MXPA97000879A - Electronic assembly of multiple layers using a sinterizable composition and related method of formac - Google Patents

Abstract

Electronic assemblies comprising a sinterable composition are described. The composition sinters reactive and / or non-reactive, during the lamination cure cycle of the assembly. The composition generally comprises (i) at least one high melting point particulate material, (ii) at least one low melting point material and (iii) an organic portion comprising a resin and a crosslinking agent.

Description

ELECTRONIC ASSEMBLY OF MULTIPLE LAYERS USING UHA COMPOSITION SINTE IZABLE uaE opo Rfli-ft iQNAPQ pg TRAINING REFERENCE CROSSED TO RELATED SQ lQ This relates to a continuation-in-part of the patent application of the U.S.A. Serial No. 08 / 154,862, presented on November 19, 1993, are titled METALURGICALLY METALLURGED POLYMER ROUTE (METALLURGICALLY BONDED POLYMER VÍAS). FIELD PE LA INVENCIÓ This invention relates to single and multi-layer electronic interconnect assemblies, methods for forming these assemblies and methods for forming electrically conductive routes in laminates by using a novel sinterable composition that forms a robust electrical path during lamination. AWTECEPEWTES OF INVENTION Multilayer electronic assemblies are of enormous importance in the electronic industry where space is paramount. These assemblies typically comprise two or more dielectric substrates having electrically conductive circuits, separated from one another by one or more dielectric layers. The electrically conductive layers of the assemblies are electrically connected at discrete sites within the assembly via electrically conductive pathways. The tracks extend perpendicularly to and between the electrically conducting layers or circuits and thus extend through one or more dielectric layers, Substrate layers having electronic circuits arranged on one or both sides of the substrate and further having one or more Electrically conductive pathways, extending through the thickness of the substrate, are known. The vias or orifices that extend through the dielectric can be made electrically conductive through a variety of techniques. A common technique used with circuit boards based on organic laminate, is to produce a metallized orifice coated in the multilayer structure, when a path from one layer to another is required. Although employed in most multilayer interconnect assemblies, there are a number of disadvantages associated with conventional metallized holes. A first disadvantage is that the area of the board occupies a metallized hole. Metallized holes are typically produced by drilling a hole through a multilayer board and then metallizing the hole with copper by electrodeless and electrolytic coating. It is difficult to drill and coat a small path through the relatively thick multilayer structure. It is also difficult to register the drill with the "catch cushion" required to connect the through hole to the desired electrically conductive traces in the assembly. These combined difficulties result in relatively large catch and track cushion structures. Typical sizes are holes of 300 microns in capture cushions of 450 microns. Smaller sizes are possible with significant cost penalties. A reduction in the area of the circuit board occupied by tracks and capture cushions can be achieved by the use of blind and buried roads. As will be understood by those skilled in the art, blind tracks are tracks extending from an exposed face of the multilayer assembly to a location within the assembly. Buried tracks are tracks that extend from a first interior location within the assembly to a second interior location within the assembly. In order to form a multilayer assembly, having buried or electrically conductive blind ways, using coated track techniques, it is necessary to perform a relatively complicated sequential lamination procedure. This procedure is time consuming and expensive. Furthermore, sequential lamination processes are undesirable since these techniques subject the initial assembly or its components to a large number of lamination cycles that typically involve high temperatures. In addition, this exposure may adversely affect the physical and electrical integrity of the initial assembly.

Previous technicians have developed many approaches to fabricating multilayer electronic interconnect assemblies with blind and buried pathways. Some share the aforementioned disadvantage of sequential processing. These approaches include multi-layer thick film processes that successively deposit dielectric material and electrically conductive material, followed by a burn or cure step. These stages are then repeated to sequentially accumulate a multilayer structure with blind and buried pathways. This approach has been practiced with both metal / ceramic materials (cermet) as well as metal / polymer materials (thick polymer film). More recently, sequential processes have been developed based on dielectric deposition followed by development of pathways in the dielectric by various means, including blind laser drilling, plasma or chemical etching, image-forming techniques and others known in the art. specialty. Once made, metal circuit tracks and tracks are formed by any of several available means such as liquid or vapor phase metal deposition techniques such as evaporation, electrodeposition, electrodeless and electroless coatings. Additional layers require the repetition of this dielectric deposition by stages of metal deposition and deposition.

