NL139095B - PROCEDURE FOR SELLING WITHOUT POWER SUPPLY. - Google Patents

PROCEDURE FOR SELLING WITHOUT POWER SUPPLY.

Info

Publication number
NL139095B
NL139095B NL696900088A NL6900088A NL139095B NL 139095 B NL139095 B NL 139095B NL 696900088 A NL696900088 A NL 696900088A NL 6900088 A NL6900088 A NL 6900088A NL 139095 B NL139095 B NL 139095B
Authority
NL
Netherlands
Prior art keywords
selling
procedure
power supply
supply
power
Prior art date
Application number
NL696900088A
Other languages
Dutch (nl)
Other versions
NL6900088A (en
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Publication of NL6900088A publication Critical patent/NL6900088A/xx
Publication of NL139095B publication Critical patent/NL139095B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
NL696900088A 1968-01-05 1969-01-03 PROCEDURE FOR SELLING WITHOUT POWER SUPPLY. NL139095B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69586068A 1968-01-05 1968-01-05

Publications (2)

Publication Number Publication Date
NL6900088A NL6900088A (en) 1969-07-08
NL139095B true NL139095B (en) 1973-06-15

Family

ID=24794740

Family Applications (1)

Application Number Title Priority Date Filing Date
NL696900088A NL139095B (en) 1968-01-05 1969-01-03 PROCEDURE FOR SELLING WITHOUT POWER SUPPLY.

Country Status (7)

Country Link
US (1) US3475186A (en)
BE (1) BE726182A (en)
DE (1) DE1900442B2 (en)
FR (1) FR1599501A (en)
GB (1) GB1195330A (en)
NL (1) NL139095B (en)
SE (1) SE345144B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3615733A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
DE3473890D1 (en) * 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
US20090206526A1 (en) 2008-02-18 2009-08-20 Huntsman Petrochemical Corporation Sintering aids

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
GB1089317A (en) * 1965-06-19 1967-11-01 Asahi Dow Ltd An electroless copper plating bath

Also Published As

Publication number Publication date
GB1195330A (en) 1970-06-17
FR1599501A (en) 1970-07-15
NL6900088A (en) 1969-07-08
US3475186A (en) 1969-10-28
BE726182A (en) 1969-06-27
SE345144B (en) 1972-05-15
DE1900442A1 (en) 1969-11-20
DE1900442B2 (en) 1971-09-09

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