MY154601A - Lead-free solder ball - Google Patents
Lead-free solder ballInfo
- Publication number
- MY154601A MY154601A MYPI2014703944A MYPI2014703944A MY154601A MY 154601 A MY154601 A MY 154601A MY PI2014703944 A MYPI2014703944 A MY PI2014703944A MY PI2014703944 A MYPI2014703944 A MY PI2014703944A MY 154601 A MY154601 A MY 154601A
- Authority
- MY
- Malaysia
- Prior art keywords
- electrodes
- solder ball
- mass
- lead
- free solder
- Prior art date
Links
Landscapes
- Conductive Materials (AREA)
Abstract
A SOLDER BALL IS PROVIDED WHICH SUPPRESSES INTERFACIAL PEELING IN A BONDING INTERFACE OF A SOLDER BALL, WHICH SUPPRESSES FUSION DEFECTS WHICH DEVELOP BETWEEN THE SOLDER BALL AND SOLDER PASTE, AND WHICH CAN BE USED BOTH WITH NI ELECTRODES PLATE WITH AU OR THE LIKE AND CU ELECTRODES HAVING A WATER-SOLUBLE PREFLUX APPLIED ATOP CU. THE PRESENT INVENTION IS A LEAD-FREE SOLDER BALL FOR ELECTRODES OF BGAS OR CSPS CONSISTING OF 1.6 - 2.9 MASS % OF AG, 0.7 - 0.8 MASS % OF CU, 0.05 - 0.08 MASS % OF NI, AND A REMAINDER OF SN. IT HAS EXCELLENT RESISTANCE TO THERMAL FATIGUE AND EXCELLENT RESISTANCE TO DROP IMPACTS REGARDLESS OF THE TYPE OF ELECTRODES OF A PRINTED CIRCUIT BOARD TO WHICH IT IS BONDED, WHICH ARE CU ELECTRODES OR NI ELECTRODES HAVING AU PLATING OR AU/PD PLATING AS SURFACE TREATMENT. AT LEAST ONE ELEMENT SELECTED FROM FE, CO, AND PT IN A TOTAL AMOUNT OF 0.003 - 0.1 MASS % OR AT LEAST ONE ELEMENT SELECTED FROM BI, IN, SB, P, AND GE IN A TOTAL AMOUNT OF 0.003 - 0.1 MASS % MAY BE ADDED TO THIS COMPOSITION. (FIG. 2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2014703944A MY154601A (en) | 2012-06-30 | 2012-06-30 | Lead-free solder ball |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2014703944A MY154601A (en) | 2012-06-30 | 2012-06-30 | Lead-free solder ball |
Publications (1)
Publication Number | Publication Date |
---|---|
MY154601A true MY154601A (en) | 2015-07-01 |
Family
ID=54150143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014703944A MY154601A (en) | 2012-06-30 | 2012-06-30 | Lead-free solder ball |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY154601A (en) |
-
2012
- 2012-06-30 MY MYPI2014703944A patent/MY154601A/en unknown
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