MY167740A - Mold cleaning sheet - Google Patents
Mold cleaning sheetInfo
- Publication number
- MY167740A MY167740A MYPI2012700662A MYPI2012700662A MY167740A MY 167740 A MY167740 A MY 167740A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY PI2012700662 A MYPI2012700662 A MY PI2012700662A MY 167740 A MY167740 A MY 167740A
- Authority
- MY
- Malaysia
- Prior art keywords
- mold cleaning
- cleaning members
- width
- blocks
- mold
- Prior art date
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The present invention relates to a mold cleaning sheet for cleaning a mold having a cavity which has an opening in a shape of an oval or a quadrangle, in which the mold cleaning sheet includes a sheet-like base material (1) and a plurality of belt-shaped mold cleaning members (2) formed on at least one side of the sheet-like base material (1), formed from an unvulcanized rubber composition or a thermosetting resin composition, and disposed in a pattern that the plurality of belt-shaped mold cleaning members (2) are aligned in parallel with a clearance on the base material; each of the mold cleaning members (2) is cut into a plurality of blocks in a longitudinal direction of the mold cleaning members (2) at predetermined intervals to form a column including the plurality of blocks; each of the blocks has a length (Y) of from 3 mm to 50 mm, a clearance between neighboring blocks in the column including the plurality of blocks is 0.1 mm or more and is not larger than a width (X) of the mold cleaning members (2), a clearance between neighboring mold cleaning members (2) in a direction of the width (X) of the mold cleaning members (2) is not smaller than 1/2 of the width (X) of the mold cleaning members (2) and not larger than the width (X) of the mold cleaning members (2), and the width (X) of the mold cleaning members (2) is 1 mm or more and not larger than 4/5 of a breadth of the opening of the cavity.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011254241A JP5741398B2 (en) | 2011-11-21 | 2011-11-21 | Mold cleaning sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
MY167740A true MY167740A (en) | 2018-09-24 |
Family
ID=48489653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2012700662A MY167740A (en) | 2011-11-21 | 2012-09-14 | Mold cleaning sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5741398B2 (en) |
KR (1) | KR102002175B1 (en) |
CN (2) | CN105538556A (en) |
MY (1) | MY167740A (en) |
SG (1) | SG190510A1 (en) |
TW (1) | TWI516353B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5741398B2 (en) * | 2011-11-21 | 2015-07-01 | 日立化成株式会社 | Mold cleaning sheet |
CN104194645B (en) * | 2014-08-07 | 2016-05-11 | 湖北迪曼特科技有限公司 | For removing clear mould cake and the preparation and application thereof of the residual aluminium of mould to be repaired |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0271107B1 (en) * | 1986-12-11 | 1993-06-02 | Nitto Denko Corporation | Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet |
JPH07304044A (en) * | 1994-05-11 | 1995-11-21 | Toshiba Chem Corp | Method and material for cleaning mold |
JP3943145B2 (en) * | 1994-11-04 | 2007-07-11 | 株式会社ルネサステクノロジ | Mold cleaning method and semiconductor chip resin sealing method |
JP2862852B2 (en) * | 1997-04-21 | 1999-03-03 | 日東電工株式会社 | Mold regeneration sheet and mold cleaning method using the same |
AU2003289119A1 (en) * | 2002-12-06 | 2004-06-30 | Nippon Carbide Kogyo Kabushiki Kaisha | Cleaning material for molding metal die, and cleaning method |
JP3780284B2 (en) * | 2004-01-16 | 2006-05-31 | 株式会社ルネサステクノロジ | Mold cleaning sheet |
JP4373291B2 (en) * | 2004-06-24 | 2009-11-25 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
JP5245039B2 (en) * | 2006-01-27 | 2013-07-24 | 日立化成株式会社 | Mold regeneration sheet |
JP5245040B2 (en) * | 2006-01-27 | 2013-07-24 | 日立化成株式会社 | Mold regeneration sheet |
TWI414410B (en) * | 2006-01-27 | 2013-11-11 | Nitto Denko Corp | Sheet for regenerating a mold |
JP2007242924A (en) * | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | Manufacturing method of semiconductor device |
MY148591A (en) * | 2006-05-25 | 2013-05-15 | Nitto Denko Corp | Mold cleaning composition |
JP5089273B2 (en) * | 2006-10-23 | 2012-12-05 | 日東電工株式会社 | Mold regeneration sheet |
JP5322140B2 (en) * | 2006-12-13 | 2013-10-23 | 日立化成株式会社 | Mold regeneration sheet |
JP2008213313A (en) * | 2007-03-05 | 2008-09-18 | Nitto Denko Corp | Sheet for regeneration of mold and mold cleaning method using the sheet |
JP5741398B2 (en) * | 2011-11-21 | 2015-07-01 | 日立化成株式会社 | Mold cleaning sheet |
-
2011
- 2011-11-21 JP JP2011254241A patent/JP5741398B2/en active Active
-
2012
- 2012-09-14 SG SG2012068771A patent/SG190510A1/en unknown
- 2012-09-14 CN CN201510971755.0A patent/CN105538556A/en active Pending
- 2012-09-14 MY MYPI2012700662A patent/MY167740A/en unknown
- 2012-09-14 TW TW101133862A patent/TWI516353B/en active
- 2012-09-14 KR KR1020120101875A patent/KR102002175B1/en active IP Right Grant
- 2012-09-14 CN CN201210342468.XA patent/CN103128884B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103128884A (en) | 2013-06-05 |
CN105538556A (en) | 2016-05-04 |
CN103128884B (en) | 2016-01-27 |
JP5741398B2 (en) | 2015-07-01 |
SG190510A1 (en) | 2013-06-28 |
TWI516353B (en) | 2016-01-11 |
TW201321160A (en) | 2013-06-01 |
KR102002175B1 (en) | 2019-07-19 |
KR20130056162A (en) | 2013-05-29 |
JP2013107287A (en) | 2013-06-06 |
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