MY174146A - Polyurethane resin composition - Google Patents

Polyurethane resin composition

Info

Publication number
MY174146A
MY174146A MYPI2017700401A MYPI2017700401A MY174146A MY 174146 A MY174146 A MY 174146A MY PI2017700401 A MYPI2017700401 A MY PI2017700401A MY PI2017700401 A MYPI2017700401 A MY PI2017700401A MY 174146 A MY174146 A MY 174146A
Authority
MY
Malaysia
Prior art keywords
resin composition
polyurethane resin
hydroxyl
containing compound
polyisocyanate compound
Prior art date
Application number
MYPI2017700401A
Inventor
Akira Morisaki
Kotaro Murakami
Tatsuki Nousou
Original Assignee
Sanyu Rec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyu Rec Co Ltd filed Critical Sanyu Rec Co Ltd
Publication of MY174146A publication Critical patent/MY174146A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Abstract

An object of the present invention is to provide a polyurethane resin composition superior in elongation (flexibility), compatibility, hardness, humidity resistance, and heat dissipation property (thermal conductivity). A polyurethane resin composition comprising a hydroxyl-containing compound (A), a polyisocyanate compound (B), a plasticizer (C), and an inorganic filler (D), wherein the hydroxyl-containing compound (A) comprises a polybutadiene polyol (A-1); and the polyisocyanate compound (B) comprises an isocyanurate-modified hexamethylene diisocyanate (B-1) and a hydrogenated 4,4?-diphenylmethane diisocyanate (B-2).
MYPI2017700401A 2015-12-04 2016-10-13 Polyurethane resin composition MY174146A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015237337A JP5989219B1 (en) 2015-12-04 2015-12-04 Polyurethane resin composition

Publications (1)

Publication Number Publication Date
MY174146A true MY174146A (en) 2020-03-11

Family

ID=56871797

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017700401A MY174146A (en) 2015-12-04 2016-10-13 Polyurethane resin composition

Country Status (4)

Country Link
JP (1) JP5989219B1 (en)
CN (1) CN107041141B (en)
MY (1) MY174146A (en)
WO (1) WO2017094358A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018116681A1 (en) * 2016-12-22 2018-06-28 Dic株式会社 Moisture-curable hot-melt urethane resin composition, laminate, and shoes
JP7182900B2 (en) * 2017-06-09 2022-12-05 キヤノン株式会社 liquid ejection head
WO2019194162A1 (en) * 2018-04-05 2019-10-10 三井化学株式会社 Polyurethane gel material, polyurethane gel, pseudo-biological material, and production method for polyurethane gel
CN109679319A (en) * 2018-11-12 2019-04-26 许文强 A kind of preparation method of the electronic package material of high thermal conductivity low thermal expansion
JP7288575B2 (en) * 2019-09-13 2023-06-08 シーカ・ジャパン株式会社 Urethane coating composition, coating structure and construction method
JP6905135B1 (en) * 2020-09-29 2021-07-21 第一工業製薬株式会社 Polyurethane resin composition
CN112322028B (en) * 2020-11-05 2022-10-28 深圳市傲川科技有限公司 Polyurethane low-density heat-conducting gel and preparation method thereof
JP2024510321A (en) * 2021-09-28 2024-03-06 エルジー・ケム・リミテッド curable composition
JP2024505046A (en) * 2021-09-28 2024-02-02 エルジー・ケム・リミテッド curable composition
CN113736419B (en) * 2021-10-19 2022-04-12 杭州之江新材料有限公司 Double-component polyurethane heat-conducting structural adhesive and preparation method thereof
JP2023121004A (en) * 2022-02-18 2023-08-30 サンユレック株式会社 resin composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684415B2 (en) * 1986-06-26 1994-10-26 日本電信電話株式会社 Admixture for cable connection
JP3276673B2 (en) * 1992-05-20 2002-04-22 出光アトフィナ株式会社 Liquid polymer composition
JP5535529B2 (en) * 2009-06-17 2014-07-02 第一工業製薬株式会社 Polyurethane resin composition
US9666330B2 (en) * 2011-10-12 2017-05-30 Sanyu Rec Co., Ltd. Polyurethane resin composition for electrical insulation
JP5550161B1 (en) * 2013-11-06 2014-07-16 第一工業製薬株式会社 Polyurethane resin composition
JP5568187B1 (en) * 2014-01-10 2014-08-06 第一工業製薬株式会社 Polyurethane resin composition
JP2015089941A (en) * 2014-05-15 2015-05-11 第一工業製薬株式会社 Polyurethane resin composition
JP5784210B1 (en) * 2014-11-21 2015-09-24 サンユレック株式会社 Polyurethane resin composition

Also Published As

Publication number Publication date
WO2017094358A1 (en) 2017-06-08
JP2017101195A (en) 2017-06-08
JP5989219B1 (en) 2016-09-07
CN107041141B (en) 2018-11-16
CN107041141A (en) 2017-08-11

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