NL157146B - Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen. - Google Patents

Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen.

Info

Publication number
NL157146B
NL157146B NL6814369.A NL6814369A NL157146B NL 157146 B NL157146 B NL 157146B NL 6814369 A NL6814369 A NL 6814369A NL 157146 B NL157146 B NL 157146B
Authority
NL
Netherlands
Prior art keywords
support
transferring
maintaining
mutual orientation
semiconductive elements
Prior art date
Application number
NL6814369.A
Other languages
English (en)
Dutch (nl)
Other versions
NL6814369A (enExample
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL6814369A publication Critical patent/NL6814369A/xx
Publication of NL157146B publication Critical patent/NL157146B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/086—Work-clamping means other than mechanically-actuated using a solidifying liquid, e.g. with freezing, setting or hardening means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
NL6814369.A 1967-10-09 1968-10-08 Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen. NL157146B (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67390067A 1967-10-09 1967-10-09
US72985968A 1968-04-10 1968-04-10

Publications (2)

Publication Number Publication Date
NL6814369A NL6814369A (enExample) 1969-04-11
NL157146B true NL157146B (nl) 1978-06-15

Family

ID=27101044

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6814369.A NL157146B (nl) 1967-10-09 1968-10-08 Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen.

Country Status (7)

Country Link
US (1) US3632074A (enExample)
BE (1) BE721992A (enExample)
DE (1) DE1801878C3 (enExample)
FR (1) FR1594637A (enExample)
GB (1) GB1251501A (enExample)
NL (1) NL157146B (enExample)
SE (1) SE354383B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915784A (en) * 1972-04-26 1975-10-28 Ibm Method of semiconductor chip separation
IT981199B (it) * 1972-04-26 1974-10-10 Ibm Apparecchiatura e procedimento per la separazione di chip semi conduttori
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus
US3847697A (en) * 1972-10-30 1974-11-12 Western Electric Co Article transfer method
US3989566A (en) * 1972-11-20 1976-11-02 Western Electric Company, Inc. Method of holding articles
EP0126302B1 (en) * 1983-04-22 1988-01-13 Fmc Corporation Centering arrangement for redecking of upper crane
DE10029035C1 (de) * 2000-06-13 2002-02-28 Infineon Technologies Ag Verfahren zur Bearbeitung eines Wafers
US7982290B2 (en) 2006-01-12 2011-07-19 Palo Alto Research Center, Inc. Contact spring application to semiconductor devices
CN102064257A (zh) * 2010-09-29 2011-05-18 苏州纳晶光电有限公司 一种蓝宝石图形衬底及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2468995A (en) * 1944-08-31 1949-05-03 Morrison Harry Height gauge
US2667436A (en) * 1950-09-21 1954-01-26 Carborundum Co Pressure sensitive adhesive coated sheet material
US2753799A (en) * 1952-12-19 1956-07-10 Vandercook & Sons Inc Printing device
US2882183A (en) * 1956-05-21 1959-04-14 Minnesota Mining & Mfg Silicone pressure-sensitive adhesive tape
US3098272A (en) * 1961-11-17 1963-07-23 Bruce J Frye Self adhesive clip and method
US3322871A (en) * 1963-08-29 1967-05-30 Rca Corp Method of forming a pattern
US3229949A (en) * 1964-07-16 1966-01-18 Peter G Chaconas Dewar flask holder
US3295810A (en) * 1965-03-03 1967-01-03 Irving L Kintish Article attaching means
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers

Also Published As

Publication number Publication date
DE1801878C3 (de) 1973-10-18
GB1251501A (enExample) 1971-10-27
US3632074A (en) 1972-01-04
DE1801878B2 (de) 1973-03-29
SE354383B (enExample) 1973-03-05
NL6814369A (enExample) 1969-04-11
BE721992A (enExample) 1969-03-14
FR1594637A (enExample) 1970-06-08
DE1801878A1 (de) 1969-07-10

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