MY135978A - Polishing pad, conditioner and method for polishing the same - Google Patents

Polishing pad, conditioner and method for polishing the same

Info

Publication number
MY135978A
MY135978A MYPI20035022A MYPI20035022A MY135978A MY 135978 A MY135978 A MY 135978A MY PI20035022 A MYPI20035022 A MY PI20035022A MY PI20035022 A MYPI20035022 A MY PI20035022A MY 135978 A MY135978 A MY 135978A
Authority
MY
Malaysia
Prior art keywords
polishing
conditioner
polishing pad
same
pad
Prior art date
Application number
MYPI20035022A
Inventor
Kim Jae Seok
Kim Geon
Kim Sung Min
Lee Ju Yeol
Lee Jong Myung
Lee Hyun Woo
Park In Ha
Song Eu Gene
Original Assignee
Skc Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skc Co Ltd filed Critical Skc Co Ltd
Publication of MY135978A publication Critical patent/MY135978A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

THE PRESENT INVENTION RELATES TO A POLISHING PAD FOR PERFORMING EFFECTIVE POLISHING AND CONDITIONING IN A CHEMICAL MECHANICAL POLISHING (HEREINAFTER REFERRED TO AS 'CMP'), A CONDITIONER SUITABLE FOR THE POLISHING PAD, AND A CMP PROCESS USING THE POLISHING PAD AND THE CONDITIONER.(FIG 2)
MYPI20035022A 2002-12-28 2003-12-29 Polishing pad, conditioner and method for polishing the same MY135978A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20020085855 2002-12-28
KR1020030095949A KR100666726B1 (en) 2002-12-28 2003-12-24 CMP Process Conditioner and methods for polishing using the same

Publications (1)

Publication Number Publication Date
MY135978A true MY135978A (en) 2008-07-31

Family

ID=32677805

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20035022A MY135978A (en) 2002-12-28 2003-12-29 Polishing pad, conditioner and method for polishing the same

Country Status (4)

Country Link
KR (1) KR100666726B1 (en)
AU (1) AU2003289525A1 (en)
MY (1) MY135978A (en)
WO (1) WO2004059715A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1715980B1 (en) 2004-02-17 2011-05-18 SKC Co., Ltd. Base pad polishing pad and multi-layer pad comprising the same
CN115594823A (en) * 2022-10-12 2023-01-13 中环领先半导体材料有限公司（Cn） Novel formula of notch polishing pad

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4591980B2 (en) * 2000-02-22 2010-12-01 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
JP2001246552A (en) * 2000-03-02 2001-09-11 Jsr Corp Abrasive pad
DE60109601T2 (en) * 2000-05-27 2006-02-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington RILLEN POLISHING PILLOWS FOR CHEMICAL-MECHANICAL PLANARIZATION
CN1224499C (en) * 2000-12-01 2005-10-26 东洋橡膠工业株式会社 Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad

Also Published As

Publication number Publication date
KR100666726B1 (en) 2007-01-09
KR20040060754A (en) 2004-07-06
WO2004059715A1 (en) 2004-07-15
AU2003289525A1 (en) 2004-07-22

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