DE102013203536A1 - Device for testing electronic components - Google Patents

Abstract

The invention relates to a device for testing electronic components with at least one test socket (13) for contacting the electronic components (17) and with a test head, which is electrically coupled to the test socket (13). According to the invention, an adapter board (1) is provided for the forwarding of signals between test socket (13) and test head, which has contact surfaces (2) on its side facing the test socket (13) which are adapted to the position of contacts of the test socket (13) and whose side facing away from the test socket (13) is provided with contact bushes (4) which are adapted to the position of contact pins (10) of the test head or of an intermediate board (6), the contact surfaces (2) being connected to the respective corresponding contact bushes (4). are electrically connected.

Description

The invention relates to a device for testing electronic components according to the preamble of claim 1.

Electronic components are usually subjected to certain tests to verify their electrical or even their sonsorischen functions. There are several known for this purpose. For example, the electronic components are tested before they are separated on the substrate. After being singulated and completed, the electronic components can either be tested individually, or a support is provided on which a plurality of the electronic components are mounted.

The carrier, the substrate or the individual electronic component is then handed over to a so-called handler. The handler has a normally fixed test head to which a likewise fixed test socket is connected. The carrier, the substrate or the individual component is moved relative to the test socket and positioned exactly. A test socket can be used that simultaneously contacts and tests multiple electronic components, or each component is tested individually. If not all electronic components of a carrier or substrate are tested simultaneously, the carrier or substrate must be repositioned after each test step.

If the electronic components are handed over individually to a handler and there occasionally further processed, the individual components are inserted into a so-called leadbacker and positioned in this opposite the test socket. The leadbacker is adapted to the shape of the electronic component to be tested and supports this and possibly existing contact legs of the component when pressed against the test socket so that the electronic component is not damaged by the applied force.

Between the test head and the test socket, which takes over the direct contacting of the electronic component, both the excitation signals of the test head, as well as the response signals of the electronic component must be transmitted. For this purpose, the test socket has contact surfaces on its side facing away from the electronic component. The arrangement of these contact surfaces is closely related to the position of the contacts of the electronic component and other conditions such as the necessary distance between the contacts, spatial relationships, etc .. The fixed arrangement of the contacts of the test head can not be dealt with or only slightly.

Therefore, one or more hardware interfaces are usually used which connect the contacts of the test socket facing away from the electronic component to the contacts of the test head. There are known such hardware interfaces that contain on the one hand to the test socket adapted contact surfaces and on the opposite side adapted to the test head pins. To stabilize these pins, they must be cast in the hardware interface.

Since the pins must be positioned very accurately, the pouring of the pins is relatively expensive and expensive. Nevertheless, the risk that these pins are damaged in a conversion to another electronic component or during their storage is very large. If only a single contact pin is damaged or broken off, the entire hardware interface becomes unusable and has to be replaced, since it is not possible to change these individually with molded-in contact pins.

The invention has for its object to design a device for testing electronic components according to the preamble of claim 1 so that signals between the test socket and the test head with high transmission reliability can be replaced and the hardware interfaces used simple, inexpensive to manufacture and robust are executed.

The object is achieved according to the invention by a device for testing of electronic components with the features of claim 1. According to the invention, an adapter board is provided for forwarding signals between test socket and test head having contact surfaces on its side facing the test socket side, which contact the position are adapted to contacts of the test socket and the test socket facing away from the side is provided with contact sockets, which are adapted to the position of the contact pins of the test head or an intermediate board and wherein the contact surfaces with the respective corresponding contact sockets are electrically connected.

Operating costs can be significantly reduced by using contact sockets instead of contact pins. Since contact sockets at least do not protrude far beyond the surface of the adapter board, the risk of them being damaged is considerably less than with contact pins.

Further details and advantages of the invention will become apparent from the dependent claims.

The positions of the contact surfaces on one side of the adapter board are advantageously arranged independently of the positions of the corresponding contact sockets on the opposite side of the adapter board. Independent in this context means that the positions of corresponding contact surfaces and contact sockets can be arranged directly above one another or offset from one another. As a result, the positions of the contact surfaces can be easily adapted to the positions of the contacts of the test socket and the positions of the contact sockets to the positions of the contact pins of the test head or an intermediate board.

As already mentioned above, the positions of the contact surfaces are arranged independently of the positions of the contact sockets, so that the contact surfaces or the contact sockets can be adapted to the test socket or to the test head or an intermediate board. The adapter board is therefore advantageously constructed as a board. The electrically conductive connection between the contact surfaces and the contact sockets is thus achieved over a long proven and proven technology. Due to the structure of the adapter board as a board and a very inexpensive production is possible.

