MY184556A - Device for testing electronic components - Google Patents

Device for testing electronic components

Info

Publication number
MY184556A
MY184556A MYPI2014000567A MYPI2014000567A MY184556A MY 184556 A MY184556 A MY 184556A MY PI2014000567 A MYPI2014000567 A MY PI2014000567A MY PI2014000567 A MYPI2014000567 A MY PI2014000567A MY 184556 A MY184556 A MY 184556A
Authority
MY
Malaysia
Prior art keywords
test
electronic components
test base
testing electronic
contact
Prior art date
Application number
MYPI2014000567A
Inventor
Gerald Staniszewski
Manuel Petermann
Gerhard Gschwendtberger
Original Assignee
Multitest Elektronische Systeme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51188864&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY184556(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Multitest Elektronische Systeme Gmbh filed Critical Multitest Elektronische Systeme Gmbh
Publication of MY184556A publication Critical patent/MY184556A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester

Abstract

The invention proceeds from a device for testing electronic components, comprising at least one test base (13) for contacting the electronic components (17) and comprising a test head, which is coupled electrically to the test base (13). In accordance with the invention, in order to forward signals between the? test base (13) and test head, an adapter board (1) is provided, which, on its side facing the test base (13), has contact areas (2) which are adapted to the position of contacts of the test base (13), and, on its side facing away from the test base (13), is provided with contact sockets (4) which are adapted to the position of contact pins (10) of the test head or an intermediate board (6), the contact areas (2) each being electrically conductively connected to corresponding contact sockets (4). ( Figure 2 )
MYPI2014000567A 2013-03-01 2014-02-27 Device for testing electronic components MY184556A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013203536.5A DE102013203536B4 (en) 2013-03-01 2013-03-01 Device for testing electronic components

Publications (1)

Publication Number Publication Date
MY184556A true MY184556A (en) 2021-04-02

Family

ID=51188864

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014000567A MY184556A (en) 2013-03-01 2014-02-27 Device for testing electronic components

Country Status (4)

Country Link
CN (1) CN103941115B (en)
DE (1) DE102013203536B4 (en)
MY (1) MY184556A (en)
SG (1) SG10201400225TA (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1069955A (en) * 1996-08-28 1998-03-10 Fujitsu Ltd Ic socket, and testing method using it, and mounting mechanism of the socket
ATE260470T1 (en) * 1997-11-05 2004-03-15 Feinmetall Gmbh TEST HEAD FOR MICROSTRUCTURES WITH INTERFACE
JPH11233216A (en) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk Ic socket for test
CN2522868Y (en) * 2001-12-19 2002-11-27 及成企业股份有限公司 Electronic element detection apparatus
US20050159050A1 (en) * 2003-06-05 2005-07-21 Hiroyuki Hama Device interface apparatus
DE112004000029T5 (en) * 2003-06-05 2005-07-28 Advantest Corp. Component connection device
TWI235836B (en) * 2004-03-05 2005-07-11 Asustek Comp Inc Testing apparatus and testing method for testing whether electronic device connecting correctly with circuit board
DE102008004800A1 (en) * 2007-02-08 2008-08-14 Feinmetall Gmbh Electrical testing device for testing electrical specimens
DE102008034918B4 (en) * 2008-07-26 2012-09-27 Feinmetall Gmbh Electrical test equipment for testing an electrical device under test and electrical test method

Also Published As

Publication number Publication date
DE102013203536B4 (en) 2016-03-31
SG10201400225TA (en) 2014-10-30
DE102013203536A1 (en) 2014-09-18
CN103941115A (en) 2014-07-23
CN103941115B (en) 2017-06-13

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