MY124070A - Printed circuit board and method of production thereof - Google Patents
Printed circuit board and method of production thereofInfo
- Publication number
- MY124070A MY124070A MYPI9902439A MY124070A MY 124070 A MY124070 A MY 124070A MY PI9902439 A MYPI9902439 A MY PI9902439A MY 124070 A MY124070 A MY 124070A
- Authority
- MY
- Malaysia
- Prior art keywords
- wiring patterns
- crossing portion
- production
- circuit board
- printed circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A FILET (F) IS ADDED TO A PORTION CONSTITUTING A CORNER PORTION (C) EQUAL TO OR SMALLER THAN 90° IN A CROSSING PORTION (X) OF WIRING PATTERNS (58B, 58C AND 58D), AND A WIRING PATTERN (58) IS FORMED. SINCE THE FILET (F) IS ADDED, THE WIRING PATTERNS ARE NOT MADE THIN AND ARE NOT DISCONNECTED IN THE CROSSING PORTION (X).FURTHER, SINCE THERE IS NO STRESS CONCENTRATED TO THE CROSSING PORTION (X), DISCONNECTION IS NOT CAUSED IN THE WIRING PATTERNS AND NO AIR BUBBLES ARE LEFT BETWEEN THE CROSSING PORTION (X) OF THE WIRING PATTERNS AND AN INTERLAYER RESIN INSULATING LAYER SO THAT RELIABILITY OF A PRINTED WIRING BOARD IS IMPROVED.(FIGURE 12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9472599A JP4197070B2 (en) | 1999-04-01 | 1999-04-01 | Multilayer build-up wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
MY124070A true MY124070A (en) | 2006-06-30 |
Family
ID=14118105
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI0405101 MY144758A (en) | 1999-04-01 | 1999-06-15 | Printed circuit board and method of production thereof |
MYPI9902439 MY124070A (en) | 1999-04-01 | 1999-06-15 | Printed circuit board and method of production thereof |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI0405101 MY144758A (en) | 1999-04-01 | 1999-06-15 | Printed circuit board and method of production thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4197070B2 (en) |
MY (2) | MY144758A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004260133A (en) | 2003-02-04 | 2004-09-16 | Seiko Epson Corp | Wiring board, electro-optical device, manufacturing method thereof and electronic apparatus |
JP2007305653A (en) * | 2006-05-09 | 2007-11-22 | Toppan Printing Co Ltd | Multilayer circuit wiring board and semiconductor device |
JP5223213B2 (en) * | 2007-03-12 | 2013-06-26 | 凸版印刷株式会社 | Multilayer wiring board, semiconductor device package, and electronic equipment |
TWI396474B (en) * | 2007-03-22 | 2013-05-11 | Ngk Spark Plug Co | Method of manufacturing multilayer wiring board |
JP2009094361A (en) * | 2007-10-10 | 2009-04-30 | Nitto Denko Corp | Cof board |
US20130153266A1 (en) * | 2011-12-19 | 2013-06-20 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20130153275A1 (en) | 2011-12-19 | 2013-06-20 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
CN113474853B (en) * | 2019-02-27 | 2023-04-04 | 住友电工印刷电路株式会社 | Printed wiring board and method for manufacturing printed wiring board |
-
1999
- 1999-04-01 JP JP9472599A patent/JP4197070B2/en not_active Expired - Fee Related
- 1999-06-15 MY MYPI0405101 patent/MY144758A/en unknown
- 1999-06-15 MY MYPI9902439 patent/MY124070A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2000294925A (en) | 2000-10-20 |
JP4197070B2 (en) | 2008-12-17 |
MY144758A (en) | 2011-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1083779A4 (en) | Printed circuit board and method of production thereof | |
EP1259103A4 (en) | Multilayer printed wiring board and method for producing multilayer printed wiring board | |
EP0997935A4 (en) | Printed wiring board and method for manufacturing the same | |
MY120077A (en) | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof | |
MY139405A (en) | Printed circuit board and method for its production | |
MY113466A (en) | Multilayer printed wiring board | |
MY148600A (en) | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | |
EP1283662A4 (en) | It laminating double-side circuit board and production method therefor and multi-layer printed circuit board using | |
MY125599A (en) | Printed circuit boards and method of producing the same | |
MY125677A (en) | Multilayer printed circuit board | |
MY109360A (en) | Two-layer of multilayer printed circuit board,vmethod of manufacturing such a printed circuit board,vand laminate for the manufacture of such a printed circuit board by such a method | |
MY108905A (en) | Copper-clad laminate and printed wiring board | |
MY122378A (en) | Method for producing vias in the manufacture of printed circuit boards | |
EP1211920A4 (en) | Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device | |
MY128551A (en) | Printed wiring board and manufacturing method thereof | |
TW200518647A (en) | Printed wiring board and method of manufacturing same | |
MY118245A (en) | Multilayer printed circuit boards | |
TW200520656A (en) | Printed wiring board manufacturing method and printed wiring board | |
TWI264973B (en) | Printed wiring board | |
MY124070A (en) | Printed circuit board and method of production thereof | |
WO2003004262A1 (en) | Laminate and its producing method | |
TW344938B (en) | Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board | |
EP0710062A4 (en) | Multilayer printed wiring board and its manufacture, and transferring plate and its manufacture | |
TW200618707A (en) | Multi-layer printed circuit board layout and manufacturing method thereof | |
MY130361A (en) | Multilayer printed wiring board |