JPH08250304A - Overvoltage and overcurrent protective device - Google Patents

Overvoltage and overcurrent protective device

Info

Publication number
JPH08250304A
JPH08250304A JP4938395A JP4938395A JPH08250304A JP H08250304 A JPH08250304 A JP H08250304A JP 4938395 A JP4938395 A JP 4938395A JP 4938395 A JP4938395 A JP 4938395A JP H08250304 A JPH08250304 A JP H08250304A
Authority
JP
Japan
Prior art keywords
lead wire
ptc thermistor
overvoltage
soldered
thermistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4938395A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
清 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Corp filed Critical Nichicon Corp
Priority to JP4938395A priority Critical patent/JPH08250304A/en
Publication of JPH08250304A publication Critical patent/JPH08250304A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE: To assure no loss by burning even when overvoltage or overcurrent is applied by soldering a lead wire having a spring property to a PTC thermistor device and soldering the other end of the lead wire to a substrate so that force is provided to the spring property of the lead wire as if the PTC thermistor and the lead wire may come apart. CONSTITUTION: Electrodes are formed by nickle plating and tin plating on both sides of a PTC thermistor 1. Spring yellow copper wires 2 and 3 are soldered to these electrodes by a tin-lead eutectic solder 4 (melting point 183 deg.C). When the other end of the lead wire is soldered to a substrate 5, while the PTC thermistor element is given force by the spring property of the lead wire as if it were leaving the thermistor element, the substrate 5 is soldered. This enables the thermistor to be made small and an overvoltage and overcurrent protective device which can quickly shuts off high voltage and large current to be made.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器例えば電話器
の電子交換機等の過電流・過電圧保護装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an overcurrent / overvoltage protection device for electronic equipment such as an electronic exchange of a telephone.

【0002】[0002]

【従来の技術】電話器の電子交換機は,結線のショート
を保護するために正特性サーミスタが用いられている。
一方これら交換機は雷サージによる機器の保護を行うた
め、例えばUL1459に定められた過電圧・過電流に
よる保護も必要とされている。
2. Description of the Related Art An electronic exchange for a telephone uses a positive temperature coefficient thermistor to protect a short circuit in a wire connection.
On the other hand, since these exchanges protect equipment from lightning surges, they also require protection from overvoltage and overcurrent, for example, specified in UL1459.

【0003】UL1459では、例えば600V 40
A 1.5秒、600V 7A 5秒、600V 2.
2A 30分の過電圧・過電流に耐えることが必要とさ
れており、これらの過電圧、過電流に耐えるためには正
特性サーミスタの素子寸法が大きくなりすぎ、素子寸法
を小さくした場合、正特性サーミスタは過電圧・過電流
の電力で焼損するという致命的な欠点があった。
In UL1459, for example, 600V 40
A 1.5 seconds, 600V 7A 5 seconds, 600V 2.
It is required to withstand overvoltage / overcurrent for 2A 30 minutes, and in order to withstand these overvoltage and overcurrent, the element size of the positive temperature coefficient thermistor becomes too large. Had a fatal drawback of being burned by overvoltage and overcurrent power.

【0004】[0004]

【発明が解決しようとする課題】本発明はこれらの過電
圧・過電流が加わった場合でも正特性サーミスタを小型
化出来、且つ過電圧・過電流が加わっても焼損せず、機
器を保護することを目的とするものである。
SUMMARY OF THE INVENTION The present invention aims to protect a device by making it possible to miniaturize a positive temperature coefficient thermistor even when these overvoltages / overcurrents are applied, and not burning even if overvoltages / overcurrents are applied. It is intended.

