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Application filed by Optical Coating Laboratory IncfiledCriticalOptical Coating Laboratory Inc
Priority to MYPI89000364ApriorityCriticalpatent/MY103984A/en
Publication of MY103984ApublicationCriticalpatent/MY103984A/en
IN-LINE AND ROTARY CYLINDRICAL SPUTTERING SYSTEMS ARE DISCLOSED WHICH SPUTTER DEPOSITS MATERIALS SUCH AS REFRACTORY METALS AND FORMS OXIDES AND OTHER COMPOUNDS AND ALLOYS OF SUCH MATERIALS. THE ASSOCIATED PROCESS IS CHARACTERIZED BY THE ABILITY TO FORM A WIDE RANGE OF MATERIALS, BY HIGH THROUGHPUT, AND BY CONTROLLED COATING THICKNESS, INCLUDING BOTH CONSTANT AND SELECTIVELY VARIED THICKNESS PROFILES.
MYPI89000364A1989-03-221989-03-22Magnetron sputtering apparatus and process.
MY103984A
(en)