MY180648A - Binder resin for inorganic particle-dispersed paste and inorganic particle-dispersed paste - Google Patents
Binder resin for inorganic particle-dispersed paste and inorganic particle-dispersed pasteInfo
- Publication number
- MY180648A MY180648A MYPI2017701144A MYPI2017701144A MY180648A MY 180648 A MY180648 A MY 180648A MY PI2017701144 A MYPI2017701144 A MY PI2017701144A MY PI2017701144 A MYPI2017701144 A MY PI2017701144A MY 180648 A MY180648 A MY 180648A
- Authority
- MY
- Malaysia
- Prior art keywords
- paste
- inorganic particle
- dispersed paste
- binder resin
- resin
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 239000011230 binding agent Substances 0.000 title abstract 2
- 239000002245 particle Substances 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 abstract 2
- 229920002678 cellulose Chemical class 0.000 abstract 2
- 239000001913 cellulose Chemical class 0.000 abstract 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 abstract 2
- 229920002554 vinyl polymer Polymers 0.000 abstract 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 abstract 1
- 229910002113 barium titanate Inorganic materials 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- 238000004898 kneading Methods 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J101/00—Adhesives based on cellulose, modified cellulose, or cellulose derivatives
- C09J101/08—Cellulose derivatives
- C09J101/26—Cellulose ethers
- C09J101/28—Alkyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J101/00—Adhesives based on cellulose, modified cellulose, or cellulose derivatives
- C09J101/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F2215/00—Auxiliary or complementary information in relation with mixing
- B01F2215/04—Technical information in relation with mixing
- B01F2215/0413—Numerical information
- B01F2215/0486—Material property information
- B01F2215/0495—Numerical values of viscosity of substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Capacitors (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
A binder resin for an inorganic particle-dispersed paste that excels in both printability and adhesiveness and such an inorganic particle-dispersed paste are provided. The resin includes a mixture in which a polyvinyl acetal and a cellulose derivative are mixed so as to satisfy 0.2 ? X/(X + Y) ? 0.8, where X and Y stand for parts by mass of the polyvinyl acetal and the cellulose derivative, respectively. When a paste is formulated by mixing and kneading the resin with spherical nickel particles with an average particle diameter of 0.3 ?m, barium titanate particles with an average particle diameter of 0.05 ?m, a nonionic surfactant, dihydroterpineol, and mineral spirit at the prescribed mixing ratio, the paste is as follows: when strains of 0.02 and 0.2 are applied to the paste at an angular frequency of 6.284 rad/s, a value of a phase difference o between each strain and a stress caused by each strain is greater than 45? ; and a ratio of the viscosity at a shear rate of 4 (1/s) to the viscosity at a shear rate of 40 (1/s) is 4.5 or less. Figure 2.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015145345 | 2015-07-22 | ||
JP2015146217 | 2015-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY180648A true MY180648A (en) | 2020-12-04 |
Family
ID=57834345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017701144A MY180648A (en) | 2015-07-22 | 2016-07-22 | Binder resin for inorganic particle-dispersed paste and inorganic particle-dispersed paste |
Country Status (9)
Country | Link |
---|---|
US (1) | US10392535B2 (en) |
EP (1) | EP3327730A4 (en) |
JP (1) | JP6119939B1 (en) |
KR (1) | KR101847362B1 (en) |
CN (1) | CN106716552B (en) |
MY (1) | MY180648A (en) |
PH (1) | PH12017500434A1 (en) |
TW (1) | TWI609059B (en) |
WO (1) | WO2017014295A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180103110A (en) * | 2016-01-12 | 2018-09-18 | 가부시키가이샤 노리타케 캄파니 리미티드 | Conductive composition |
JP6864505B2 (en) * | 2016-06-24 | 2021-04-28 | 日東電工株式会社 | Heat-bonding sheet and heat-bonding sheet with dicing tape |
JP7059636B2 (en) * | 2018-01-10 | 2022-04-26 | 住友金属鉱山株式会社 | A conductive paste, a dry film thereof, an internal electrode formed by firing the dry film, and a laminated ceramic capacitor having the internal electrode. |
JP6637097B2 (en) * | 2018-03-30 | 2020-01-29 | 株式会社ノリタケカンパニーリミテド | Conductive paste |