【0005】[0005]

【課題を解決するための手段】即ち、正特性サーミスタ
素子にバネ性を有するリード線を半田付けし、且つ正特
性サーミスタとリード線とが離間するようにリード線の
バネ性で付勢した状態で当該リード線の他端を基板に半
田付けし、正特性サーミスタが自己発熱して正特性サー
ミスタとリード線を接続した半田を融解させ、リード線
のバネで正特性サーミスタとリード線とが離間すること
により回路を遮断する過電圧・過電流保護装置を提供す
るものである。
That is, a state in which a lead wire having a spring property is soldered to a PTC thermistor element, and the PTC thermistor and the lead wire are urged by the spring property of the lead wire so as to be separated from each other. Then, solder the other end of the lead wire to the board, the PTC thermistor self-heats and melts the solder that connects the PTC thermistor and the lead wire, and separates the PTC thermistor and the lead wire with the spring of the lead wire. The present invention provides an overvoltage / overcurrent protection device that shuts off the circuit by doing so.

【0006】あるいは又、正特性サーミスタ素子に半田
付されたリード線にバネ材を半田付けし、且つリード線
と正特性サーミスタとが離間するようにバネ性を付勢し
た状態でバネ材の他端を基板に半田付けし、正特性サー
ミスタに過電圧・過電流が加わった場合、正特性サーミ
スタが自己発熱して正特性サーミスタとリード線を接続
した半田を融解させ、バネ材のバネ力で正特性サーミス
タとリード線とが離間することにより回路を遮断するこ
とを特徴とする過電圧・過電流保護装置を提供するもの
である。
Alternatively, the spring material is soldered to the lead wire soldered to the PTC thermistor element, and the spring property is biased so that the lead wire and the PTC thermistor are separated from each other. When the end is soldered to the board and the overvoltage / overcurrent is applied to the PTC thermistor, the PTC thermistor self-heats and the solder that connects the PTC thermistor and the lead wire is melted, and the spring force of the spring material corrects it. The present invention provides an overvoltage / overcurrent protection device characterized in that a circuit is cut off by separating a characteristic thermistor and a lead wire.

【0007】[0007]

【作用】上記の構造とすることにより、正特性サーミス
タ素子は従来は20φ×4.0tmmの大きさであった
ものが、7φ×2.5tmmの大きさとすることが可能
となり、装置も小型化出来、コストも低減することが可
能となった。
With the above structure, the PTC thermistor element, which has been conventionally 20φ × 4.0tmm in size, can be made 7φ × 2.5tmm in size, and the device can be downsized. It was possible and the cost could be reduced.

【0008】[0008]

【実施例】本発明の実施例を図1に基づき詳述する。正
特性サーミスタ1(7φ×2.5tmm、キュリー温度
120℃、抵抗値12Ω)の両面にニッケルメッキ及び
錫メッキ(図示せず)により、電極を形成し、その電極
にバネ性を有する0.5φの黄銅線2,3を錫−鉛共晶
半田4(融点183℃)で半田付けした。
Embodiment An embodiment of the present invention will be described in detail with reference to FIG. Electrodes are formed on both sides of the positive temperature coefficient thermistor 1 (7φ × 2.5tmm, Curie temperature 120 ° C., resistance value 12Ω) by nickel plating and tin plating (not shown), and the electrode has a spring property of 0.5φ. The brass wires 2 and 3 were soldered with tin-lead eutectic solder 4 (melting point 183 ° C.).

【0009】リード線の他端を基板5に半田付けするに
際し、リード線2は、リード線のバネ力で正特性サーミ
スタ素子を離間するように付勢した状態で基板5に半田
付けした。このリード線3,2間に600V 40A、
600V 7A、600V 2.2Aの電流を流したと
ころ、正特性サーミスタに電流が流れて自己発熱して半
田4の融点である183℃を超え、それぞれ0.02
秒、1.0秒、2.3秒で図3の通り、リード線が正特
性サーミスタと離間し、遮断した。
When the other end of the lead wire is soldered to the substrate 5, the lead wire 2 is soldered to the substrate 5 while being biased by the spring force of the lead wire so as to separate the positive temperature coefficient thermistor element. 600V 40A between the lead wires 3 and 2,
When a current of 600V 7A, 600V 2.2A was passed, the current flowed through the positive temperature coefficient thermistor and self-heated, exceeding the melting point of the solder 4, 183 ° C., 0.02 each.
As shown in FIG. 3, the lead wire was separated from the positive temperature coefficient thermistor at 1.0 second, 2.3 seconds, and was cut off.

