MY150334A - Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance - Google Patents

Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance

Info

Publication number
MY150334A
MY150334A MYPI2010003394A MYPI20103394A MY150334A MY 150334 A MY150334 A MY 150334A MY PI2010003394 A MYPI2010003394 A MY PI2010003394A MY PI20103394 A MYPI20103394 A MY PI20103394A MY 150334 A MY150334 A MY 150334A
Authority
MY
Malaysia
Prior art keywords
soldering
composition
wicking
flux
polymer
Prior art date
Application number
MYPI2010003394A
Inventor
Ryo Hirabayashi
Fusae Ishiwata
Original Assignee
Agc Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Seimi Chemical Co Ltd filed Critical Agc Seimi Chemical Co Ltd
Publication of MY150334A publication Critical patent/MY150334A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C08F220/24—Esters containing halogen containing perhaloalkyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Abstract

PROVIDED IS A COMPOSITION FOR PREVENTING WICKING OF A SOLDERING FLUX WHICH HAS A FLUX WICKING PREVENTION EFFECT COMPARABLE TO THAT OF A CONVENTIONAL FLUX WICKING INHIBITOR INCLUDING A POLYMER CONTAINING A POLYFLUOROALKYL GROUP WITH A CARBON NUMBER OF 8 OR MORE AND, AT THE SAME TIME, SIGNIFICANTLY REDUCES BIOLOGICAL AND ENVIRONMENTAL RISKS. THE COMPOSITION FOR PREVENTING WICKING OF A SOLDERING FLUX INCLUDES A POLYMER HAVING AT LEAST ONE REPEATING UNIT (A) AS A (METH) ACRYLATE CONTAINING A PERFLUOROALKYL GROUP WITH A CARBON NUMBER OF 6 OR LESS AND AT LEAST ONE REPEATING UNIT (B) DERIVED FROM AN UNSATURATED COMPOUND CONTAINING A HYDROXY GROUP, WITH THE WEIGHT-AVERAGE MOLECULAR WEIGHT OF THE POLYMER BEING 150,000 OR MORE (POLYMETHYL METHACRYLATE STANDARDS).
MYPI2010003394A 2008-01-18 2008-11-25 Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance MY150334A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008008923 2008-01-18

Publications (1)

Publication Number Publication Date
MY150334A true MY150334A (en) 2013-12-31

Family

ID=40885200

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003394A MY150334A (en) 2008-01-18 2008-11-25 Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance

Country Status (4)

Country Link
JP (1) JP5295131B2 (en)
CN (1) CN101952082B (en)
MY (1) MY150334A (en)
WO (1) WO2009090798A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101730676B1 (en) * 2009-08-20 2017-04-26 에이지씨 세이미 케미칼 가부시키가이샤 Fluoroalkyl group-containing n-substituted(meth)acrylamide compound, polymer thereof, and use thereof
CN102782105A (en) * 2010-02-26 2012-11-14 阿尔卑斯电气株式会社 Surface treating agent for electrical contacts
JP4947244B2 (en) * 2010-06-02 2012-06-06 Ｄｉｃ株式会社 Cationic polymerizable composition, adhesive containing the same, and cured product and polarizing plate obtained using the same
CN108250338B (en) * 2017-12-27 2020-11-20 兰州大学 Polymer with anti-creep property and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516148B2 (en) * 1993-12-28 2004-04-05 大日本インキ化学工業株式会社 How to prevent flux from entering electronic components
JP3529489B2 (en) * 1995-05-12 2004-05-24 千住金属工業株式会社 Flux bleeding inhibitor for soldering
JPH1133708A (en) * 1997-07-15 1999-02-09 Seimi Chem Co Ltd Soldering flux climb preventive, its composition, and application
DE69806007T2 (en) * 1997-07-15 2002-11-28 Seimi Chem Kk COMPOSITION FOR AVOIDING CREAM OF A SOFT SOLDER
JP4343354B2 (en) * 1999-11-02 2009-10-14 Ａｇｃセイミケミカル株式会社 Solder flux creeping-up inhibitor composition and its use
JP5124441B2 (en) * 2006-03-01 2013-01-23 Ａｇｃセイミケミカル株式会社 Solder flux scooping prevention composition

Also Published As

Publication number Publication date
CN101952082A (en) 2011-01-19
CN101952082B (en) 2013-03-13
JPWO2009090798A1 (en) 2011-05-26
WO2009090798A1 (en) 2009-07-23
JP5295131B2 (en) 2013-09-18

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