NL141053B - Halfgeleiderbouwelement met een halfgeleiderelement dat in een huis is aangebracht, dat is voorzien van uit isolerend materiaal vervaardigde ringen. - Google Patents

Halfgeleiderbouwelement met een halfgeleiderelement dat in een huis is aangebracht, dat is voorzien van uit isolerend materiaal vervaardigde ringen.

Info

Publication number
NL141053B
NL141053B NL63302170A NL302170A NL141053B NL 141053 B NL141053 B NL 141053B NL 63302170 A NL63302170 A NL 63302170A NL 302170 A NL302170 A NL 302170A NL 141053 B NL141053 B NL 141053B
Authority
NL
Netherlands
Prior art keywords
semiconductor
house
insulating material
installed inside
rings made
Prior art date
Application number
NL63302170A
Other languages
English (en)
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL141053B publication Critical patent/NL141053B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
NL63302170A 1963-06-15 1963-12-18 Halfgeleiderbouwelement met een halfgeleiderelement dat in een huis is aangebracht, dat is voorzien van uit isolerend materiaal vervaardigde ringen. NL141053B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0085696 1963-06-15

Publications (1)

Publication Number Publication Date
NL141053B true NL141053B (nl) 1974-01-15

Family

ID=7512520

Family Applications (2)

Application Number Title Priority Date Filing Date
NL302170D NL302170A (ja) 1963-06-15
NL63302170A NL141053B (nl) 1963-06-15 1963-12-18 Halfgeleiderbouwelement met een halfgeleiderelement dat in een huis is aangebracht, dat is voorzien van uit isolerend materiaal vervaardigde ringen.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL302170D NL302170A (ja) 1963-06-15

Country Status (5)

Country Link
US (1) US3310716A (ja)
BE (1) BE649191A (ja)
CH (1) CH416842A (ja)
GB (1) GB1065897A (ja)
NL (2) NL141053B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1539645A1 (de) * 1965-05-28 1969-06-26 Asea Ab Halbleiteranordnung
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3452254A (en) * 1967-03-20 1969-06-24 Int Rectifier Corp Pressure assembled semiconductor device using massive flexibly mounted terminals
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
US3577042A (en) * 1967-06-19 1971-05-04 Int Rectifier Corp Gate connection for controlled rectifiers
US5075765A (en) * 1990-09-21 1991-12-24 Unisys Low stress multichip module
FR3027380A1 (fr) * 2014-10-17 2016-04-22 Commissariat Energie Atomique Dispositif de refroidissement par liquide caloporteur pour composants electroniques

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728881A (en) * 1950-03-31 1955-12-27 Gen Electric Asymmetrically conductive devices
NL101253C (ja) * 1955-09-12
US2882116A (en) * 1956-09-20 1959-04-14 Eitel Mccullough Inc Method of making electron tubes
NL288523A (ja) * 1961-08-04 1900-01-01
NL253550A (ja) * 1959-07-22
BE624012A (ja) * 1961-10-27
DE1248808B (ja) * 1962-03-23 1900-01-01

Also Published As

Publication number Publication date
BE649191A (ja) 1964-12-14
US3310716A (en) 1967-03-21
GB1065897A (en) 1967-04-19
NL302170A (ja)
CH416842A (de) 1966-07-15

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