MY164922A - Method of thermocompression bonding of laser-etched copper pads to cob module - Google Patents

Method of thermocompression bonding of laser-etched copper pads to cob module

Info

Publication number
MY164922A
MY164922A MYPI2011002669A MYPI2011002669A MY164922A MY 164922 A MY164922 A MY 164922A MY PI2011002669 A MYPI2011002669 A MY PI2011002669A MY PI2011002669 A MYPI2011002669 A MY PI2011002669A MY 164922 A MY164922 A MY 164922A
Authority
MY
Malaysia
Prior art keywords
thermocompression bonding
laser
copper pads
etched copper
cob module
Prior art date
Application number
MYPI2011002669A
Inventor
Pooi Nguon Lim
Bin Mohd Daud Noordazlee
Original Assignee
Iris Corp Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iris Corp Berhad filed Critical Iris Corp Berhad
Priority to MYPI2011002669A priority Critical patent/MY164922A/en
Priority to TW101120726A priority patent/TW201316865A/en
Priority to PCT/MY2012/000116 priority patent/WO2012169873A2/en
Publication of MY164922A publication Critical patent/MY164922A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)

Abstract

THE PRESENT INVENTION PROVIDES AN RFID BOARD COMPRISING ANTENNA (101) AND CHIP-ON BOARD MODULE (103), WHEREIN THE ANTENNA (101) HAVING TWO TERMINALS IN A FORM OF PADS (104, 105), IS BONDED TO LEAD FRAME (108) OF THE CHIP-ON-BOARD MODULE (103) VIA THERMOCOMPRESSION BONDING, WITHOUT THE USE OF ANY INTERMEDIATE ELECTRICALLY CONDUCTIVE MATERIALS. A METHOD TO FABRICATE THE RFID BOARD VIA THERMOCOMPRESSION BONDING IS ALSO PROVIDED HEREWITH. (FIG. 3C)
MYPI2011002669A 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module MY164922A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module
TW101120726A TW201316865A (en) 2011-06-10 2012-06-08 Method of thermocompression bonding of laser-etched copper pads to COB module
PCT/MY2012/000116 WO2012169873A2 (en) 2011-06-10 2012-06-08 Method of thermocompression bonding of laser-etched copper pads to cob module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module

Publications (1)

Publication Number Publication Date
MY164922A true MY164922A (en) 2018-02-15

Family

ID=47296656

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011002669A MY164922A (en) 2011-06-10 2011-06-10 Method of thermocompression bonding of laser-etched copper pads to cob module

Country Status (3)

Country Link
MY (1) MY164922A (en)
TW (1) TW201316865A (en)
WO (1) WO2012169873A2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1544787A1 (en) * 2003-12-19 2005-06-22 Axalto SA Contactless card including an antenna switch
US20090166431A1 (en) * 2005-04-18 2009-07-02 Hallys Corporation Electronic component and manufacturing method thereof
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
EP2232414A4 (en) * 2007-12-19 2011-05-04 Linda Seah Contact-less and dual interface inlays and methods for producing the same
DE102008037817B4 (en) * 2008-08-14 2019-09-05 Infineon Technologies Ag Transponder inlay for a personal identification document and a method of making a transponder inlay

Also Published As

Publication number Publication date
WO2012169873A3 (en) 2013-04-04
WO2012169873A2 (en) 2012-12-13
TW201316865A (en) 2013-04-16

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