US11929341B2 (en) * | 2018-06-26 | 2024-03-12 | Alpha Assembly Solutions Inc. | Nano copper paste and film for sintered die attach and similar applications |
JP6719539B2 (en) * | 2018-12-13 | 2020-07-08 | 株式会社ノリタケカンパニーリミテド | Conductive paste |
JP6894572B1 (en) * | 2020-03-26 | 2021-06-30 | 積水化学工業株式会社 | Polyvinyl acetal resin composition and adhesive |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6047314B2 (en) | 1982-09-07 | 1985-10-21 | 富士通株式会社 | Binder composition for paste |
JP4347440B2 (en) | 1998-09-01 | 2009-10-21 | 住友ゴム工業株式会社 | Conductive paste for internal electrode of multilayer ceramic capacitor, and method of manufacturing multilayer ceramic capacitor using the same |
JP3767362B2 (en) * | 1999-12-13 | 2006-04-19 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
JP2004186339A (en) | 2002-12-02 | 2004-07-02 | Shoei Chem Ind Co | Conductive paste for internal electrode of multilayer electronic component and multilayer electronic component using the same |
JP4568513B2 (en) * | 2003-09-19 | 2010-10-27 | 積水化学工業株式会社 | Conductive paste |
CN1860569A (en) | 2003-09-30 | 2006-11-08 | Tdk株式会社 | Method for producing conductive paste for internal electrode of multilayer ceramic electronic component |
JP4487596B2 (en) | 2004-02-27 | 2010-06-23 | Tdk株式会社 | Method for manufacturing multilayer unit for multilayer ceramic electronic component |
JP4462493B2 (en) | 2005-01-18 | 2010-05-12 | ヤスハラケミカル株式会社 | Conductive paste |
CN100485835C (en) * | 2006-03-10 | 2009-05-06 | 潮州三环(集团)股份有限公司 | Inner electrode size of ceramic capacitor and preparation method thereof |
US20080283188A1 (en) * | 2007-05-16 | 2008-11-20 | Tdk Corporation | Ferrite paste, and method for manufacturing laminated ceramic component |
JP5224722B2 (en) * | 2007-05-17 | 2013-07-03 | 積水化学工業株式会社 | Resin composition, conductive paste and ceramic paste |
JP5091700B2 (en) | 2008-01-30 | 2012-12-05 | 積水化学工業株式会社 | Conductive paste for multilayer ceramic capacitor internal electrode |
JP5600488B2 (en) * | 2009-08-04 | 2014-10-01 | 積水化学工業株式会社 | Inorganic fine particle dispersion paste |
JP5702311B2 (en) * | 2010-01-26 | 2015-04-15 | 株式会社クラレ | Slurry composition for ceramic green sheet, ceramic green sheet and multilayer ceramic capacitor |
CN102169755B (en) * | 2010-02-26 | 2015-07-15 | 住友金属矿山株式会社 | Conductive paste for internal electrode of laminated ceramic capacitor |
JP2010256908A (en) * | 2010-05-07 | 2010-11-11 | Fujifilm Corp | Silver halide photographic photosensitive material for movie |
JP5569747B2 (en) | 2011-02-18 | 2014-08-13 | 住友金属鉱山株式会社 | Gravure printing conductive paste used for multilayer ceramic capacitor internal electrode |
JP5736209B2 (en) * | 2011-03-28 | 2015-06-17 | 株式会社ダイセル | Solvent composition for producing multilayer ceramic parts |
KR102232508B1 (en) * | 2014-01-17 | 2021-03-26 | 소에이 가가쿠 고교 가부시키가이샤 | Method for producing binder resin, method for producing resin composition, binder resin, and resin composition |
JP6613551B2 (en) * | 2014-07-31 | 2019-12-04 | 住友金属鉱山株式会社 | Multilayer ceramic capacitor internal electrode paste and multilayer ceramic capacitor |
-
2016
- 2016-07-22 EP EP16827855.4A patent/EP3327730A4/en active Pending
- 2016-07-22 MY MYPI2017701144A patent/MY180648A/en unknown
- 2016-07-22 TW TW105123232A patent/TWI609059B/en active
- 2016-07-22 KR KR1020177005525A patent/KR101847362B1/en active IP Right Grant
- 2016-07-22 CN CN201680002460.5A patent/CN106716552B/en active Active
- 2016-07-22 US US15/504,557 patent/US10392535B2/en active Active
- 2016-07-22 WO PCT/JP2016/071532 patent/WO2017014295A1/en active Application Filing
- 2016-07-22 JP JP2016569860A patent/JP6119939B1/en active Active
-
2017
- 2017-03-08 PH PH12017500434A patent/PH12017500434A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20180223134A1 (en) | 2018-08-09 |
TWI609059B (en) | 2017-12-21 |
KR101847362B1 (en) | 2018-04-09 |
JP6119939B1 (en) | 2017-04-26 |
CN106716552A (en) | 2017-05-24 |
TW201710441A (en) | 2017-03-16 |
EP3327730A1 (en) | 2018-05-30 |
PH12017500434B1 (en) | 2017-07-31 |
WO2017014295A1 (en) | 2017-01-26 |
KR20170048371A (en) | 2017-05-08 |
PH12017500434A1 (en) | 2017-07-31 |
US10392535B2 (en) | 2019-08-27 |
CN106716552B (en) | 2018-04-10 |
JPWO2017014295A1 (en) | 2017-07-20 |
EP3327730A4 (en) | 2019-04-03 |
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