【0010】また本発明の他の実施例を図2に示す。正
特性サーミスタ1(7φ×2.5tmm、キュリー温度
90℃、抵抗値12Ω)の両面にニッケルメッキ及び錫
メッキ(図示せず)電極を形成し、その電極に0.5φ
のCp線6.7を錫−鉛共晶半田4(融点183℃)で
半田付けした。
Another embodiment of the present invention is shown in FIG. Nickel-plated and tin-plated (not shown) electrodes are formed on both sides of the positive temperature coefficient thermistor 1 (7φ × 2.5tmm, Curie temperature 90 ° C., resistance value 12Ω), and 0.5φ is formed on the electrodes.
Cp wire 6.7 was soldered with tin-lead eutectic solder 4 (melting point 183 ° C.).

【0011】リード線6の他端を基板5に半田付けし、
リード線7の他端をバネ材8(リン青銅 幅2.0mm
厚み1.0tmm)で半田付けし、バネ材8をリード
線7と正特性サーミスタとが離間するよう予め付勢した
状態でバネ材8の他端を基板5に半田付けした。リード
線6、バネ材8の間に600V 40A、600V 7
A、600V2.2Aの電流を流したところ、0.05
秒、1.6秒,3.8秒で電流を遮断した。
The other end of the lead wire 6 is soldered to the substrate 5,
Attach the other end of the lead wire 7 to the spring material 8 (phosphor bronze width 2.0 mm
The spring material 8 was soldered with a thickness of 1.0 tmm, and the other end of the spring material 8 was soldered to the substrate 5 in a state where the spring material 8 was biased in advance so that the lead wire 7 and the PTC thermistor were separated from each other. 600V 40A, 600V 7 between the lead wire 6 and the spring material 8
A, when a current of 600V 2.2A was passed, it was 0.05
The electric current was cut off after 1 second, 1.6 seconds and 3.8 seconds.

【0012】[0012]

【発明の効果】以上、詳述するように、正特性サーミス
タを小型化し、低コストで高電圧、大電流を素早く遮断
する過電圧、過電流保護装置を提供することが可能とな
った。尚、実施例ではバネ材として黄銅やリン青銅を用
いたが、これらのバネ材に限定されるものではないこと
はいうまでもない。また、用途として、PBX(電子交
換機)を例として説明したが、この用途に制限されるも
のではなく、過電圧、過電流保護用途として広く応用出
来るものである。
As described above in detail, it has become possible to provide an overvoltage and overcurrent protection device which can reduce the size of a positive temperature coefficient thermistor and quickly cut off a high voltage and a large current at low cost. Although brass and phosphor bronze are used as the spring material in the embodiment, it goes without saying that the spring material is not limited to these. Further, the PBX (Electronic Exchange) has been described as an example of the application, but the application is not limited to this application and can be widely applied as an overvoltage / overcurrent protection application.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

【図2】他の実施例の断面図である。FIG. 2 is a cross-sectional view of another embodiment.

【図3】図3は図1の実施例で、リード線が正特性サー
ミスタから離間した状態を示す。
FIG. 3 shows the embodiment of FIG. 1 in which the lead wires are spaced apart from the positive temperature coefficient thermistor.

【符号の説明】[Explanation of symbols]

1 正特性サーミスタ素子 2 黄銅線 3 黄銅線 4 半田 5 基板 6 Cp線 7 Cp線 8 リン青銅板 1 Positive Characteristic Thermistor Element 2 Brass Wire 3 Brass Wire 4 Solder 5 Substrate 6 Cp Line 7 Cp Line 8 Phosphor Bronze Plate

