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Application filed by Electro Scient Ind IncfiledCriticalElectro Scient Ind Inc
Priority to MYPI20002185priorityCriticalpatent/MY136000A/en
Publication of MY136000ApublicationCriticalpatent/MY136000A/en
Testing Of Individual Semiconductor Devices
(AREA)
Abstract
TO FACILITIES THE TESTING OF SMALL ELECTRONIC COMPONENTS, AN IMPROVED TEST PROBE AND TRANSPORT WHEEL (8) ASSEMBLY ARE DISCLOSED. THE BASIC FORM OF THE PROBE FEATURES A FIXED SUPPORT BODY (84) ONTO WHICH A MOVABLE BASE (78) IS SECURED BY AT LEAST ONE RESILIENT STRUCTURE. SECURED TO THE MOVABLE BASE (78) ARE A NUMBER OF LEADS (66) THAT MAY BE MOVED THROUGH COMPLEMENTARY TUNNELS IN A FIXED GUIDE BLOCK (94) TOWARD THE SIDE-LOCATED TERMINALS OF AN ELECTRONIC COMPONENT TO BE TESTED. THE TRANSPORT WHEEL (8) ASSEMBLY INCLUDES WHEEL (8) THAT HAS A NUMBER OF PERIPHERALLY-LOCATED COMPARTMENTS FOR RECEIVING THE ELECTRONIC COMPONENTS. EACH OF THE COMPARTMENTS INCLUDES A METAL BASE. ALSO DISCLOSED IS A METAL ROLLER (96) THAT IS DESIGNED TO PRESS ON AN END OF A COMPONENT DURING TESTING. THE METAL BASE OF EACH COMPARTMENT AND THE METAL ROLLER (96) FACILITATE ELECTRICAL CONNECTION TO THE COMPONENT''S END-LOCATED TERMINALS BY SIDE-LOCATED LEADS FROM THE TEST PROBE.(FIG 1)
MYPI200021852000-05-192000-05-19Apparatus for testing multi-terminal electronic components
MY136000A
(en)
Testing apparatus of prepackage singulated semiconductor die, has test unit in movable communication with electrical contact pad to make electrical contact with contact pad during testing of die