MY148116A - Cleaning method for removing post via etch residue - Google Patents

Cleaning method for removing post via etch residue

Info

Publication number
MY148116A
MY148116A MYPI20095611A MY148116A MY 148116 A MY148116 A MY 148116A MY PI20095611 A MYPI20095611 A MY PI20095611A MY 148116 A MY148116 A MY 148116A
Authority
MY
Malaysia
Prior art keywords
etch residue
via etch
post via
removing post
cleaning method
Prior art date
Application number
Inventor
Hazian Bin Mamat
Adzmir Bin Abd Latif
Mazlin Bin Man
Zaliha Binti Mohamad
Azlina Binti Mohd Zain
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Priority to MYPI20095611 priority Critical patent/MY148116A/en
Priority to PCT/MY2010/000252 priority patent/WO2011081512A2/en
Publication of MY148116A publication Critical patent/MY148116A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

THE PRESENT INVENTION RELATES GENERALLY TO A METHOD FOR EFFECTIVELY REMOVING POST VIA ETCH RESIDUE(1) INCLUDING FLUORINATED BY-PRODUCT (12) AND HENCE ENHANCES FUNCTIONAL PRODUCT YIELD BY FIRST TREATING THE ETCHED WAFER WITH A PRELIMINARY SOLVENT CLEANING TREATMENT (4) PRIOR TO CONVENTIONAL PLASMA RESIST STRIPPING TREATMENT (6) AND THEREAFTER A SUBSEQUENT SOLVENT CLEANING TREATMENT (8).
MYPI20095611 2009-12-28 2009-12-28 Cleaning method for removing post via etch residue MY148116A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI20095611 MY148116A (en) 2009-12-28 2009-12-28 Cleaning method for removing post via etch residue
PCT/MY2010/000252 WO2011081512A2 (en) 2009-12-28 2010-11-08 Cleaning method for removing post via etch residue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20095611 MY148116A (en) 2009-12-28 2009-12-28 Cleaning method for removing post via etch residue

Publications (1)

Publication Number Publication Date
MY148116A true MY148116A (en) 2013-02-28

Family

ID=44227087

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20095611 MY148116A (en) 2009-12-28 2009-12-28 Cleaning method for removing post via etch residue

Country Status (2)

Country Link
MY (1) MY148116A (en)
WO (1) WO2011081512A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110957261B (en) * 2018-09-26 2022-11-01 长鑫存储技术有限公司 Preparation method of semiconductor device interconnection structure barrier layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH076942A (en) * 1991-09-30 1995-01-10 Fujitsu Ltd Manufacture of semiconductor device
EP1511072A3 (en) * 2003-08-26 2006-02-22 Texas Instruments Incorporated Post-etch clean process for porous low dielectric constant materials
KR100584498B1 (en) * 2003-12-31 2006-05-29 동부일렉트로닉스 주식회사 Method for removing photoresist pattern
US8007194B2 (en) * 2006-07-05 2011-08-30 Wheeler Ronald Keith Car washing appliance

Also Published As

Publication number Publication date
WO2011081512A3 (en) 2011-08-18
WO2011081512A2 (en) 2011-07-07

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