MY140052A - Ultra-thin micro lead frame package - Google Patents
Ultra-thin micro lead frame packageInfo
- Publication number
- MY140052A MY140052A MYPI20021302A MY140052A MY 140052 A MY140052 A MY 140052A MY PI20021302 A MYPI20021302 A MY PI20021302A MY 140052 A MY140052 A MY 140052A
- Authority
- MY
- Malaysia
- Prior art keywords
- lead frame
- ultra
- package
- thin micro
- frame package
- Prior art date
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
THE PRESENT INVENTION GENERALLY RELATES TO AN INTEGRATED CIRCUIT PACKAGE, MORE SPECIFICALLY TO AN ULTRA- THIN MICRO LEAD FRAME PACKAGE (UT-MLP). THE UT-MLP COMPRISES A LEAD FRAME (2.1) HAVING A DIE PAD (2.2) AND A PLURALITY OF LEADS (2.3). A SILICON DIE (2.4) ATTACHED TO THE DIE PAD (2.2) AND A PLURALITY OF BOND WIRE (2.5) CONNECT THE SILICON DIE (2.4) TO THE PLURALITY OF LEADS (2.3). TO COMPLETE THE PACKAGE A PLASTIC ENCAPSULATION (2.6) IS APPLIED TO THE LEAD FRAME (2.1). TO KEEP HEIGHT TO A MINIMUM THE PLASTIC ENCAPSULATION (2.6) IS APPLIED TO ONE SIDE OF THE LEAD FRAME (2.1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20021302 MY140052A (en) | 2002-04-10 | 2002-04-10 | Ultra-thin micro lead frame package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20021302 MY140052A (en) | 2002-04-10 | 2002-04-10 | Ultra-thin micro lead frame package |
Publications (1)
Publication Number | Publication Date |
---|---|
MY140052A true MY140052A (en) | 2009-11-30 |
Family
ID=45699682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20021302 MY140052A (en) | 2002-04-10 | 2002-04-10 | Ultra-thin micro lead frame package |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY140052A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8674488B2 (en) | 2010-11-02 | 2014-03-18 | Carsem (M) Sdn. Bhd. | Light emitting diode (LED) packages |
-
2002
- 2002-04-10 MY MYPI20021302 patent/MY140052A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8674488B2 (en) | 2010-11-02 | 2014-03-18 | Carsem (M) Sdn. Bhd. | Light emitting diode (LED) packages |
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