MY148116A - Cleaning method for removing post via etch residue - Google Patents
Cleaning method for removing post via etch residueInfo
- Publication number
- MY148116A MY148116A MYPI20095611A MY148116A MY 148116 A MY148116 A MY 148116A MY PI20095611 A MYPI20095611 A MY PI20095611A MY 148116 A MY148116 A MY 148116A
- Authority
- MY
- Malaysia
- Prior art keywords
- etch residue
- via etch
- post via
- removing post
- cleaning method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
THE PRESENT INVENTION RELATES GENERALLY TO A METHOD FOR EFFECTIVELY REMOVING POST VIA ETCH RESIDUE(1) INCLUDING FLUORINATED BY-PRODUCT (12) AND HENCE ENHANCES FUNCTIONAL PRODUCT YIELD BY FIRST TREATING THE ETCHED WAFER WITH A PRELIMINARY SOLVENT CLEANING TREATMENT (4) PRIOR TO CONVENTIONAL PLASMA RESIST STRIPPING TREATMENT (6) AND THEREAFTER A SUBSEQUENT SOLVENT CLEANING TREATMENT (8).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20095611 MY148116A (en) | 2009-12-28 | 2009-12-28 | Cleaning method for removing post via etch residue |
PCT/MY2010/000252 WO2011081512A2 (en) | 2009-12-28 | 2010-11-08 | Cleaning method for removing post via etch residue |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20095611 MY148116A (en) | 2009-12-28 | 2009-12-28 | Cleaning method for removing post via etch residue |
Publications (1)
Publication Number | Publication Date |
---|---|
MY148116A true MY148116A (en) | 2013-02-28 |
Family
ID=44227087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20095611 MY148116A (en) | 2009-12-28 | 2009-12-28 | Cleaning method for removing post via etch residue |
Country Status (2)
Country | Link |
---|---|
MY (1) | MY148116A (en) |
WO (1) | WO2011081512A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110957261B (en) * | 2018-09-26 | 2022-11-01 | 长鑫存储技术有限公司 | Preparation method of semiconductor device interconnection structure barrier layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH076942A (en) * | 1991-09-30 | 1995-01-10 | Fujitsu Ltd | Manufacture of semiconductor device |
EP1511072A3 (en) * | 2003-08-26 | 2006-02-22 | Texas Instruments Incorporated | Post-etch clean process for porous low dielectric constant materials |
KR100584498B1 (en) * | 2003-12-31 | 2006-05-29 | 동부일렉트로닉스 주식회사 | Method for removing photoresist pattern |
US8007194B2 (en) * | 2006-07-05 | 2011-08-30 | Wheeler Ronald Keith | Car washing appliance |
-
2009
- 2009-12-28 MY MYPI20095611 patent/MY148116A/en unknown
-
2010
- 2010-11-08 WO PCT/MY2010/000252 patent/WO2011081512A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011081512A3 (en) | 2011-08-18 |
WO2011081512A2 (en) | 2011-07-07 |
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