CZ305899A3 - Waffle product - Google Patents

Abstract

Crunchy, approximately round-roasted product, with two the surface of this wafer has every pattern created by the fish where the first a surface comprising at least two network patterns superimposed one on top of the other, the one being placed at an angle about 45 ° relative to the other, and the second surface has one mesh pattern, this pattern being stored at an angle of 45 ° relative to it bottom network on the first surface.

Description

Technical field

The present invention relates to a round wafer product and a process for its production.

BACKGROUND OF THE INVENTION

Round wafer products are well known in the art. However, to date, the wafer dough is inserted into a hot mold to achieve the desired circular shape. However, such use of the mold results in a raw, non-baked wafer, as the mold does not provide any moisture output during cooking.

The wafer products produced by inserting the wafer dough between the heated flat plates are crispy, but due to the advantageous flow of the dough it has not been possible to form an approximately circular product.

Thus, the present invention relates to solving the problem of how to form an approximately circular wafer which also has the desired crunchiness.

Surprisingly, it has now been found that this problem can be solved if a specific pattern is formed on both sides of the wafer by grooves.

SUMMARY OF THE INVENTION

Thus, the present invention provides a crispy, approximately circular wafer product, of which two surfaces of the wafer each have a groove pattern, wherein the first surface has a pattern comprising at least two mesh patterns superimposed on each other, one mesh at an angle of approximately 45 °. · · ♦

V, * vzor ř ', ř vzor f f f Φ Φ f Φ Φ Φ Φ

relative to the second, and the second surface has one mesh, the pattern being disposed at an angle of 45 ° to the bottom mesh on the first surface.

Preferably, each network is a square pattern.

The upper surface preferably has two superimposed mesh patterns, wherein the first (upper) mesh is disposed in an approximately 45 ° orientation relative to the second (lower) mesh.

Preferably, the squares forming the pattern of the first mesh on the first surface are larger compared to the squares forming the second mesh on the first surface.

Preferably, the squares forming the mesh pattern on the second surface are smaller compared to the squares forming the first mesh pattern on the first surface. Particularly preferably, the squares forming the mesh pattern on the second surface are smaller compared to the squares forming any of the two superimposed mesh patterns on the first surface.

The mesh on the second surface preferably has the same orientation as the first mesh on the first surface.

Wafers of the present invention will generally be used as components in a food product. Typically, this wafer will be shaped and then sacked with a food component, such as ice cream. Suggested products that can be produced in this way are filled cones and Taco products.

Preferably, when the filled product is manufactured, the first surface of the wafer will form the outer surface of the filled product and the second surface will form the inner surface of the filled product.

Wafers are made by placing a mixture of wafer dough between two heated plates having the desired pattern engraved on the plates. The blankets will usually have a temperature of 185 to 215 ° C.

Preferably, the wafer is oiled while still hot (e.g., at a temperature greater than or equal to 100 ° C).

If a shaped wafer is required rather than a flat wafer, the wafer may either be shaped to the desired shape while still being hot, or alternatively, the wafer may be reheated to be shaped. The reheating may be accomplished by any suitable means, however, the preferred reheating means is infrared radiation as described in copending European patent application No. 96306392.0.

A large number of wafer dough compositions can be used to produce the wafer product of the present invention. It is believed that it is well within the ability of a person skilled in the art to determine which wafer compositions can be advantageously used. Generally, wafers will be based on starches, for example made from wheat, rice, corn or other suitable flour. Other ingredients such as sugar, flavors, emulsifiers, dairy ingredients, fat and the like can be added. Preferably, the wafer composition comprises molasses.

Wafers having a thickness of less than 3 mm, for example from 0.5 to 2.5 mm, are preferably produced.

The present invention will be described in more detail and illustrated by way of example with reference to the accompanying drawings.

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A »A

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 shows a pattern of a first surface of a wafer according to the present invention;

Fig. 2 shows a pattern of a second surface of a wafer according to the present invention;

Giant. 3 is a side view of a wafer having a pattern on the first surface shown in FIG. 1 and a pattern on the second surface shown in FIG. 2;

Giant. 4 is a cross-sectional view taken along line 4-4 of FIG. 1 of a wafer having a pattern on the first surface shown in FIG. 1 and a pattern on the second surface shown in FIG.

¹⁵ 2;

Giant. 5 shows an alternative pattern of a first surface according to the invention;

Fig. 6A shows a surface comparative pattern that does not provide a circular wafer product;

Fig. 6B shows a second surface comparative pattern that does not provide a circular wafer product.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described in more detail below by means of the following examples.

Example 1

A wafer dough having the following composition was formed:

** 4 9 • 4 4 ·

4 4 4

4 <4 '·

4 44 • 44 44

4 4 4 4

4 4 4 4

4,444,444 ♦ 4 ··· ·· 44

Ingredients

Flour

Sucrose

Molasses

Inverted Sugar Oil & Lecithin

Salt

Water% by weight

38.82

18.63

3.88

1.79

1.00

0.93 to 100

The dough was placed between heated flat plates having a temperature of approximately 200 ° C and heated for 70 seconds to form a wafer. A pattern 15 was previously engraved on the flat plates by having one surface of the wafer provided with the pattern shown in Fig. 1, and the other surface of the wafer being formed with the pattern shown in Fig. 2, the pattern in Fig. 2 being angled 45 ° with respect to the network of smaller squares of the pattern shown in Fig. 1.

An approximately circular, crispy wafer was formed as shown by Figures 1 and 2.

Example 2

Example 1 was repeated except that the heated flat plates used were engraved such that the wafer was formed with a first surface having a pattern as shown in Figure 5 and a second surface having a pattern as shown in Figure 2, wherein the pattern in FIG. 2 is oriented at an angle of 45 DEG. 4 99 9 9 99 9 9 9 9 9 99 9 99 999 999 999 99 ··

99 999 999 99 99 • 99 relative to the network of smaller squares of the pattern shown in Fig. 1.

An approximately round, crispy wafer was formed.

Comparative example

Example 1 was repeated except that the heated flat plates used were engraved such that the wafer was formed with a single surface having a pattern as shown in Figure 6A.

A wafer having the shape as shown in FIG. 6A was formed. This shape is not circular enough.

Comparative example

Example 1 was repeated except that the heated flat plates used were engraved such that the wafer was formed with a single surface having a pattern as shown in Fig. 6B.

A wafer having the shape as shown in FIG. 6B was formed. This shape is not circular enough.

Represented by:

Claims (6)

PATENT CLAIMS A crunchy, approximately circular wafer product, each of the two surfaces of the wafer having each groove pattern, wherein the first surface has a pattern comprising at least two mesh patterns stacked on top of each other, one mesh at an angle of approximately 45 ° with respect to the second, and the second surface has one mesh pattern, the pattern being disposed at an angle of 45 ° to the bottom mesh on the first surface. 2. The wafer product of claim 1 wherein each net is a square pattern. 3. The wafer product of claim 2, wherein the first network of the first surface is of squares larger than those of the second network of said first surface. The wafer product of claim 2, wherein the squares forming the mesh pattern on the second surface are smaller compared to the squares forming the first mesh pattern on the first surface. 5. The wafer product of claim 2, wherein the squares forming the mesh pattern on the second surface are smaller compared to the squares forming either of the first and second mesh patterns on the first surface. 6. The wafer product of claim 2, wherein the second surface network preferably has the same orientation as the first network of the first surface. Represented by: