MY196268A - A Spring Loaded Clamp - Google Patents

A Spring Loaded Clamp

Info

Publication number
MY196268A
MY196268A MYPI2018703033A MYPI2018703033A MY196268A MY 196268 A MY196268 A MY 196268A MY PI2018703033 A MYPI2018703033 A MY PI2018703033A MY PI2018703033 A MYPI2018703033 A MY PI2018703033A MY 196268 A MY196268 A MY 196268A
Authority
MY
Malaysia
Prior art keywords
spring
clamp
spring loaded
loaded clamp
jaws
Prior art date
Application number
MYPI2018703033A
Inventor
Chee Kin Leong
Original Assignee
Intotest Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intotest Sdn Bhd filed Critical Intotest Sdn Bhd
Priority to MYPI2018703033A priority Critical patent/MY196268A/en
Priority to PCT/MY2019/050044 priority patent/WO2020046107A1/en
Priority to CN201990001017.5U priority patent/CN217345103U/en
Priority to SG11202102070WA priority patent/SG11202102070WA/en
Publication of MY196268A publication Critical patent/MY196268A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/04—Clamps with pivoted jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/02—Clamps with sliding jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/06—Arrangements for positively actuating jaws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B2/00—Friction-grip releasable fastenings
    • F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
    • F16B2/06—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
    • F16B2/10—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action using pivoting jaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Clamps And Clips (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

A spring loaded clamp (100) suitable for handling integrated circuit chips, which clamp comprises a coil spring (120) which interacts with a pair of clamp jaws (110) and wherein means (130) are provided to mitigate buckling of the spring (120) so that the coils are compressed and relaxed evenly along the length of the spring (120) during relative movement between the clamp jaws (110). (Fig. 1)
MYPI2018703033A 2018-08-28 2018-08-28 A Spring Loaded Clamp MY196268A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI2018703033A MY196268A (en) 2018-08-28 2018-08-28 A Spring Loaded Clamp
PCT/MY2019/050044 WO2020046107A1 (en) 2018-08-28 2019-08-16 A spring loaded clamp
CN201990001017.5U CN217345103U (en) 2018-08-28 2019-08-16 Spring loading clamp, rotary table using same and integrated circuit manipulator
SG11202102070WA SG11202102070WA (en) 2018-08-28 2019-08-16 A spring loaded clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2018703033A MY196268A (en) 2018-08-28 2018-08-28 A Spring Loaded Clamp

Publications (1)

Publication Number Publication Date
MY196268A true MY196268A (en) 2023-03-24

Family

ID=69642798

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703033A MY196268A (en) 2018-08-28 2018-08-28 A Spring Loaded Clamp

Country Status (4)

Country Link
CN (1) CN217345103U (en)
MY (1) MY196268A (en)
SG (1) SG11202102070WA (en)
WO (1) WO2020046107A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028390B2 (en) * 2008-06-25 2011-10-04 Endicott Interconnect Technologies, Inc. Spring actuated clamping mechanism
US9352451B1 (en) * 2013-05-02 2016-05-31 Chick Workholding Solutions, Inc. Workholding apparatus
CN105357947A (en) * 2015-11-30 2016-02-24 成都市天目电子设备有限公司 Novel device capable of automatically and stably clamping pcb (printed circuit board)
GB201521345D0 (en) * 2015-12-03 2016-01-20 Protosonic Ltd Apparatus for holding a printed circuit board
DE102016104798A1 (en) * 2016-03-15 2017-09-21 ABUS August Bremicker Söhne KG bracket

Also Published As

Publication number Publication date
SG11202102070WA (en) 2021-03-30
CN217345103U (en) 2022-09-02
WO2020046107A1 (en) 2020-03-05

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