MY132239A - Polishing agent used for polishing semiconductor wafers and polishing method using the same - Google Patents

Polishing agent used for polishing semiconductor wafers and polishing method using the same

Info

Publication number
MY132239A
MY132239A MYPI9602529A MY132239A MY 132239 A MY132239 A MY 132239A MY PI9602529 A MYPI9602529 A MY PI9602529A MY 132239 A MY132239 A MY 132239A
Authority
MY
Malaysia
Prior art keywords
polishing
wafer
polishing agent
same
agent used
Prior art date
Application number
Inventor
Hisashi Masumura
Kiyoshi Suzuki
Hideo Kudo
Teruaki Fukami
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY132239A publication Critical patent/MY132239A/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A SEMICONDUCTOR WAFER POLISHING AGENT CONTAINS MAINLY A SILICA CONTAINING POLISHING AGENT AND IS ADDED WITH A POLYOLEFIN TYPE FINE PARTICLE MATERIAL. THE NOVEL SEMICONDUCTOR WAFER POLISHING AGENT IS CAPABLE OF LOW BRIGHTNESS POLISHING TO THE BACK FACE OF THE WAFER, SENSOR DETECTION OF THE FRONT AND BACK FACES OF THE WAFER, AND SUPPRESSION OF DUST TO BE GENERATED BY CHIPPING OF THE BACK FACE OF THE WAFER, THEREBY TO INCREASE THE YIELD OF SEMICONDUCTOR DEVICES. A POLISHING METHOD USING THE POLISHING AGENT AND A NOVEL SEMICONDUCTOR WAFER HAVING A BACK FACE WITH AN UNCONVENTIONAL SURFACE SHAPE ARE ALSO DISCLOSED.
MYPI9602529 1995-06-23 1996-06-21 Polishing agent used for polishing semiconductor wafers and polishing method using the same MY132239A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18113007 1995-06-23

Publications (1)

Publication Number Publication Date
MY132239A true MY132239A (en) 2007-09-28

Family

ID=47290152

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9602529 MY132239A (en) 1995-06-23 1996-06-21 Polishing agent used for polishing semiconductor wafers and polishing method using the same

Country Status (1)

Country Link
MY (1) MY132239A (en)

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