NL121501C - - Google Patents

Info

Publication number
NL121501C
NL121501C NL121501DA NL121501C NL 121501 C NL121501 C NL 121501C NL 121501D A NL121501D A NL 121501DA NL 121501 C NL121501 C NL 121501C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL121501C publication Critical patent/NL121501C/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42Fillings
    • H10W76/47Solid or gel fillings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
NL121501D 1959-12-16 NL121501C (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6506159 1959-12-16

Publications (1)

Publication Number Publication Date
NL121501C true NL121501C (cg-RX-API-DMAC7.html)

Family

ID=13276045

Family Applications (2)

Application Number Title Priority Date Filing Date
NL258551D NL258551A (cg-RX-API-DMAC7.html) 1959-12-16
NL121501D NL121501C (cg-RX-API-DMAC7.html) 1959-12-16

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL258551D NL258551A (cg-RX-API-DMAC7.html) 1959-12-16

Country Status (4)

Country Link
US (1) US3114866A (cg-RX-API-DMAC7.html)
DE (1) DE1200951B (cg-RX-API-DMAC7.html)
GB (1) GB910979A (cg-RX-API-DMAC7.html)
NL (2) NL121501C (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495353A (en) * 1950-01-24 Mounting arrangement for circuit
NL94441C (cg-RX-API-DMAC7.html) * 1951-09-15
NL87784C (cg-RX-API-DMAC7.html) * 1953-10-23 1958-04-15
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
DE1068816B (cg-RX-API-DMAC7.html) * 1955-09-12 1959-11-12
US2894183A (en) * 1956-05-01 1959-07-07 Sprague Electric Co Transistor sub-assembly
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
US3001113A (en) * 1959-10-06 1961-09-19 Rca Corp Semiconductor device assemblies

Also Published As

Publication number Publication date
US3114866A (en) 1963-12-17
NL258551A (cg-RX-API-DMAC7.html)
DE1200951B (de) 1965-09-16
GB910979A (en) 1962-11-21

Similar Documents

Publication Publication Date Title
IT641679A (cg-RX-API-DMAC7.html)
AT212261B (cg-RX-API-DMAC7.html)
JPS374423B1 (cg-RX-API-DMAC7.html)
AT213304B (cg-RX-API-DMAC7.html)
BE586366A (cg-RX-API-DMAC7.html)
BE586481A (cg-RX-API-DMAC7.html)
BE575242A (cg-RX-API-DMAC7.html)
NL252634A (cg-RX-API-DMAC7.html)
NL252511A (cg-RX-API-DMAC7.html)
NL251024A (cg-RX-API-DMAC7.html)
NL122819C (cg-RX-API-DMAC7.html)
NL297579A (cg-RX-API-DMAC7.html)
NL258551A (cg-RX-API-DMAC7.html)
BE592616A (cg-RX-API-DMAC7.html)
BE586583A (cg-RX-API-DMAC7.html)
BE586572A (cg-RX-API-DMAC7.html)
BE574478A (cg-RX-API-DMAC7.html)
BE586571A (cg-RX-API-DMAC7.html)
BE586328A (cg-RX-API-DMAC7.html)
BE586479A (cg-RX-API-DMAC7.html)
BE586460A (cg-RX-API-DMAC7.html)
BE586456A (cg-RX-API-DMAC7.html)
BE586431A (cg-RX-API-DMAC7.html)
BE585897A (cg-RX-API-DMAC7.html)
BE586349A (cg-RX-API-DMAC7.html)