MY157618A - Medium for etching oxidic, transparent, conductive layers - Google Patents
Medium for etching oxidic, transparent, conductive layersInfo
- Publication number
- MY157618A MY157618A MYPI20063097A MYPI20063097A MY157618A MY 157618 A MY157618 A MY 157618A MY PI20063097 A MYPI20063097 A MY PI20063097A MY PI20063097 A MYPI20063097 A MY PI20063097A MY 157618 A MY157618 A MY 157618A
- Authority
- MY
- Malaysia
- Prior art keywords
- medium
- transparent
- etching
- conductive layers
- oxidic
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- DDSPUNTXKUFWTM-UHFFFAOYSA-N oxygen(2-);tin(4+) Chemical compound [O-2].[O-2].[Sn+4] DDSPUNTXKUFWTM-UHFFFAOYSA-N 0.000 abstract 1
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Weting (AREA)
- Manufacturing Of Electric Cables (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
- 24 - ABSTRJKCT MEDIUM FOR ETCHING OXIDIC, TRANSPARENT, CONDUCTIVE LAYERS THE PRESENT INVENTION RELATES TO A NOVEL DISPENSABLE MEDIUM FOR ETCH- ING DOPED TIN OXIDE LAYERS HAVING NON-NEWTONIAN FLOW BEHAVIOUR FOR THE ETCHING OF SURFACES IN THE PRODUCTION OF DISPLAYS AND/OR SOLAR CELLS AND TO THE USE THEREOF. IN PARTICULAR, IT RELATES TO CORRESPONDING PARTICLE-FREE COMPOSITIONS BY MEANS OF WHICH FINE STRUCTURES CAN BE ETCHED SELEC- TIVELY WITHOUT DAMAGING OR ATTACKING ADJACENT AREAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005031469A DE102005031469A1 (en) | 2005-07-04 | 2005-07-04 | Medium for the etching of oxidic, transparent, conductive layers |
Publications (1)
Publication Number | Publication Date |
---|---|
MY157618A true MY157618A (en) | 2016-06-30 |
Family
ID=36888644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20063097A MY157618A (en) | 2005-07-04 | 2006-06-29 | Medium for etching oxidic, transparent, conductive layers |
Country Status (10)
Country | Link |
---|---|
US (1) | US20080210660A1 (en) |
EP (1) | EP1899277A1 (en) |
JP (1) | JP5373394B2 (en) |
KR (1) | KR20080025757A (en) |
CN (1) | CN101208277B (en) |
DE (1) | DE102005031469A1 (en) |
HK (1) | HK1119652A1 (en) |
MY (1) | MY157618A (en) |
TW (1) | TWI391474B (en) |
WO (1) | WO2007003255A1 (en) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005035255A1 (en) * | 2005-07-25 | 2007-02-01 | Merck Patent Gmbh | Etching media for oxide, transparent, conductive layers |
DE102006051735A1 (en) * | 2006-10-30 | 2008-05-08 | Merck Patent Gmbh | Printable medium for the etching of oxidic, transparent, conductive layers |
EA201000138A1 (en) * | 2007-07-04 | 2010-12-30 | Агк Флэт Гласс Юроп Са | GLASS PRODUCT |
US7888168B2 (en) * | 2007-11-19 | 2011-02-15 | Applied Materials, Inc. | Solar cell contact formation process using a patterned etchant material |
WO2009067475A1 (en) * | 2007-11-19 | 2009-05-28 | Applied Materials, Inc. | Crystalline solar cell metallization methods |
US8309446B2 (en) | 2008-07-16 | 2012-11-13 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a doping layer mask |
TW201027766A (en) * | 2008-08-27 | 2010-07-16 | Applied Materials Inc | Back contact solar cells using printed dielectric barrier |
CN102203952A (en) * | 2008-10-29 | 2011-09-28 | 三菱瓦斯化学株式会社 | Texture processing liquid for transparent conductive film mainly composed of zinc oxide and method for producing transparent conductive film having recesses and projections |
US8518277B2 (en) * | 2009-02-12 | 2013-08-27 | Tpk Touch Solutions Inc. | Plastic capacitive touch screen and method of manufacturing same |
US8486282B2 (en) * | 2009-03-25 | 2013-07-16 | Intermolecular, Inc. | Acid chemistries and methodologies for texturing transparent conductive oxide materials |
CN102369258B (en) | 2009-03-30 | 2014-12-10 | 东丽株式会社 | Agent for removing conductive film and method for removing conductive film |
US8263427B2 (en) * | 2009-06-02 | 2012-09-11 | Intermolecular, Inc. | Combinatorial screening of transparent conductive oxide materials for solar applications |
CN101958361A (en) * | 2009-07-13 | 2011-01-26 | 无锡尚德太阳能电力有限公司 | Method for etching transparent thin-film solar cell component |
