NL103467C - - Google Patents

Info

Publication number
NL103467C
NL103467C NL103467DA NL103467C NL 103467 C NL103467 C NL 103467C NL 103467D A NL103467D A NL 103467DA NL 103467 C NL103467 C NL 103467C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL103467C publication Critical patent/NL103467C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
NL103467D 1959-05-12 NL103467C (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL239126 1959-05-12

Publications (1)

Publication Number Publication Date
NL103467C true NL103467C (en:Method)

Family

ID=19751725

Family Applications (2)

Application Number Title Priority Date Filing Date
NL103467D NL103467C (en:Method) 1959-05-12
NL239126D NL239126A (en:Method) 1959-05-12

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL239126D NL239126A (en:Method) 1959-05-12

Country Status (5)

Country Link
US (1) US3120693A (en:Method)
CH (1) CH382856A (en:Method)
DE (1) DE1149459B (en:Method)
GB (1) GB948450A (en:Method)
NL (2) NL239126A (en:Method)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619635A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Manufacturing apparatus
DK2079477T3 (en) 2006-10-10 2017-08-28 Wisconsin Alumni Res Found Intramammary teat sealant formulation and method of using same to reduce or eliminate visual defects in matured cheeses
AU2010234514B2 (en) 2009-04-08 2014-03-27 Wisconsin Alumni Research Foundation Intra-mammary teat sealant formulation and method of using same to reduce or eliminate visual defects in aged cheeses
CN113955413B (zh) * 2021-11-11 2022-09-02 安徽耐科装备科技股份有限公司 塑封料饼自动排布装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2595058A (en) * 1949-09-30 1952-04-29 Rca Corp Loading stop for electron tube making machines
US2693555A (en) * 1951-04-04 1954-11-02 Hughes Aircraft Co Method and apparatus for welding germanium diodes
BE527478A (en:Method) * 1953-05-13
DE1020121B (de) * 1955-02-19 1957-11-28 Kieler Howaldtswerke Ag Verfahren zur Herstellung von Halbleitergeraeten kleinster Abmessungen und Vorrichtung zur Ausuebung des Verfahrens
US2961800A (en) * 1955-06-28 1960-11-29 Sylvania Electric Prod Apparatus for forming glass envelopes and mounting operative elements therein
FR1167971A (fr) * 1956-10-19 1958-12-03 Thomson Houston Comp Francaise Nouveau procédé de fabrication des diodes à semi-conducteurs sous enveloppe scellée

Also Published As

Publication number Publication date
CH382856A (de) 1964-10-15
GB948450A (en) 1964-02-05
DE1149459B (de) 1963-05-30
US3120693A (en) 1964-02-11
NL239126A (en:Method)

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