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Priority claimed from US09/628,705external-prioritypatent/US6970362B1/en
Priority claimed from US09/631,037external-prioritypatent/US6611419B1/en
Application filed by Intel CorpfiledCriticalIntel Corp
Publication of MY133591ApublicationCriticalpatent/MY133591A/en
Fixed Capacitors And Capacitor Manufacturing Machines
(AREA)
Abstract
TO REDUCE SWITCHING NOISE, THE POWER SUPPLY TERMINALS OF AN INTEGRATED CIRCUIT DIE (300) CAN BE COUPLED TO THE RESPECTIVE TERMINALS OF AT LEAST ONE EMBEDDED CAPACITOR (330) IN A MULTILAYER CERAMIC SUBSTRATE. IN ONE EMBODIMENT, THE CAPACITOR (330) IS FORMED OF AT LEAST ONE HIGH PERMITTIVITY LAYER (340). IN ANOTHER EMBODIMENT, SEVERAL HIGH PERMITTIVITY LAYERS ARE INTERLEAVED WITH CONDUCTIVE LAYERS. ALTERNATIVELY, THE CAPACITOR CAN COMPRISES AT LEAST ONE EMBEDDED DISCRETE CAPACITOR.ALSO DESCRIBED ARE AN ELECTRONIC SYSTEM, A DATA PROCESSING SYSTEM, AND VARIOUS METHODS OF MANUFACTURE.(FIG 3)
MYPI200130212000-07-312001-06-26Electronic assembly comprising substrate with embedded capacitors
MY133591A
(en)