CN102097536B (en) * | 2009-12-11 | 2012-12-12 | 杜邦太阳能有限公司 | Method of making monolithic photovoltaic module |
CN102108512B (en) * | 2009-12-25 | 2013-09-18 | 比亚迪股份有限公司 | Chemical etching liquid for metals and etching method |
CN103069502A (en) * | 2010-03-23 | 2013-04-24 | 凯博瑞奥斯技术公司 | Etch patterning of nanostructure transparent conductors |
WO2011125603A1 (en) | 2010-04-09 | 2011-10-13 | 鶴見曹達株式会社 | Ink for conductive polymer etching and method for patterning conductive polymer |
US20130092657A1 (en) * | 2010-06-14 | 2013-04-18 | Nano Terra, Inc. | Cross-linking and multi-phase etch pastes for high resolution feature patterning |
JP2012043897A (en) * | 2010-08-17 | 2012-03-01 | Dnp Fine Chemicals Co Ltd | Etchant for conductive film and etching method |
US20140021400A1 (en) | 2010-12-15 | 2014-01-23 | Sun Chemical Corporation | Printable etchant compositions for etching silver nanoware-based transparent, conductive film |
DE102011016881A1 (en) * | 2011-04-13 | 2012-10-18 | Forschungszentrum Jülich GmbH | Etching solution and method for structuring a zinc oxide layer and zinc oxide layer |
KR20140014292A (en) | 2011-06-24 | 2014-02-05 | 가부시키가이샤 구라레 | Method for forming conductive film, conductive film, insulation method, and insulation film |
WO2013010612A1 (en) * | 2011-07-18 | 2013-01-24 | Merck Patent Gmbh | Structuring antistatic and antireflection coatings and corresponding stacked layers |
CN102569038A (en) * | 2011-12-29 | 2012-07-11 | 映瑞光电科技(上海)有限公司 | Method for manufacturing patterned substrate |
WO2013106225A1 (en) | 2012-01-12 | 2013-07-18 | Applied Materials, Inc. | Methods of manufacturing solar cell devices |
KR20130084717A (en) * | 2012-01-18 | 2013-07-26 | 솔브레인 주식회사 | Etchant composition and method of manufacturing a display substrate using the etchant composition |
EP2827363A4 (en) * | 2012-03-13 | 2015-11-11 | Adeka Corp | Etching solution composition and etching method |
WO2015168881A1 (en) * | 2014-05-07 | 2015-11-12 | 佛山市中山大学研究院 | Novel etching solution used in oxide material system, etching method and application thereof |
CN103980905B (en) * | 2014-05-07 | 2017-04-05 | 佛山市中山大学研究院 | A kind of etching solution and its engraving method and application for oxide material system |
WO2016096083A1 (en) * | 2014-12-19 | 2016-06-23 | Merck Patent Gmbh | Agent for increasing etching rates |
US10294422B2 (en) | 2015-07-16 | 2019-05-21 | Hailiang Wang | Etching compositions for transparent conductive layers comprising silver nanowires |
US10372246B2 (en) | 2015-07-16 | 2019-08-06 | Hailiang Wang | Transferable nanocomposites for touch sensors |
KR101922289B1 (en) * | 2015-11-26 | 2018-11-27 | 삼성에스디아이 주식회사 | Cmp slurry composition and polishing method of organic film using the same |
JP2017216444A (en) * | 2016-05-31 | 2017-12-07 | ナガセケムテックス株式会社 | Etchant |
US9824893B1 (en) * | 2016-06-28 | 2017-11-21 | Lam Research Corporation | Tin oxide thin film spacers in semiconductor device manufacturing |
KR20180093798A (en) | 2017-02-13 | 2018-08-22 | 램 리써치 코포레이션 | Method to create air gaps |
KR102383394B1 (en) | 2017-09-22 | 2022-04-08 | 가부시키가이샤 가네카 | Methods of making patterned sheets and etched structures |
CN107673627B (en) * | 2017-11-01 | 2020-06-16 | 南京大学 | Preparation method of porous conductive glass |
CN111886689A (en) | 2018-03-19 | 2020-11-03 | 朗姆研究公司 | Non-chamfer through hole integration scheme |
CN110922971A (en) * | 2018-09-20 | 2020-03-27 | 深圳新宙邦科技股份有限公司 | Etching solution composition for aluminum-doped zinc oxide film |
JP7320085B2 (en) | 2019-06-27 | 2023-08-02 | ラム リサーチ コーポレーション | Alternating etching and passivation processes |
US11964874B2 (en) * | 2020-06-09 | 2024-04-23 | Agilent Technologies, Inc. | Etched non-porous particles and method of producing thereof |
CN112981403A (en) * | 2020-12-29 | 2021-06-18 | 苏州运宏电子有限公司 | Metal sheet surface fine grain etching process |
