MY114933A - Improvements in or relating to thermal trip arrangements - Google Patents
Improvements in or relating to thermal trip arrangementsInfo
- Publication number
- MY114933A MY114933A MYPI98000099A MYPI9800099A MY114933A MY 114933 A MY114933 A MY 114933A MY PI98000099 A MYPI98000099 A MY PI98000099A MY PI9800099 A MYPI9800099 A MY PI9800099A MY 114933 A MY114933 A MY 114933A
- Authority
- MY
- Malaysia
- Prior art keywords
- varistor
- circuit board
- printed circuit
- solder
- melts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/04—Bases; Housings; Mountings
- H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
- H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
- H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/042—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage comprising means to limit the absorbed power or indicate damaged over-voltage protection device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10643—Disc shaped leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Fuses (AREA)
- Thermistors And Varistors (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Confectionery (AREA)
- Preparation Of Compounds By Using Micro-Organisms (AREA)
Abstract
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
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9700480A GB2321135B (en) | 1997-01-11 | 1997-01-11 | Improvements in or relating to thermal trip arrangements |
Publications (1)
Publication Number | Publication Date |
---|---|
MY114933A true MY114933A (en) | 2003-02-28 |
Family
ID=10805813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI98000099A MY114933A (en) | 1997-01-11 | 1998-01-09 | Improvements in or relating to thermal trip arrangements |
Country Status (10)
Country | Link |
---|---|
US (1) | US6175480B1 (en) |
EP (1) | EP0951807B1 (en) |
CN (1) | CN1176566C (en) |
AU (1) | AU720575B2 (en) |
DE (1) | DE69801482T2 (en) |
ES (1) | ES2163850T3 (en) |
GB (1) | GB2321135B (en) |
HK (1) | HK1011891A1 (en) |
MY (1) | MY114933A (en) |
WO (1) | WO1998031203A1 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3555550B2 (en) * | 1999-06-18 | 2004-08-18 | アンデン株式会社 | Electric circuit device |
US7433169B2 (en) * | 2005-12-15 | 2008-10-07 | Raycap Corporation | Overvoltage protection devices including wafer of varistor material |
US20080036556A1 (en) * | 2006-08-10 | 2008-02-14 | Honeywell International Inc. | Methods and apparatus for installing a feed through filter |
CN101388305B (en) * | 2007-09-13 | 2011-09-07 | 胜德国际研发股份有限公司 | Circuit protecting element and circuit board having the circuit protecting element |
DE102008053182B4 (en) * | 2008-10-24 | 2015-01-08 | Continental Automotive Gmbh | Device with an electronic assembly with thermal fuse |
DE102008057166B4 (en) * | 2008-11-13 | 2020-03-12 | Behr-Hella Thermocontrol Gmbh | Electrical circuit with overtemperature protection |
DE102008061323B3 (en) * | 2008-12-11 | 2010-06-24 | Phoenix Contact Gmbh & Co. Kg | Excess voltage protection unit has a varistor which, on a thermal overload, shifts for separation from the contacts |
GB2466510B (en) * | 2008-12-24 | 2014-03-12 | Pri Ltd | Improving safety in electrical products |
US9670895B2 (en) | 2012-05-07 | 2017-06-06 | Magna Electronics, Inc. | Control device for a vehicle |
US8743525B2 (en) | 2012-06-19 | 2014-06-03 | Raycap Intellectual Property, Ltd | Overvoltage protection devices including wafer of varistor material |
US9476398B2 (en) | 2013-06-03 | 2016-10-25 | Magna Electronics Inc. | Control device for a vehicle |
US9906017B2 (en) | 2014-06-03 | 2018-02-27 | Ripd Research And Ip Development Ltd. | Modular overvoltage protection units |
US9890760B2 (en) | 2014-07-29 | 2018-02-13 | Magna Electronics Inc. | Control device for a vehicle |
CN105914700B (en) * | 2015-02-23 | 2018-09-14 | 菲尼克斯电气公司 | It is mountable to the electrical overvoltage protective module and its method of circuit board |
US10151292B2 (en) | 2016-03-23 | 2018-12-11 | Magna Electronics Inc. | Control device with thermal fuse having removable pre-tension element |
US10637229B2 (en) | 2016-09-02 | 2020-04-28 | Magna Electronics Inc. | Electronic fuse module with built in microcontroller and centralized power management bus |
US10319545B2 (en) | 2016-11-30 | 2019-06-11 | Iskra Za{hacek over (s)}{hacek over (c)}ite d.o.o. | Surge protective device modules and DIN rail device systems including same |
US10707678B2 (en) | 2016-12-23 | 2020-07-07 | Ripd Research And Ip Development Ltd. | Overvoltage protection device including multiple varistor wafers |
US10447026B2 (en) | 2016-12-23 | 2019-10-15 | Ripd Ip Development Ltd | Devices for active overvoltage protection |
US10340110B2 (en) | 2017-05-12 | 2019-07-02 | Raycap IP Development Ltd | Surge protective device modules including integral thermal disconnect mechanisms and methods including same |