Particularly advantageously, the contact sockets are inserted in blind holes of the adapter board. As a result, a plated through hole is avoided and on the test socket facing side of the adapter board only the contact surfaces for the pins of the test socket are available. The adapter board can be built as a two-layer board, which can be easily adapted to all conditions.

The contact sockets can be connected to the adapter board via an electrically conductive adhesive, a so-called ECA adhesive (Electrically Conductive Adhesive). But to make the adapter board easy to repair, the contact sockets are advantageously soldered to the adapter board.

Contact sockets are usually designed with an open cross section, so do not form a closed ring. As a result, a good adaptation to the surface of the contact pin to be contacted and thus a good electrical contact with low contact resistance between the contact pin and contact socket is possible. The contact bushes therefore have an annular flange, wherein only the flange is soldered to the surface of the adapter board. In order to give the contact socket the necessary stability, the flange is formed as a closed ring, wherein the inner diameter is dimensioned slightly larger than the outer diameter of the contact pin.

If the test head is provided with sockets in order to provide the necessary conductive connection to the test socket, a connection board according to the invention is provided between the adapter board and the test head as an intermediate board having interchangeable contact pins which are facing both from the side facing the adapter board and the test head Project side out of the surface.

The positions of the pins on one side need not be different from the positions of the pins on the other side, since the adjustment of the positions to the test socket or to the test head has already been taken into account in the design of the adapter board. Consequently, continuous contact pins can be used, which can be anchored very stably in the connection board.

The interchangeability of the pins, the connection board can be repaired in case of damage to one or more pins and does not need to be replaced by a new terminal board. As a result, the necessary in the transmission chain between test socket and test head, but very susceptible to damage pins are moved to a separate board in which they can be easily replaced.

In order to exchange the contact pins protruding on both sides over the surface in a simple manner, the connection board has two parts connected to one another, which can be separated and reconnected to one another for exchanging the contact pins. It is very easy to replace damaged pins. For this purpose, only the connection between the two parts, advantageously a screw connection, must be solved, so that the two parts can be separated from each other. Then the loose in the one of the two parts stuck damaged pins are replaced and the two parts are joined together again.

Electronic components often need to be tested at very low temperatures, while the test head with the test electronics is exposed to the normally tempered ambient air. It can therefore happen that condenses moisture from the ambient air at one point of the transmission chain between electronic component and test head. This moisture can form conductive connections between the very close individual contacts and thus lead to incorrect measurements and even damage to the test electronics of the test head. To avoid the condensation of moisture, therefore, the cold zone is strictly separated from the normal tempered zone. For this purpose, the connection board has a temperature-insulating layer.

Heat transfer between the cold and warm sides of the connection board can, however, take place via the continuous contact pins projecting over the surface on both sides. As a result, condensation can form on the cold pins on the warm side of the recording board. In order to avoid this formation of condensation, the connection board can be flushed with air on its side facing the test head.

Further details and advantages of the invention will become apparent from the description of an embodiment which is explained in detail with reference to the drawing.

It shows:

1 an inventive adapter board in perspective view,

2 a section through the adapter board 1 .

3 a trained as a connection board intermediate board in perspective view,

4 a section through the connection board in 3 .

5 a section through a contact unit holder with adapter board and connection board and

6 a perspective sectional view of the assembly 5 ,

The inventive in 1 shown adapter board 1 is designed for testing an approximately square electronic component having contacts on all four sides. Accordingly, a to be used for the examination of the component test socket is constructed. The adapter board 1 Therefore, has on its top a divided into four groups variety of very small contact surfaces 2 on, with the contact surfaces 2 are isolated from each other and each contact surface of a Prüffeder of in 1 Assigned not shown test socket.

The adapter board 1 is constructed as a board, so that the contact surfaces 2 practically in any way electrically conductive can be further connected. At the in 3 illustrated connection board 6 the arrangement of the contacts is apparent, as dictated by the test head. In the adapter board 1 are therefore at the bottom blind holes 3 available (see 2 ), which correspond to this arrangement. In these blind holes 3 are contact sockets 4 plugged in. The contact sockets 4 have an annular flange 5 on, whose outer diameter is greater than the inner diameter of the blind holes 3 is dimensioned. The ring flange 5 the contact sockets 4 is soldered to the board. In this way, a secure contact between the board and contact socket 4 , ensures a durable attachment and high stability.