CN113969173B (en) * | 2021-09-23 | 2022-05-13 | 易安爱富(武汉)科技有限公司 | Etching solution for ITO/Ag/ITO composite metal layer film |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63125683A (en) * | 1986-11-14 | 1988-05-28 | Taiyo Yuden Co Ltd | Etching solution for electrically conductive film containing metallic element |
JPH01147078A (en) * | 1987-12-02 | 1989-06-08 | Ricoh Co Ltd | Etching ink composition for forming transparent electrode pattern and method for using same |
JPH02135619A (en) * | 1988-11-17 | 1990-05-24 | Asahi Glass Co Ltd | Wet etching method |
JPH0342829A (en) * | 1989-07-11 | 1991-02-25 | Citizen Watch Co Ltd | Etchant for transparent conductive film |
JPH03239377A (en) * | 1990-02-16 | 1991-10-24 | Canon Inc | Solar cell module |
CN1058051A (en) * | 1990-07-10 | 1992-01-22 | 虞凌 | One-step technology for fast carving on steel |
CN1031747C (en) * | 1993-10-27 | 1996-05-08 | 高平 | Steel mould intaglio etching liquid specially for transfer machine electronic |
US5688366A (en) * | 1994-04-28 | 1997-11-18 | Canon Kabushiki Kaisha | Etching method, method of producing a semiconductor device, and etchant therefor |
JP3173318B2 (en) * | 1994-04-28 | 2001-06-04 | キヤノン株式会社 | Etching method and method for manufacturing semiconductor device |
US5457057A (en) * | 1994-06-28 | 1995-10-10 | United Solar Systems Corporation | Photovoltaic module fabrication process |
JP3057599B2 (en) * | 1994-07-06 | 2000-06-26 | キヤノン株式会社 | Cleaning device and cleaning method |
JPH10110281A (en) * | 1996-10-03 | 1998-04-28 | Asahi Denka Kogyo Kk | Etching method for metallic oxide thin film |
JPH11117080A (en) * | 1997-10-15 | 1999-04-27 | Asahi Denka Kogyo Kk | Etching of metal oxide thin film |
WO2000011107A1 (en) * | 1998-08-18 | 2000-03-02 | Ki Won Lee | Ito etching composition |
JP2001307567A (en) * | 2000-04-25 | 2001-11-02 | Nippon Sheet Glass Co Ltd | Substrate with transparent conductive film and its manufacturing method |
RU2274615C2 (en) * | 2000-04-28 | 2006-04-20 | Мерк Патент Гмбх | Engraving pastes for inorganic surfaces |
EP1646091A3 (en) * | 2000-09-08 | 2006-04-19 | Kanto Kagaku Kabushiki Kaisha | Etching liquid composition |
KR100442026B1 (en) * | 2000-12-22 | 2004-07-30 | 동우 화인켐 주식회사 | Etchant for ito layer and method for the same therewith |
DE10150040A1 (en) * | 2001-10-10 | 2003-04-17 | Merck Patent Gmbh | Etching passivating and antireflection layers made from silicon nitride on solar cells comprises applying a phosphoric acid and/or etching medium containing a salt of phosphoric acid the surface regions to be etched |
JP3791597B2 (en) * | 2001-10-19 | 2006-06-28 | 三菱瓦斯化学株式会社 | Etching composition for transparent conductive film |
-
2005
- 2005-07-04 DE DE102005031469A patent/DE102005031469A1/en not_active Withdrawn
-
2006
- 2006-06-08 JP JP2008518655A patent/JP5373394B2/en not_active Expired - Fee Related
- 2006-06-08 CN CN200680023243.0A patent/CN101208277B/en not_active Expired - Fee Related
- 2006-06-08 KR KR1020087003019A patent/KR20080025757A/en not_active Application Discontinuation
- 2006-06-08 EP EP06754211A patent/EP1899277A1/en not_active Withdrawn
- 2006-06-08 US US11/994,608 patent/US20080210660A1/en not_active Abandoned
- 2006-06-08 WO PCT/EP2006/005460 patent/WO2007003255A1/en active Application Filing
- 2006-06-29 MY MYPI20063097A patent/MY157618A/en unknown
- 2006-07-04 TW TW095124352A patent/TWI391474B/en not_active IP Right Cessation
-
2008
- 2008-10-24 HK HK08111757.2A patent/HK1119652A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200710206A (en) | 2007-03-16 |
WO2007003255A1 (en) | 2007-01-11 |
TWI391474B (en) | 2013-04-01 |
CN101208277B (en) | 2014-09-24 |
JP5373394B2 (en) | 2013-12-18 |
JP2008547232A (en) | 2008-12-25 |
EP1899277A1 (en) | 2008-03-19 |
US20080210660A1 (en) | 2008-09-04 |
DE102005031469A1 (en) | 2007-01-11 |
CN101208277A (en) | 2008-06-25 |
KR20080025757A (en) | 2008-03-21 |
HK1119652A1 (en) | 2009-03-13 |
WO2007003255A8 (en) | 2007-03-22 |
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