NL172903C - METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME. - Google Patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME.

Info

Publication number
NL172903C
NL172903C NLAANVRAGE7011336,A NL7011336A NL172903C NL 172903 C NL172903 C NL 172903C NL 7011336 A NL7011336 A NL 7011336A NL 172903 C NL172903 C NL 172903C
Authority
NL
Netherlands
Prior art keywords
semi
subscription
coating
sheet
respect
Prior art date
Application number
NLAANVRAGE7011336,A
Other languages
Dutch (nl)
Other versions
NL172903B (en
NL7011336A (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB1319655D priority Critical patent/GB1319655A/en
Priority to BE754034D priority patent/BE754034A/en
Application filed by Gen Electric filed Critical Gen Electric
Priority to NLAANVRAGE7011336,A priority patent/NL172903C/en
Priority to DE2042463A priority patent/DE2042463C2/en
Priority claimed from DE2042463A external-priority patent/DE2042463C2/en
Publication of NL7011336A publication Critical patent/NL7011336A/xx
Publication of NL172903B publication Critical patent/NL172903B/en
Application granted granted Critical
Publication of NL172903C publication Critical patent/NL172903C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
NLAANVRAGE7011336,A 1969-07-01 1970-07-31 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME. NL172903C (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1319655D GB1319655A (en) 1970-07-21 1970-07-21 Semiconductor lead attachment apparatus
BE754034D BE754034A (en) 1969-07-01 1970-07-28 DEVICE FOR ATTACHING CONDUCTORS TO SEMICONDUCTORS
NLAANVRAGE7011336,A NL172903C (en) 1969-07-01 1970-07-31 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME.
DE2042463A DE2042463C2 (en) 1970-07-31 1970-08-27 External leads joining appliance - for contact areas of semiconductor wafers with aligning, joining, feeding and shifting devices

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83821369A 1969-07-01 1969-07-01
GB3535870 1970-07-21
NLAANVRAGE7011336,A NL172903C (en) 1969-07-01 1970-07-31 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME.
DE2042463A DE2042463C2 (en) 1970-07-31 1970-08-27 External leads joining appliance - for contact areas of semiconductor wafers with aligning, joining, feeding and shifting devices

Publications (3)

Publication Number Publication Date
NL7011336A NL7011336A (en) 1972-02-02
NL172903B NL172903B (en) 1983-06-01
NL172903C true NL172903C (en) 1983-11-01

Family

ID=27431121

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7011336,A NL172903C (en) 1969-07-01 1970-07-31 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEMI-CONDUCTIVE SEMI-CONDUCTOR MATERIALS OBTAINED BY SUBSCRIPTION OF A SHEET IN RESPECT OF SINGLE OF THE COATING AT THE SAME TIME.

Country Status (2)

Country Link
BE (1) BE754034A (en)
NL (1) NL172903C (en)

Also Published As

Publication number Publication date
NL172903B (en) 1983-06-01
BE754034A (en) 1971-01-28
NL7011336A (en) 1972-02-02

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Legal Events

Date Code Title Description
V4 Lapsed because of reaching the maximum lifetime of a patent