NL121501C - - Google Patents

Info

Publication number
NL121501C
NL121501C NL121501DA NL121501C NL 121501 C NL121501 C NL 121501C NL 121501D A NL121501D A NL 121501DA NL 121501 C NL121501 C NL 121501C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL121501C publication Critical patent/NL121501C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
NL121501D 1959-12-16 NL121501C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6506159 1959-12-16

Publications (1)

Publication Number Publication Date
NL121501C true NL121501C (zh)

Family

ID=13276045

Family Applications (2)

Application Number Title Priority Date Filing Date
NL121501D NL121501C (zh) 1959-12-16
NL258551D NL258551A (zh) 1959-12-16

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL258551D NL258551A (zh) 1959-12-16

Country Status (4)

Country Link
US (1) US3114866A (zh)
DE (1) DE1200951B (zh)
GB (1) GB910979A (zh)
NL (2) NL258551A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495353A (en) * 1950-01-24 Mounting arrangement for circuit
NL94441C (zh) * 1951-09-15
NL87784C (zh) * 1953-10-23 1958-04-15
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
NL101253C (zh) * 1955-09-12
US2894183A (en) * 1956-05-01 1959-07-07 Sprague Electric Co Transistor sub-assembly
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
US3001113A (en) * 1959-10-06 1961-09-19 Rca Corp Semiconductor device assemblies

Also Published As

Publication number Publication date
NL258551A (zh)
US3114866A (en) 1963-12-17
DE1200951B (de) 1965-09-16
GB910979A (en) 1962-11-21

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