MY136631A - A semiconductor package and a leadframe therefor - Google Patents

A semiconductor package and a leadframe therefor

Info

Publication number
MY136631A
MY136631A MYPI9900427A MY136631A MY 136631 A MY136631 A MY 136631A MY PI9900427 A MYPI9900427 A MY PI9900427A MY 136631 A MY136631 A MY 136631A
Authority
MY
Malaysia
Prior art keywords
semiconductor package
leadframe
semiconductor die
flag portion
therefor
Prior art date
Application number
Inventor
Saat Shukri Embong
Tan Aik Chong
Chew Chee Hiong
Original Assignee
Semiconductor Components Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Ind filed Critical Semiconductor Components Ind
Priority to MYPI9900427 priority Critical patent/MY136631A/en
Publication of MY136631A publication Critical patent/MY136631A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

A SEMICONDUCTOR PACKAGE (50) COMPRISES A LEADFRAME (56) WITH A CENTRAL FLAG PORTION (54) ON WHICH A SEMICONDUCTOR DIE (52) IS DISPOSED. ENDS OF FLAT CLIPS (62) ARE SOLDERED TO SOLDER PADS (60) ON THE SEMICONDUCTOR DIE (52), AND ON FREE ENDS (61) OF PREFORMED LEAD PORTIONS (58) THAT SURROUND THE FLAG PORTION (54). THE SEMICONDUCTOR DIE (52), THE CLIPS (62), THE FREE ENDS (61), AND ALL BUT A LOWER SURFACE OF THE FLAG PORTION (54) ARE ENCAPSULATED IN MOULD COMPOUND (66) TO FORM THE SEMICONDUCTOR PACKAGE (50) HAVING AN OUTLINE (68), WHICH IS THEN SINGULATED FROM THE LEAD FRAME (56).FIG. 5 AND 6
MYPI9900427 1999-02-08 1999-02-08 A semiconductor package and a leadframe therefor MY136631A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI9900427 MY136631A (en) 1999-02-08 1999-02-08 A semiconductor package and a leadframe therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI9900427 MY136631A (en) 1999-02-08 1999-02-08 A semiconductor package and a leadframe therefor

Publications (1)

Publication Number Publication Date
MY136631A true MY136631A (en) 2008-11-28

Family

ID=45893860

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9900427 MY136631A (en) 1999-02-08 1999-02-08 A semiconductor package and a leadframe therefor

Country Status (1)

Country Link
MY (1) MY136631A (en)

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