MY135679A - Method and system of automatic fluid dispensing for imprint lithography processes - Google Patents

Method and system of automatic fluid dispensing for imprint lithography processes

Info

Publication number
MY135679A
MY135679A MYPI20030077A MY135679A MY 135679 A MY135679 A MY 135679A MY PI20030077 A MYPI20030077 A MY PI20030077A MY 135679 A MY135679 A MY 135679A
Authority
MY
Malaysia
Prior art keywords
substrate
imprint lithography
lithography processes
fluid dispensing
automatic fluid
Prior art date
Application number
Inventor
Choi Byung Jin
Colburn Matthew
S V Sreeni-Vasan
Bailey Todd
Willson C Grant
Eckerdt John
Original Assignee
Univ Texas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Texas filed Critical Univ Texas
Priority to MYPI20030077 priority Critical patent/MY135679A/en
Publication of MY135679A publication Critical patent/MY135679A/en

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

DISCLOSED HEREIN IS AN AUTOMATIC FLUID DISPENSING METHOD AND SYSTEM FOR DISPENSING FLUID ON THE SURFACE OF PLATE-LIKE MATERIAL, OR SUBSTRATE(20), INCLUDING A SEMICONDUCTOR WAFER FOR IMPRINT LITHOGRAPHY PROCESSES. THE DISPENSING METHOD USES FLUID DISPENSER AND A SUBSTRATE STAGE THAT MAY GENERATE RELATIVE LATERAL MOTIONS BETWEEN A FLUID DISPENSER TIP (1001;1002) AND A SUBSTRATE. ALSO DESCRIBED HEREIN ARE METHODS AND DEVICES FOR CREATING A PLANAR SURFACE ON A SUBSTRATE(20) USING A SUBSTANTIALLY UNPATTERNED PLANAR TEMPLATE(12).FIG. 11
MYPI20030077 2003-01-10 2003-01-10 Method and system of automatic fluid dispensing for imprint lithography processes MY135679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20030077 MY135679A (en) 2003-01-10 2003-01-10 Method and system of automatic fluid dispensing for imprint lithography processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20030077 MY135679A (en) 2003-01-10 2003-01-10 Method and system of automatic fluid dispensing for imprint lithography processes

Publications (1)

Publication Number Publication Date
MY135679A true MY135679A (en) 2008-06-30

Family

ID=45879165

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20030077 MY135679A (en) 2003-01-10 2003-01-10 Method and system of automatic fluid dispensing for imprint lithography processes

Country Status (1)

Country Link
MY (1) MY135679A (en)

Similar Documents

Publication Publication Date Title
WO2002006902A3 (en) Method and system of automatic fluid dispensing for imprint lithography processes
WO2003028048A3 (en) Low-force electrochemical mechanical processing method and apparatus
MY143956A (en) Controls of ambient environment during wafer drying using proximity head
AU2001249659A1 (en) Method of forming vias in silicon carbide and resulting devices and circuits
TW200707632A (en) Semiconductor device and forming method thereof
ATE268217T1 (en) DEVICE FOR APPLYING THIN LAYERS
TWI266970B (en) Scatterometry alignment for imprint lithography
WO2000045421A3 (en) Wafer edge engineering method and device
WO2005064405A3 (en) Lithographic apparatus and device manufacturing method
WO2002079876A3 (en) Lithographic template
TWI329360B (en) Semiconductor device production method and semiconductor device
MY122784A (en) Abrasive article suitable for modifying a semiconductor wafer
MY112147A (en) Process and apparatus for etching semiconductor wafers
MY163666A (en) Apparatus and method for processing a substrate
MY154538A (en) Imprint lithography templates having alignment marks
EP0877413A3 (en) Method and apparatus for selectively marking a semiconductor wafer
TW200633045A (en) Method of polishing GaN substrate
WO2003038888A3 (en) Method and apparatus for cascade control using integrated metrology
DE59707533D1 (en) METHOD AND DEVICE FOR DRYING SUBSTRATES
TW200515498A (en) Coating film forming apparatus and coating film forming method
AU2003281895A1 (en) Method and apparatus for control of layer thicknesses
TWI367245B (en) Method for laser marking the inactive surface of a semiconductor silicon die or wafer
GB2375883A (en) A method and apparatus for implanting semiconductor wafer substrates
TW347555B (en) Trench scribe line for decreased chip spacing
DK1350863T3 (en) Apparatus and method for directional application of deposition material to a substrate