MY128632A - Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture - Google Patents

Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture

Info

Publication number
MY128632A
MY128632A MYPI20013690A MYPI20013690A MY128632A MY 128632 A MY128632 A MY 128632A MY PI20013690 A MYPI20013690 A MY PI20013690A MY PI20013690 A MYPI20013690 A MY PI20013690A MY 128632 A MY128632 A MY 128632A
Authority
MY
Malaysia
Prior art keywords
ceramic
manufacture
organic
substrate
methods
Prior art date
Application number
MYPI20013690A
Inventor
Kishore K Chakravorty
Paul H Wermer
David G Figueroa
Gupta Debabrata
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of MY128632A publication Critical patent/MY128632A/en

Links

Classifications

    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H10W70/655—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

TO REDUCE SWITCHING NOISE, THE POWER SUPPLY TERMINALS OF AN INTEGRATED CIRCUIT DIE (60) ARE COUPLED TO THE RESPECTIVE TERMINALS OF AT LEAST ONE EMBEDDED CAPACITOR IN A MULTILAYER CERAMIC/ORGANIC HYBRID SUBSTRATE (50). IN ONE EMBODIMENT, A CERAMIC PORTION (90) OF THE SUBSTRATE (50) INCLUDES AT LEAST ONE CAPACITOR FORMED OF A HIGH PERMITTIVITY LAYER SANDWICHED BETWEEN CONDUCTIVE PLANES. AN ORGANIC PORTION (80) OF THE SUBSTRATE INCLUDES SUITABLE ROUTING AND FAN-OUT OF POWER AND SIGNAL CONDUCTORS. THE ORGANIC PORTION (80) INCLUDES A BUILD-UP OF MULTIPLE LAYERS (81-83) OF ORGANIC MATERIAL OVERLYING THE CERAMIC PORTION (90). ALSO DESCRIBED ARE AN ELECTRONIC SYSTEM, A DATA PROCESSING SYSTEM, AND VARIOUS METHODS OF MANUFACTURE.(FIG 3)
MYPI20013690A 2000-08-30 2001-08-06 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture MY128632A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/650,566 US6775150B1 (en) 2000-08-30 2000-08-30 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture

Publications (1)

Publication Number Publication Date
MY128632A true MY128632A (en) 2007-02-28

Family

ID=24609420

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20013690A MY128632A (en) 2000-08-30 2001-08-06 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture

Country Status (6)

Country Link
US (3) US6775150B1 (en)
EP (1) EP1314200A2 (en)
CN (1) CN1284234C (en)
AU (1) AU2001286857A1 (en)
MY (1) MY128632A (en)
WO (1) WO2002019430A2 (en)

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WO2002019430A3 (en) 2002-09-12
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CN1284234C (en) 2006-11-08
US20040238942A1 (en) 2004-12-02
US7120031B2 (en) 2006-10-10
US6775150B1 (en) 2004-08-10
US20060279940A1 (en) 2006-12-14
EP1314200A2 (en) 2003-05-28
CN1401138A (en) 2003-03-05

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