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 正特性サーミスタ素子にバネ性を有する
リード線を半田付けし、且つ正特性サーミスタとリード
線とが離間するようにリード線のバネ性を付勢した状態
で当該リード線の他端を基板に半田付けし、正特性サー
ミスタに過電圧・過電流が加わった場合、正特性サーミ
スタが自己発熱して正特性サーミスタとリード線を接続
した半田を融解させ、リード線のバネ力で正特性サーミ
スタとリード線とが離間することにより回路を遮断する
ことを特徴とする過電圧・過電流保護装置。
1. A lead wire having a spring property is soldered to the PTC thermistor element, and the spring property of the lead wire is biased so that the PTC thermistor and the lead wire are separated from each other. When the end is soldered to the board and the overvoltage / overcurrent is applied to the PTC thermistor, the PTC thermistor self-heats and the solder connecting the PTC thermistor and the lead wire is melted, and the spring force of the lead wire corrects it. An overvoltage / overcurrent protection device characterized in that the circuit is interrupted by separating the characteristic thermistor and the lead wire.
【請求項2】 正特性サーミスタ素子に半田付されたリ
ード線にバネ材を半田付けし、且つリード線と正特性サ
ーミスタとが離間するようにバネ性を付勢した状態でバ
ネ材の他端を基板に半田付けし、正特性サーミスタに過
電圧・過電流が加わった場合、正特性サーミスタが自己
発熱して正特性サーミスタとリード線を接続した半田を
融解させ、バネ材のバネ力で正特性サーミスタとリード
線とが離間することにより回路を遮断することを特徴と
する過電圧・過電流保護装置。
2. The other end of the spring material in a state where the spring material is soldered to the lead wire soldered to the PTC thermistor element and the spring property is urged so that the lead wire and the PTC thermistor are separated from each other. If the overvoltage / overcurrent is applied to the PTC thermistor by soldering to the board, the PTC thermistor self-heats and melts the solder connecting the PTC thermistor and the lead wire, and the positive force of the spring material An overvoltage / overcurrent protection device characterized in that the circuit is interrupted by separating the thermistor and the lead wire.
JP4938395A 1995-03-09 1995-03-09 Overvoltage and overcurrent protective device Pending JPH08250304A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4938395A JPH08250304A (en) 1995-03-09 1995-03-09 Overvoltage and overcurrent protective device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4938395A JPH08250304A (en) 1995-03-09 1995-03-09 Overvoltage and overcurrent protective device

Publications (1)

Publication Number Publication Date
JPH08250304A true JPH08250304A (en) 1996-09-27

Family

ID=12829506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4938395A Pending JPH08250304A (en) 1995-03-09 1995-03-09 Overvoltage and overcurrent protective device

Country Status (1)

Country Link
JP (1) JPH08250304A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031203A1 (en) * 1997-01-11 1998-07-16 W.J. Furse & Company Limited Improvements in or relating to thermal trip arrangements
US6196873B1 (en) 1998-06-10 2001-03-06 Yazaki Corporation Waterproof connector
US6445277B1 (en) 1999-06-22 2002-09-03 Yazaki Corporation Safety device of electric circuit and process for producing the same
WO2002091398A2 (en) * 2001-05-08 2002-11-14 Tyco Electronics Raychem K. K Circuit protection arrangement
US8058966B2 (en) 2003-06-23 2011-11-15 Hiroyuki Koyama PTC thermistor and method for protecting circuit
JP2021517739A (en) * 2018-04-04 2021-07-26 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag Thermal protection device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031203A1 (en) * 1997-01-11 1998-07-16 W.J. Furse & Company Limited Improvements in or relating to thermal trip arrangements
US6196873B1 (en) 1998-06-10 2001-03-06 Yazaki Corporation Waterproof connector
US6445277B1 (en) 1999-06-22 2002-09-03 Yazaki Corporation Safety device of electric circuit and process for producing the same
WO2002091398A2 (en) * 2001-05-08 2002-11-14 Tyco Electronics Raychem K. K Circuit protection arrangement
WO2002091398A3 (en) * 2001-05-08 2003-10-30 Tyco Electronics Raychem Kk Circuit protection arrangement
US8058966B2 (en) 2003-06-23 2011-11-15 Hiroyuki Koyama PTC thermistor and method for protecting circuit
JP2021517739A (en) * 2018-04-04 2021-07-26 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag Thermal protection device
US11482354B2 (en) 2018-04-04 2022-10-25 Tdk Electronics Ag Thermal protection device

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