Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011162305Aexternal-prioritypatent/JP2013023661A/en
Priority claimed from JP2011249483Aexternal-prioritypatent/JP2013102735A/en
Priority claimed from JP2011283686Aexternal-prioritypatent/JP5660021B2/en
Application filed by Nitto Denko CorpfiledCriticalNitto Denko Corp
Publication of MY161388ApublicationCriticalpatent/MY161388A/en
The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A),to (D) : (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt% based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.
MYPI2012700495A2011-07-252012-07-25Epoxy Resin Composition For Semiconductor Encapsulation
MY161388A
(en)
Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film
Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconductor
Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound