MY152696A - Slider bond pad with a recessed channel - Google Patents

Slider bond pad with a recessed channel

Info

Publication number
MY152696A
MY152696A MYPI2010002941A MY152696A MY 152696 A MY152696 A MY 152696A MY PI2010002941 A MYPI2010002941 A MY PI2010002941A MY 152696 A MY152696 A MY 152696A
Authority
MY
Malaysia
Prior art keywords
bond pad
recessed channel
slider bond
slider
slider body
Prior art date
Application number
Other languages
English (en)
Inventor
Erik Jon Hutchinson
Christopher Michael Unger
Original Assignee
Seagate Technology Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology Llc filed Critical Seagate Technology Llc
Publication of MY152696A publication Critical patent/MY152696A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm

Landscapes

  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
MYPI2010002941 2009-06-22 2010-06-21 Slider bond pad with a recessed channel MY152696A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/489,176 US8259415B2 (en) 2009-06-22 2009-06-22 Slider bond pad with a recessed channel

Publications (1)

Publication Number Publication Date
MY152696A true MY152696A (en) 2014-11-28

Family

ID=43354144

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002941 MY152696A (en) 2009-06-22 2010-06-21 Slider bond pad with a recessed channel

Country Status (5)

Country Link
US (1) US8259415B2 (zh)
JP (2) JP5252592B2 (zh)
KR (1) KR101273441B1 (zh)
CN (1) CN101964194B (zh)
MY (1) MY152696A (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8243391B2 (en) * 2008-09-26 2012-08-14 Hitachi Global Storage Technologies, Netherlands B.V. Slider and suspension composite fiber solder joints
US8587901B1 (en) * 2009-12-30 2013-11-19 Western Digital (Fremont), Llc Magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area
US8477457B2 (en) * 2011-09-09 2013-07-02 HGST Netherlands, B.V. Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge
US8730621B2 (en) 2012-07-09 2014-05-20 Seagate Technology Llc Solder ball bridge, and methods of making
US8767351B1 (en) * 2013-01-31 2014-07-01 Seagate Technology Llc Ambient temperature ball bond
US9025283B1 (en) 2013-09-18 2015-05-05 Western Digital Technologies, Inc. Laminated suspension flexure with open polyimide base
US8947830B1 (en) * 2014-06-10 2015-02-03 Seagate Technology Llc Method of forming electrical connections from solder posts
US9728211B1 (en) 2016-02-04 2017-08-08 Western Digital Technologies, Inc. Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge
US9786308B1 (en) 2016-06-07 2017-10-10 Seagate Technology Llc Interconnect interposer attachable to a trailing edge of a slider
US9953669B1 (en) * 2016-10-18 2018-04-24 Seagate Technology Llc Toothed slider high density head gimbal assembly slider interconnect
US10460754B2 (en) 2018-02-05 2019-10-29 Western Digital Technologies, Inc. Slider and suspension arm interconnection for magnetic storage device
US10643645B2 (en) 2018-09-24 2020-05-05 Seagate Technology Llc Slider with bondable surface opposite suspension trace
US10706880B1 (en) * 2019-04-02 2020-07-07 Seagate Technology Llc Electrically conductive solder non-wettable bond pads in head gimbal assemblies
US11676628B1 (en) 2021-12-02 2023-06-13 Western Digital Technologies, Inc. Multiple-portion hard disk drive slider pad configuration
US11631426B1 (en) 2021-12-15 2023-04-18 Western Digital Technologies, Inc. Hard disk drive suspension pad peel-prevention configuration
US11705153B1 (en) 2022-03-23 2023-07-18 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder formation and guiding
US11908497B2 (en) 2022-03-29 2024-02-20 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder sidewalls
US12094501B1 (en) 2023-04-05 2024-09-17 Western Digital Technologies, Inc. Hard disk drive slider split pad configuration

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258460U (zh) * 1975-10-24 1977-04-27
JPS57166377U (zh) * 1981-04-13 1982-10-20
JPS57188315A (en) 1981-05-15 1982-11-19 Nippon Concrete Ind Co Ltd Method of removing concrete post body from die
JPS57188315U (zh) * 1981-05-26 1982-11-30
US5390412A (en) 1993-04-08 1995-02-21 Gregoire; George D. Method for making printed circuit boards
US5373111A (en) 1993-11-19 1994-12-13 Delco Electronics Corporation Bond pad having a patterned bonding surface
US5530604A (en) * 1994-05-19 1996-06-25 International Business Machines Corporation Electrical connection and slider-suspension assembly having an improved electrical connection
KR0157284B1 (ko) 1995-05-31 1999-02-18 김광호 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지
US5686762A (en) 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads
US5876580A (en) 1996-01-12 1999-03-02 Micromodule Systems Rough electrical contact surface
JP3526376B2 (ja) 1996-08-21 2004-05-10 株式会社東芝 半導体装置及びその製造方法
US5929521A (en) 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6025988A (en) 1998-12-17 2000-02-15 Read-Rite Corporation Interconnect adapter and head suspension assembly
JP2000188232A (ja) * 1998-12-21 2000-07-04 Matsushita Electric Ind Co Ltd 面実装部品
US6531384B1 (en) 2001-09-14 2003-03-11 Motorola, Inc. Method of forming a bond pad and structure thereof
WO2003060886A1 (en) * 2002-01-19 2003-07-24 Sae Magnetics (H.K.) Ltd. Method and apparatus for the physical and electrical coupling of a hard disk micro-actuator and magnetic head to a drive arm suspension
US6989967B2 (en) 2002-08-06 2006-01-24 Seagate Technology Llc Slider having a trailing bearing pad adjacent to a recessed area
US7015580B2 (en) 2003-11-25 2006-03-21 International Business Machines Corporation Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
JP4255859B2 (ja) * 2004-02-26 2009-04-15 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ 回転円板形記憶装置及び配線一体型ヘッド・サスペンション・アセンブリ
US7446399B1 (en) 2004-08-04 2008-11-04 Altera Corporation Pad structures to improve board-level reliability of solder-on-pad BGA structures
JP2006185479A (ja) 2004-12-27 2006-07-13 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ及び磁気ディスク装置
CN100559473C (zh) * 2005-04-25 2009-11-11 新科实业有限公司 焊接装置及在磁盘驱动单元内形成电性焊接的方法
JP4237744B2 (ja) * 2005-11-01 2009-03-11 Ｔｄｋ株式会社 磁気ヘッドアッセンブリ及びその半田接合方法

Also Published As

Publication number Publication date
JP2012256418A (ja) 2012-12-27
US8259415B2 (en) 2012-09-04
JP5252592B2 (ja) 2013-07-31
KR101273441B1 (ko) 2013-06-11
JP5794738B2 (ja) 2015-10-14
CN101964194B (zh) 2013-06-19
US20100321829A1 (en) 2010-12-23
JP2011009216A (ja) 2011-01-13
CN101964194A (zh) 2011-02-02
KR20100137392A (ko) 2010-12-30

Similar Documents

Publication Publication Date Title
MY152696A (en) Slider bond pad with a recessed channel
TWI371069B (en) Bonding pad on ic substrate and method for making the same
WO2008118194A3 (en) Partial solder mask defined pad design
ATE470528T1 (de) Halter für einen schweissdrahtbund
SG136864A1 (en) Reduced oxidation system for wire bonding
MX2012006147A (es) Articulo abrasivo aglomerado y metodo de formacion.
TW200801382A (en) Electronic device
SG179409A1 (en) Gas delivery system for reducing oxidation in wire bonding operations
TW200611417A (en) Crystalline semiconductor film and method of making the same
SG11201906510PA (en) Method and device for bonding chips
TW200746276A (en) Method for bonding a semiconductor substrate to a metal substrate
MY152355A (en) Short and low loop wire bonding
TW200627555A (en) Method for wafer level package
TW200737379A (en) Semiconductor device and fabrication process thereof
EP2515435A3 (en) Power amplifier
EP1850044A3 (en) Clamp for a riser
SG148928A1 (en) Integrated circuit package in package system with adhesiveless package attach
SG151238A1 (en) Integrated circuit package system including die having relieved active region
IN2012DN02426A (zh)
TW200636890A (en) Apparatus and method for bonding wires
MY178992A (en) Die attachment apparatus and method utilizing activated forming gas
DE502007005693D1 (de) Testbandvorrichtung zum Untersuchen einer Körperflüssigkeit
MY156977A (en) Cutter and cutting tool incorporating the same
CA2703254A1 (en) A diagnostic device for identifying rupture of membrane during pregnancy
MY172913A (en) Gold die bond sheet preform