MY143265A - Integrated getter for vacuum or inert gas packaged leds - Google Patents

Integrated getter for vacuum or inert gas packaged leds

Info

Publication number
MY143265A
MY143265A MYPI20051690A MY143265A MY 143265 A MY143265 A MY 143265A MY PI20051690 A MYPI20051690 A MY PI20051690A MY 143265 A MY143265 A MY 143265A
Authority
MY
Malaysia
Prior art keywords
vacuum
inert gas
packaged leds
getter
integrated getter
Prior art date
Application number
Inventor
Marco Amiotti
Ronald O Petersen
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Publication of MY143265A publication Critical patent/MY143265A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A TECHNIQUE FOR CONTROLLING AN ATMOSPHERE WITHIN AN ENCLOSURE INVOLVES PROVIDING A GETTER WITHIN THE ATMOSPHERE OF THE ENCLOSURE. AN LED MANUFACTURED ACCORDING TO THE TECHNIQUE MAY INCLUDE A GETTER WITHIN AN ENCLOSED VOLUME OF THE LED DEVICE.
MYPI20051690 2004-04-15 2005-04-15 Integrated getter for vacuum or inert gas packaged leds MY143265A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56289904P 2004-04-15 2004-04-15

Publications (1)

Publication Number Publication Date
MY143265A true MY143265A (en) 2011-04-15

Family

ID=38113185

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051690 MY143265A (en) 2004-04-15 2005-04-15 Integrated getter for vacuum or inert gas packaged leds

Country Status (3)

Country Link
CN (1) CN100589226C (en)
MY (1) MY143265A (en)
TW (1) TWI373854B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102820411B (en) * 2009-02-19 2016-08-24 光宝电子(广州)有限公司 Light-emitting diode chip for backlight unit, preparation method and method for packing
CN102484203B (en) * 2009-06-01 2017-02-15 住友化学株式会社 Formulations for improved electrodes for electronic devices
CN102237319A (en) * 2010-04-23 2011-11-09 三星半导体(中国)研究开发有限公司 Package
CN102244178A (en) * 2010-05-14 2011-11-16 展晶科技(深圳)有限公司 Encapsulation structure of LED (light emitting diode)
US9161396B2 (en) * 2010-09-28 2015-10-13 Koninklijke Philips N.V. Light-emitting arrangement
CN103050603B (en) * 2011-10-17 2016-03-23 展晶科技(深圳)有限公司 The manufacture method of LED encapsulation structure
US9666556B2 (en) 2015-06-29 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Flip chip packaging
CN107346859A (en) * 2017-07-26 2017-11-14 江苏舒适照明有限公司 A kind of preparation method of white light source
WO2019052194A1 (en) * 2017-09-13 2019-03-21 厦门三安光电有限公司 Method for die-bonding semiconductor element and semiconductor element

Also Published As

Publication number Publication date
CN100589226C (en) 2010-02-10
CN1973355A (en) 2007-05-30
TW200539487A (en) 2005-12-01
TWI373854B (en) 2012-10-01

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