MY143881A - Fabrication method of a micromechanical device - Google Patents
Fabrication method of a micromechanical deviceInfo
- Publication number
- MY143881A MY143881A MYPI20071932A MYPI20071932A MY143881A MY 143881 A MY143881 A MY 143881A MY PI20071932 A MYPI20071932 A MY PI20071932A MY PI20071932 A MYPI20071932 A MY PI20071932A MY 143881 A MY143881 A MY 143881A
- Authority
- MY
- Malaysia
- Prior art keywords
- layer
- dielectric layer
- micromechanical device
- conductive layer
- fabrication method
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Abstract
FABRICATION METHOD OF A MICROMECHANICAL DEVICE 5 A METHOD FOR FABRICATING A MICROMECHANICAL DEVICE COMPRISES THE STEPS OF PROVIDING A SUBSTRATE HAVING A FIRST DIELECTRIC LAYER ON TOP SURFACE OF SAID SUBSTRATE, A BOTTOM CONDUCTIVE LAYER ON TOP SURFACE OF SAID FIRST DIELECTRIC LAYER, A SECOND DIELECTRIC LAYER ON SAID BOTTOM CONDUCTIVE LAYER, A 0 SACRIFICIAL LAYER ON SAID SECOND DIELECTRIC LAYER, A THIRD DIELECTRIC LAYER ON SAID SACRIFICIAL LAYER, AND A TOP CONDUCTIVE LAYER ON SAID THIRD DIELECTRIC LAYER, ETCHING A PLURALITY OF HOLES AT SAID TOP CONDUCTIVE LAYER, THEN AT SAID THIRD DIELECTRIC LAYER AND SAID SACRIFICIAL LAYER, AND SEALING 5 SAID ETCHED HOLES OF SAID TOP CONDUCTIVE LAYER AND THIRD DIELECTRIC LAYER BY DEPOSITING A FOURTH DIELECTRIC LAYER ON TOP OF SAID TOP CONDUCTIVE LAYER. MOST ILLUSTRATIVE DIAGRAM:
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20071932A MY143881A (en) | 2007-11-07 | 2007-11-07 | Fabrication method of a micromechanical device |
PCT/MY2008/000128 WO2009061168A1 (en) | 2007-11-07 | 2008-11-06 | Fabrication method of a micromechanical device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20071932A MY143881A (en) | 2007-11-07 | 2007-11-07 | Fabrication method of a micromechanical device |
Publications (1)
Publication Number | Publication Date |
---|---|
MY143881A true MY143881A (en) | 2011-07-15 |
Family
ID=40625958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20071932A MY143881A (en) | 2007-11-07 | 2007-11-07 | Fabrication method of a micromechanical device |
Country Status (2)
Country | Link |
---|---|
MY (1) | MY143881A (en) |
WO (1) | WO2009061168A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2481425A (en) | 2010-06-23 | 2011-12-28 | Iti Scotland Ltd | Method and device for assembling polynucleic acid sequences |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69922727T2 (en) * | 1998-03-31 | 2005-12-15 | Hitachi, Ltd. | Capacitive pressure transducer |
WO2004037711A2 (en) * | 2002-10-23 | 2004-05-06 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
JP4724488B2 (en) * | 2005-02-25 | 2011-07-13 | 日立オートモティブシステムズ株式会社 | Integrated microelectromechanical system |
-
2007
- 2007-11-07 MY MYPI20071932A patent/MY143881A/en unknown
-
2008
- 2008-11-06 WO PCT/MY2008/000128 patent/WO2009061168A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2009061168A1 (en) | 2009-05-14 |
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