MXPA99007410A - Wafer product and process of manufacture - Google Patents

Abstract

A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each has a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45°to the other, the second surface having a single grid pattern, the pattern being at 45°to the lower grid on the first surface.

Description

Wafer product and manufacturing process Technical field of the invention The invention relates to a round wafer product and a process for its manufacture.

Background of the Invention Round wafer products are well known in the art. However to date to achieve the required round shape the wafer dough is placed in a hot mold. Such use of a mold produces a raw, moist wafer because the mold does not provide any outlet for moisture during cooking.

The wafer products made by the introduction of a wafer dough between hot flat plates are crispy, but due to the preferential flow of the dough, it has not been possible to provide an approximately round product until today.

The present invention therefore addresses the problem of how to provide an approximately round wafer that also has the desired crunchiness.

Surprisingly this problem can be solved if a specific pattern is formed in the form of ridges or ridges on both sides of the wafer.

Description of the invention Accordingly, the invention provides an approximately round, crispy wafer product wherein each of the two surfaces of the wafer has a pattern formed in the form of ridges or ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each one, a grid that is at an angle of approximately 45 ° from the other, the second surface having a single grid pattern, the pattern is at 45 ° from the lower grid on the first surface.

Preferably each grid is formed by a pattern of squares.

The upper surface preferably has two grid patterns superimposed, the first grid (upper) which is at an orientation of 45 ° of the second grid (lower).

Preferably the squares forming the pattern of the first grid on the first surface are larger compared to the squares forming the second grid of the first surface.

Preferably the squares forming the grid pattern on the second surface are smaller compared to the squares forming the pattern of the first grid on the first surface. Preferably the squares that form the grid pattern on the second surface are smaller compared to the squares that form either of the two grid patterns superimposed on the first surface.

The grid of the second surface preferably has the same orientation as the first grid of the first surface.

Generally the wafers of the invention will be used as a component in a food product. Typically the wafer will be formed and then filled with a food component, for example ice cream. Suggested products that can be produced are stuffed cones and tacos products.

Preferably when preparing a filled product, the first surface of the wafer will form the outer surface of the filled product and the second surface will form the inner surface of the filled product.

The wafers are prepared by placing a wafer dough formulation between two hot plates having the required pattern etched into the plates. The plates will typically be at a temperature from 185 to 215 ° C.

Preferably the wafer is greased while still hot (for example at a temperature greater than or equal to 100 ° C).

If a wafer with a shape is required instead of a flat one, the wafer can be formed in the required shape while it is still hot, or alternatively the wafer can be reheated to be formed. The reheating can be by any convenient means, however the preferred means of reheating are by infrared radiation as described in our European co-pending application number 96306392.0 For the preparation of the wafer product of the invention a large number of wafer formulations can be used. It is believed that it is within the ability of the experienced person to determine which wafer compositions can be used appropriately. Generally the wafers will be based on starch for example, made of wheat, rice, corn or other suitable flour. Other ingredients such as sugar, flavoring, emulsifier, milk ingredients, fats, etc., can be added. Preferably the wafer formulation comprises molasses.

Preferably the wafers are prepared having a thickness of less than 3 mm, for example from 0.5 to 2.5 mm.

Drawings The invention will be further illustrated by the following drawings; Figure 1 shows a first wafer surface pattern according to the invention.

Figure 2 shows a second wafer surface pattern according to the invention.

Figure 3 shows an end view of a wafer having a first surface pattern as shown in Figure 1 and a second surface pattern as shown in Figure 2.

Figure 4 shows a cross section through 4-4 of figure 1 where the wafer has a first surface pattern as shown in figure 1 and a second surface pattern as shown in figure 2 .

Figure 5 shows a first alternative surface pattern according to the invention.

Comparative Figure A shows a comparative surface pattern that does not provide a round wafer product.

Comparative Figure B shows a second comparative surface pattern that does not provide a product of the round wafer.

Emploses The invention will now be illustrated further by the following examples. Example 1 A wafer dough having the following formulation was prepared; Ingredient% Weight Flour 38.82 Sucrose 18.63 Molasses 3.88 Inverted sugar 1.79 Oil and Lecithin 1.00 Salt 0.93 Water Up to 100 The dough was introduced between hot flat plates having a temperature of about 200 ° C and heated for 70 seconds to provide a wafer. The flat plates were etched in such a pattern that one surface of the wafer was provided with the pattern shown in Fig. 1 and the other surface was provided with the pattern shown in Fig. 2, the pattern in Fig. 2 being 45 ° of the square grid smaller than the pattern shown in figure 1.

An approximately round, crunchy wafer was provided, as shown in Figures 1 and 2.

EXAMPLE 2 Example 1 was repeated except that the hot flat plates used were engraved such that the wafer was provided with a first surface having a pattern as shown in FIG. 5 and a second surface having a pattern such as that shown in Figure 2, the pattern in Figure 2 is at 45 ° from the smaller square grid of the pattern shown in Figure 5.

An approximately round, crunchy wafer was provided.

Comparative Example A Example 1 was repeated only that the hot flat plates were engraved such that the wafer was provided with a single surface having a pattern as shown in Figure A.

A wafer was produced having the shape shown in figure A. This shape is not sufficiently round.

Comparative Example B Example 1 was repeated only that the heated flat plate was engraved such that the wafer was provided with a single surface having a pattern as shown in Figure B.

A wafer was produced having the shape shown in figure B. This shape is not sufficiently round.

Claims (6)

R E I V I N D I C A C I O N S

1. Product of approximately round crisp wafer where the two surfaces of the wafer each have a pattern formed as protrusions or ridges, the first surface having a pattern comprising at least two patterns superimposed grid each other, a grid which is at an angle of approximately 45 ° from the other, the second surface has a single grid pattern, the pattern is at 45 ° from the lower grid on the first surface. Wafer product according to claim 1, wherein each grid is formed by a pattern of squares. Wafer according to claim 2, wherein a first grid of the first surface is larger squares in comparison to the squares forming a second grid of the first surface. 4. Product wafer according to claim 2 wherein the squares forming the grid pattern on the second surface are smaller compared with the squares forming first grid pattern on the first surface. 5. Product wafer according to claim 2 wherein the squares forming the grid pattern on the second surface are smaller compared with the squares forming either of the first and second grid patterns on the first surface. Wafer according to claim 2, wherein the grid of the second surface preferably has the same orientation as the first grid of the first surface.