The one in the blind hole 3 plugging part of the contact sockets 4 On the other hand, it is open and resilient and does not lie completely against the inner wall of the blind hole 3 at. This allows an inserted contact pin the contact socket 4 inside the blind hole 3 expand and so it can be a secure contact between the inserted pin and the contact socket 4 produce.

The connection of each contact surface 2 on the top of the adapterboard 1 each with a contact socket 4 at the bottom of the adapter board takes place in the production of the board in the usual way. There may thus be printed circuit traces or an etched conductive layer on the top or bottom of the adapter board. The adapter board 1 but can also be formed in two layers with the corresponding interconnects between the two layers.

The adapter board 1 is very insensitive, since no pins protrude from its two opposite surfaces. Damage to the adapter board 1 is therefore very unlikely. It is only conceivable that during the conversion of the test device - for the testing of another electronic component - when pulling out contact pins from the contact sockets 4 the solder joint between the ring flange 5 and the adapter board 1 solves. The repair of such damage is readily possible without the same adapter board 1 would have to be replaced.

Since a test head used for testing the electronic components usually also has contact sockets, this is in 3 shown connection board 6 intended. The connection board 6 has a lower part 7 and a top 8th on. Both parts are over the screws 9 connected with each other. The connection board 6 carries contact pins 10 , wherein the contact pin tops 11 over the surface of the top 8th and the contact pin bases 12 over the surface of the base 7 protrude. The diameter of the contact pin tops 11 is the diameter of the contact sockets 4 in the adapter board 1 and the diameter of the pin bases 12 adapted to the diameter of the contact sockets of the test head, not shown here.

Even clearer is the structure of the connection board 6 out 4 to recognize. Here it becomes clear that the top part 8th on the surface, with it on the lower part 7 rests with Blind holes is provided. The bottoms of these blind holes each have a central bore whose diameter corresponds to the diameter of the contact pin tops. The contact pins 10 point between the contact pin shell 11 and the contact pin lower part 12 a thickened portion, the outer diameter of the inner diameter of the blind bore in the upper part 8th is adjusted.

The contact pins 10 are thus firmly in the connection board 6 anchored and can not be moved in the axial direction. However, they can easily be replaced if damaged. For this, the screws 9 solved and the shell 8th will be taken off. The contact pins 10 remain in the lower part 7 , but are no longer fixed in the axial direction and can be pulled upwards. After replacing the damaged contact pins, the upper part is carefully placed again and with the lower part 7 screwed. The connection board 6 is now ready for use again, without a complete exchange would have been necessary.

From the 5 and 6 is particularly evident, such as test socket 13 , Adapter board 1 and connection board 6 interact. The test socket 13 has a variety of test springs 14 on, each with its probe 16 , during the examination of an electronic component, are in conductive connection with a contact of the electronic component. The respective spring end 15 each test spring 14 puts on a contact surface 2 (please refer 1 ) of the adapter board 1 on. The test feathers 14 thus form the connection between the contacts of an electronic component to be tested and the contact surfaces 2 of the adapter board 1 ,

In 5 is schematically an electronic component to be tested 17 indicated, which in a so-called leadbacker 18 held and against the test socket 13 is pressed. In the application example shown here (see 6 ) is for each of the four sides of the electronic component to be tested 17 a separate test socket 13 intended. This arrangement results on the adapter board 1 (please refer 1 ) the four groups of contact surfaces 2 ,

When moving the leadbacker 18 towards the test socket 13 becomes the leadbacker 18 through the centering plate 22 positioned so accurately that each contact of the electronic component to be tested 17 exactly on a probe 16 a test spring 14 meets.

The test socket 13 sit with the spring ends 15 the test feathers 14 on the contact surfaces 2 of the adapter board 1 on. These are in turn conductive with the contact sockets 4 (please refer 2 ) on the underside of the adapter board 1 connected.

To finally the connection between the contacts of the electronic component to be tested 17 and the test head not shown here is below the adapter board 1 the connection board 6 arranged. The from the surface of the shell 8th protruding contact pin tops 11 each stuck in one of the contact sockets 4 at the bottom of the adapter board 1 and form a conductive connection with this. The contact pin bases 12 When connecting the test head, insert it into the test head sockets available there. About the locking pin 21 the test head is centered when connecting.

The entire test assembly with the four test sockets 13 , the adapter board 1 and the connection board 6 is in a test socket holder 23 , the so-called contact unit holder mounted. In this contact unit holder 23 can also be mounted several test assemblies, so that at the same time a variety of electronic components can be tested simultaneously. Typical examples here are contact unit holders with four or eight test modules.

