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Application filed by Shinetsu Handotai KkfiledCriticalShinetsu Handotai Kk
Publication of MY132239ApublicationCriticalpatent/MY132239A/en
A SEMICONDUCTOR WAFER POLISHING AGENT CONTAINS MAINLY A SILICA CONTAINING POLISHING AGENT AND IS ADDED WITH A POLYOLEFIN TYPE FINE PARTICLE MATERIAL. THE NOVEL SEMICONDUCTOR WAFER POLISHING AGENT IS CAPABLE OF LOW BRIGHTNESS POLISHING TO THE BACK FACE OF THE WAFER, SENSOR DETECTION OF THE FRONT AND BACK FACES OF THE WAFER, AND SUPPRESSION OF DUST TO BE GENERATED BY CHIPPING OF THE BACK FACE OF THE WAFER, THEREBY TO INCREASE THE YIELD OF SEMICONDUCTOR DEVICES. A POLISHING METHOD USING THE POLISHING AGENT AND A NOVEL SEMICONDUCTOR WAFER HAVING A BACK FACE WITH AN UNCONVENTIONAL SURFACE SHAPE ARE ALSO DISCLOSED.
MYPI96025291995-06-231996-06-21Polishing agent used for polishing semiconductor wafers and polishing method using the same
MY132239A
(en)