NL157146B - Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen. - Google Patents
Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen.Info
- Publication number
- NL157146B NL157146B NL6814369.A NL6814369A NL157146B NL 157146 B NL157146 B NL 157146B NL 6814369 A NL6814369 A NL 6814369A NL 157146 B NL157146 B NL 157146B
- Authority
- NL
- Netherlands
- Prior art keywords
- support
- transferring
- maintaining
- mutual orientation
- semiconductive elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/086—Work-clamping means other than mechanically-actuated using a solidifying liquid, e.g. with freezing, setting or hardening means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manipulator (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67390067A | 1967-10-09 | 1967-10-09 | |
US72985968A | 1968-04-10 | 1968-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6814369A NL6814369A (de) | 1969-04-11 |
NL157146B true NL157146B (nl) | 1978-06-15 |
Family
ID=27101044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6814369.A NL157146B (nl) | 1967-10-09 | 1968-10-08 | Werkwijze om een aantal halfgeleiderelementen, met behoud van hun onderlinge orientatie, van een drager op een andere drager over te brengen. |
Country Status (7)
Country | Link |
---|---|
US (1) | US3632074A (de) |
BE (1) | BE721992A (de) |
DE (1) | DE1801878C3 (de) |
FR (1) | FR1594637A (de) |
GB (1) | GB1251501A (de) |
NL (1) | NL157146B (de) |
SE (1) | SE354383B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3762426A (en) * | 1972-04-26 | 1973-10-02 | Ibm | Semiconductor chip separation apparatus |
US3915784A (en) * | 1972-04-26 | 1975-10-28 | Ibm | Method of semiconductor chip separation |
IT981199B (it) * | 1972-04-26 | 1974-10-10 | Ibm | Apparecchiatura e procedimento per la separazione di chip semi conduttori |
US3847697A (en) * | 1972-10-30 | 1974-11-12 | Western Electric Co | Article transfer method |
US3989566A (en) * | 1972-11-20 | 1976-11-02 | Western Electric Company, Inc. | Method of holding articles |
DE3468663D1 (en) * | 1983-04-22 | 1988-02-18 | Fmc Corp | Centering arrangement for redecking of upper crane |
DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
US7982290B2 (en) * | 2006-01-12 | 2011-07-19 | Palo Alto Research Center, Inc. | Contact spring application to semiconductor devices |
CN102064257A (zh) * | 2010-09-29 | 2011-05-18 | 苏州纳晶光电有限公司 | 一种蓝宝石图形衬底及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2468995A (en) * | 1944-08-31 | 1949-05-03 | Morrison Harry | Height gauge |
US2667436A (en) * | 1950-09-21 | 1954-01-26 | Carborundum Co | Pressure sensitive adhesive coated sheet material |
US2753799A (en) * | 1952-12-19 | 1956-07-10 | Vandercook & Sons Inc | Printing device |
US2882183A (en) * | 1956-05-21 | 1959-04-14 | Minnesota Mining & Mfg | Silicone pressure-sensitive adhesive tape |
US3098272A (en) * | 1961-11-17 | 1963-07-23 | Bruce J Frye | Self adhesive clip and method |
US3322871A (en) * | 1963-08-29 | 1967-05-30 | Rca Corp | Method of forming a pattern |
US3229949A (en) * | 1964-07-16 | 1966-01-18 | Peter G Chaconas | Dewar flask holder |
US3295810A (en) * | 1965-03-03 | 1967-01-03 | Irving L Kintish | Article attaching means |
US3489608A (en) * | 1965-10-26 | 1970-01-13 | Kulicke & Soffa Ind Inc | Method and apparatus for treating semiconductor wafers |
-
1968
- 1968-04-10 US US729859*A patent/US3632074A/en not_active Expired - Lifetime
- 1968-10-01 SE SE13244/68A patent/SE354383B/xx unknown
- 1968-10-07 FR FR169003A patent/FR1594637A/fr not_active Expired
- 1968-10-08 NL NL6814369.A patent/NL157146B/xx unknown
- 1968-10-08 BE BE721992A patent/BE721992A/xx unknown
- 1968-10-08 DE DE1801878A patent/DE1801878C3/de not_active Expired
- 1968-10-09 GB GB4787168A patent/GB1251501A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1594637A (de) | 1970-06-08 |
DE1801878B2 (de) | 1973-03-29 |
DE1801878C3 (de) | 1973-10-18 |
GB1251501A (de) | 1971-10-27 |
US3632074A (en) | 1972-01-04 |
SE354383B (de) | 1973-03-05 |
BE721992A (de) | 1969-03-14 |
NL6814369A (de) | 1969-04-11 |
DE1801878A1 (de) | 1969-07-10 |
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