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Application filed by Mitsubishi Gas Chemical CofiledCriticalMitsubishi Gas Chemical Co
Priority to MYPI91001494ApriorityCriticalpatent/MY106881A/en
Publication of MY106881ApublicationCriticalpatent/MY106881A/en
Perforating, Stamping-Out Or Severing By Means Other Than Cutting
(AREA)
Drilling And Boring
(AREA)
Abstract
A METHOD OF DRILLING A THROUGH -HOLE IN A PRINTED CIRCUIT BOARD PANEL, WHICH COMPRISES PLACING A WATER - SOLUBLE LUBRICANT SHEET ON ONE SURFACE OR EACH OF TWO SURFACES OF A PRINTED CIRCUIT BOARD PANEL AND DRILLING A THROUGH - HOLE THROUGH THE PRINTED CIRCUIT BOARD PANEL, THE WATER - SOLUBLE LUBRICANT SHEET BEING COMPOSED OF A MIXTURE OF 20 TO 90% BY WEIGHT OF A POLYETHYLENE GLYCOL HAVING A WEIGHT AVERAGE MOLECULAR WEIGHT OF NOT LESS THAN 10,000 WITH 10 TO 80% BY WEIGHT OF A WATER - SOLUBLE LUBRICANT AND HAVING A THICKNESS OF 0.05 TO 3 MM.
MYPI91001494A1991-08-191991-08-19Method of drilling of through-holes in printed circuit board panels.
MY106881A
(en)