US10685767B2 (en) | 2017-09-14 | 2020-06-16 | Raycap IP Development Ltd | Surge protective device modules and systems including same |
US11223200B2 (en) | 2018-07-26 | 2022-01-11 | Ripd Ip Development Ltd | Surge protective devices, circuits, modules and systems including same |
EP3709777A1 (en) * | 2019-03-11 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Solder-free component carrier connection using an elastic element, and method |
US11862967B2 (en) | 2021-09-13 | 2024-01-02 | Raycap, S.A. | Surge protective device assembly modules |
US11723145B2 (en) | 2021-09-20 | 2023-08-08 | Raycap IP Development Ltd | PCB-mountable surge protective device modules and SPD circuit systems and methods including same |
US11990745B2 (en) | 2022-01-12 | 2024-05-21 | Raycap IP Development Ltd | Methods and systems for remote monitoring of surge protective devices |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2777039A (en) * | 1954-06-29 | 1957-01-08 | Standard Coil Prod Co Inc | Resistor elements adapted for use in connection with printed circuits |
US2869041A (en) * | 1956-11-08 | 1959-01-13 | Admiral Corp | Mounting means |
US3049647A (en) * | 1958-09-02 | 1962-08-14 | Sylvania Electric Prod | Electrical chassis |
DE1278572B (en) * | 1967-05-26 | 1968-09-26 | Telefunken Patent | Solder attachment for an electrical component |
JPS6017951Y2 (en) * | 1979-12-31 | 1985-05-31 | アルプス電気株式会社 | Resonant circuit structure of tuner device |
DE3277042D1 (en) * | 1981-02-13 | 1987-09-24 | Gen Electric | Zinc oxide varistor with reduced fringe current effects |
US4545929A (en) * | 1981-07-22 | 1985-10-08 | Taiyo Yuden Co., Ltd. | Ceramic materials with a voltage-dependent nonlinear resistance |
DE3319339A1 (en) * | 1982-05-31 | 1983-12-29 | Sharp K.K., Osaka | Driver system for an x-y electrode matrix |
US4486804A (en) * | 1983-03-30 | 1984-12-04 | Northern Telecom Limited | Overload protector for a telephone set |
GB8418779D0 (en) * | 1984-07-24 | 1984-08-30 | Bowthorpe Emp Ltd | Electrical surge protection |
US4711804A (en) * | 1986-07-02 | 1987-12-08 | General Electric Company | Circuit board construction |
US4891789A (en) * | 1988-03-03 | 1990-01-02 | Bull Hn Information Systems, Inc. | Surface mounted multilayer memory printed circuit board |
US5124876A (en) * | 1990-03-22 | 1992-06-23 | Hubbell Incorporated | Multiple outlet receptacle with surge suppression |
DE4026233A1 (en) * | 1990-08-18 | 1992-02-20 | Peter Hiller | CIRCUIT BOARD WITH ELECTRICAL COMPONENTS, ESPECIALLY IN SMD VERSION |
DE9012881U1 (en) * | 1990-09-10 | 1990-11-15 | Dehn + Söhne GmbH + Co KG, 90489 Nürnberg | Arrangement of a varistor in a housing |
JPH04209557A (en) * | 1990-12-06 | 1992-07-30 | Sumitomo Electric Ind Ltd | Mounting system for integrated circuit package |
JP2634351B2 (en) * | 1991-04-23 | 1997-07-23 | 三菱電機株式会社 | Semiconductor device |
JPH0748929B2 (en) * | 1991-10-17 | 1995-05-24 | 三菱マテリアル株式会社 | Surge absorber |
DE4209542C2 (en) * | 1992-03-24 | 1995-07-06 | Roederstein Kondensatoren | Fusible link with spring arm |
US5366935A (en) * | 1994-03-14 | 1994-11-22 | Hubbell Incorporated | Passivating coating for metal oxide varistors |
JPH08250304A (en) * | 1995-03-09 | 1996-09-27 | Nichicon Corp | Overvoltage and overcurrent protective device |
ES2183993T3 (en) * | 1996-03-18 | 2003-04-01 | Krone Gmbh | PRINTED CIRCUIT PLATE AND PROCEDURE FOR ASSEMBLY AND WELDING IN THE EXACT POSITION ELECTRONIC COMPONENTS ON THE SURFACE OF THE PRINTED CIRCUIT PLATE. |
-
1997
- 1997-01-11 GB GB9700480A patent/GB2321135B/en not_active Expired - Fee Related
-
1998
- 1998-01-06 ES ES98900295T patent/ES2163850T3/en not_active Expired - Lifetime
- 1998-01-06 DE DE69801482T patent/DE69801482T2/en not_active Expired - Fee Related
- 1998-01-06 CN CNB98801629XA patent/CN1176566C/en not_active Expired - Fee Related
- 1998-01-06 WO PCT/GB1998/000025 patent/WO1998031203A1/en active IP Right Grant
- 1998-01-06 EP EP98900295A patent/EP0951807B1/en not_active Expired - Lifetime
- 1998-01-06 US US09/341,366 patent/US6175480B1/en not_active Expired - Fee Related
- 1998-01-06 AU AU54906/98A patent/AU720575B2/en not_active Ceased
- 1998-01-09 MY MYPI98000099A patent/MY114933A/en unknown
- 1998-12-09 HK HK98112994A patent/HK1011891A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU5490698A (en) | 1998-08-03 |
AU720575B2 (en) | 2000-06-08 |
GB2321135A (en) | 1998-07-15 |
EP0951807A1 (en) | 1999-10-27 |
CN1242926A (en) | 2000-01-26 |
WO1998031203A1 (en) | 1998-07-16 |
ES2163850T3 (en) | 2002-02-01 |
HK1011891A1 (en) | 1999-07-23 |
GB9700480D0 (en) | 1997-02-26 |
DE69801482T2 (en) | 2002-05-08 |
EP0951807B1 (en) | 2001-08-29 |
CN1176566C (en) | 2004-11-17 |
US6175480B1 (en) | 2001-01-16 |
DE69801482D1 (en) | 2001-10-04 |
GB2321135B (en) | 2001-06-27 |
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