In some cases, electronic components must be tested at low temperatures. For this purpose, the electronic components are usually pre-cooled in a temperature chamber. Also the centering plate 22 and the test sockets 13 may be cooled. Since the test head is usually kept at room temperature, must be prevented in the transition region between the hot and the cold area, the moisture condenses out and can lead to short circuits between the contacts. For this purpose, usually the connection board 6 made of a material that has good insulation properties. In particular, the lower part 7 can form the barrier between the cold and the warm area.

But it is also possible between the top 8th and the lower part 7 of the adapter board 6 to form a cavity. This normally air-filled cavity can form a temperature-insulating layer between a cold test zone and the surrounding area, this surrounding area usually being at room temperature.

Nevertheless, the contact pins form 10 Cold bridges, so that the contact pin bottoms 12 can cool off during the test. As a result, it is possible that atmospheric moisture is precipitated on them. To counteract this, there is a ventilation room 20 provided by which warm air can be blown, allowing the air around the contact pin bases 12 constantly exchanged and thus a cooling of the air and the condensation of moisture from the cooled air is prevented. At the same time, contact pin bases become 12 warmed up a little, so that the tendency to accumulate condensation also for this reason decreases.

The ventilation room 20 is at its bottom by a completion plate 19 limited, which is also provided with holes, but the far from the connection board 6 outstanding contact pin subdivisions 12 also gives an additional guide. In this way, the risk of damaging the pin bases, especially in the connection between the test head and contact unit holder 23 , something diminished.

The end plate 19 but mainly forms the conclusion of the ventilation room 20 , About the warm air flowing through the ventilation area 20 Both the contact pin bases are blown 12 as well as the end plate 19 kept at a temperature above the dew point. As a result, neither within the ventilation space 20 , on the contact pin bases 12 and the inside of the end plate 19 , still on the outside of the end plate 19 and the resulting pin-outs 12 Condens out water.

LIST OF REFERENCE NUMBERS

1

Adapterboard

2

contact surfaces

3

blind holes

4

Contact jacks

5

annular flange

6

connection Board

7

lower part

8th

top

9

connecting screw

10

pin

11

Pin-uppers

12

Pin-base

13

test socket

14

test spring

15

spring end

16

probe

17

Electronic component

18

lead Backer

19

End plate

20

ventilation space

21

Verschlusszapfen

22

centering

23

Test socket holder (Contact Unit Holder)

Claims (10)

Device for testing electronic components with at least one test socket ( 13 ) for contacting the electronic components ( 17 ) and with a test head electrically connected to the test socket ( 13 ), characterized in that for the transmission of signals between test socket ( 13 ) and test head an adapter board ( 1 ) provided on its test socket ( 13 ) facing side contact surfaces ( 2 ), which correspond to the position of contacts of the test socket ( 13 ) and the test socket ( 13 ) opposite side with contact sockets ( 4 ) to the position of contact pins ( 10 ) of the test head or of an intermediate board ( 6 ), the contact surfaces ( 2 ) with the respective corresponding contact sockets ( 4 ) are electrically connected. Device for testing electronic components according to claim 1, characterized in that the positions of the contact surfaces ( 2 ) on one side of the adapter board ( 1 ) independently of the positions of the corresponding contact sockets ( 4 ) on the opposite side of the adapter board ( 1 ) are arranged. Device for testing electronic components according to one of Claims 1 to 2, characterized in that the adapter board ( 1 ) is constructed as a board. Device for testing electronic components according to one of Claims 1 to 3, characterized in that the contact sockets ( 4 ) in blind holes ( 3 ) of the adapter board ( 1 ) are used. Device for testing electronic components according to one of Claims 1 to 4, characterized in that the contact sockets ( 4 ) with the adapter board ( 1 ) are soldered. Device for testing electronic components according to claim 5, characterized in that the contact sockets ( 4 ) an annular flange ( 5 ) and only the flange ( 5 ) with the surface of the adapter board ( 1 ) is soldered. Device for testing electronic components according to one of Claims 1 to 6, characterized in that between adapter board ( 1 ) and test head a connection board ( 6 ), the interchangeable contact pins ( 10 ), which consists both of the adapter board ( 1 ) and the side facing the test head protrude out of the surface. Device for testing electronic components according to claim 7, characterized in that the connection board ( 6 ) two interconnected parts ( 7 . 8th ), which is used to replace the contact pins ( 10 ) are separable from each other and connectable again. Device for testing electronic components according to one of Claims 7 to 8, characterized in that the connection board ( 6 ) a temperature insulating layer ( 7 ) having. Device for testing electronic components according to one of Claims 7 to 9, characterized in that the connection board ( 6 ) is flushable with air at its side facing the test head.

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