All of the above techniques for producing multilayer electronic interconnection structures with blind and buried pathways suffer from sequential processing that reduces performance and increases costs. Experts in the prior art have developed a parallel processing technique that overcomes some of the difficulties encountered with the aforementioned sequential processing techniques. This processing is known by those skilled in the art as the multi-layered ceramic co-burn process. This process begins with a "green" sheet consisting of various glass and ceramic particles and a small amount of organic "binder" material, to provide mechanical support in the unburnt sheet. Tracts are formed on this green leaf and then the tracks are filled with a cermet type composition. Circuit traces are then printed on the sheets with a similar cermet type composition. Green leaves similarly prepared with the required pattern of cricuite strokes and tracks are then stacked and laminated together in the proper sequence and required by the final multilayer structure. During a final high temperature burn stage, the cermet materials comprising the circuit tracks and traces and the various glass and ceramic particles comprising the electrical portion of the assembly are sintered together to form the final assembly. There are several advantages to this approach. First, since the tracks are formed in relatively thin sheets of material, the track diameters and catch cushion can be much smaller than the metallized hole structures. More importantly, due to the parallel nature of the process, blind and buried pathways are easily obtained. Sequential processes and bad performances are totally avoided. Finally, the ceramic structure is very robust and is suitable for applications of high reliability and demanding environments. Unfortunately, there are also disadvantages to the ceramic co-burning process. First, due to the need to sinter relatively refractory materials such as glass and ceramics, very high burning temperatures are involved. This imposes limitations on the conductive materials that can be used. The high temperature of burning also contributes to the high cost of this process. In second, the dielectric constant of glass and ceramics is higher than that found in typical laminated multilayer circuit boards. The combination of relatively high resistance and high dielectric constant dielectric conductors, results in limitations in the electrical performance of the ceramic co-burning boards. Thirdly, due to the burning temperature, all the organic binder originally present in the precursor conductor and the dielectric material, must be removed by a controlled "burn-off" step, before the final high-temperature sintering process. This contributes to the process difficulty and results in a very significant shrinkage of the assembly during burning. The control of the shrinkage factors in different types and batches of materials is very challenging and contributes significantly to the cost and complexity of the co-burning process. Attempts have been made to obtain the benefits of a parallel process such as co-burned ceramic, without incurring the disadvantages listed above. Thus, one approach has been to fill gates in organic compound based boards, with metal-filled polymers similar to the previously described polymer thick film materials. The filled structures are then rolled together to form the multi-layered structures. Due to the parallel process, blind and buried roads are easily obtained. As with co-firing ceramics, trays and capture cushions can be much smaller than metallized orifice structures and much more space is saved on the board as a result. High temperature processes and the associated shrinkage problems that exist with co-burned ceramic are avoided. Conductors of lower resistance and dielectrics of lower dielectric constant, also contribute to better electrical performance in materials based on organic compound.

Despite these advantages, it is difficult to produce polymer-filled metal paths with low electrical resistance, high performance and good environmental stability. The polymer component in these filled conduits is not electrically conductive. Conversely, conductivity occurs as a result of contact points between individual metal filler particles. Even silver filler particles are not totally resistant to corrosion and contamination and can also be sensitive to moisture and handling. The point contact must also be established between the path particles and the planar circuit patterns of each layer. This point contact is adversely affected by physical movement thermally or mechanically induced. Poor point contact with planar patterns results in increased electrical resistance across the path, such as if the track material itself had high electrical resistance. Point contact simply does not offer the conductivity and electrical reliability of solid metal conductors. In short, these multi-layer polymer structures filled with metal simply are not reliable and will not be used in the industry for applications that demand reliability. In this way, there is still a need for a parallel process at low temperature and low cost, capable of forming reliable, buried and small blind ways in multi-layer structures based on organic compounds.

What is missing to date and that is provided in the present invention is a via filler material that is capable of forming the same type of stable, low resistance, sintered microstructure found in co-burned ceramic pathways at temperatures and pressures consistent with laminates based on organic compound. In addition, the new track filling material does not undergo any significant shrinkage during the sintering process. The net result is a multi-layered interconnection structure effective in dense and highly reliable cost, based on organic sheet materials. In addition, the new track filler materials allow for entirely new approaches to connection of microcircuit matrix or reversible pitch and other electronic assembly processes. The current reversible microcircuit processes begin by "jumping" the input / output cushions in the matrix with a solder ball. The die is turned face-up with the active face of the die, with its associated welding stops facing and registering with connection pads at the next packing level, typically a circuit board or a single or multiple microcircuit module. Thus assembled, the assembly is exposed to a time and temperature profile sufficient to recirculate at least a portion of the weld in the die or board cushions. When cooling, a metallurgical connection is obtained between the matrix and the board cushions. If a reliable connection is to be obtained, when reversible microcircuits are connected to organic based boards, the welding stops must additionally be encapsulated with a thermoplastic or thermoplastic material that can accommodate the stresses associated with the thermal expansion coefficient of the silicon matrix and the organic board. This organic "sub-filling" is conventionally applied in liquid fprma after reversible microcircuit connection. The sub-assembled mounts are then subjected to a subsequent cure. Although satisfactory in most aspects, the currently known methods for reversible microcircuit matrix connection and related assemblies are relatively time consuming and costly. The present invention provides a new approach for electrically connecting and physically connecting a reversible microcircuit to a substrate or circuit board. COMPENDI EP The invention The present invention achieves the objectives noted above and provides compositions particularly adapted to form electrically conductive routes in laminated electronic substrates and assemblies. The compositions in general comprise (i) at least one high melting particulate phase material, (ii) at least one low melting point material and (iii) an organic portion comprising a resin and an inlet agent. loosening The compositions of the preferred embodiment have unique processing characteristics such that they are sintered in dense, highly conductive microstructures during exposure to time, temperature and pressure profiles, which are laminated to organic-based materials. The compositions of the present invention form a transient liquid phase and / or reactively sinter during processing, leading to the formation of an electrically superior conductive material. Preferred embodiment compositions also deal with particular propsions of somatic sada and the use of specific component sombinasiones. The present invention provides elastronic assemblies which comprise the above-described sompositions in both the sintered and sintered state. In particular, multi-layer electronic assemblies are provided comprising a plurality of substrates and / or other layers in a stacked configuration in which vias or openings are filled in the substrates or sapas, are the compositions of the present invention. Procedures are also provided for forming the electrically sound paths and re-mounted assemblies that comprise these tracks.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded view of a multi-layer elastronian assembly in preferred embodiment partially assembled according to the present invention; Figure 2 is an exploded view of the multi-layer assembly of the preferred embodiment of Figure 1, having capture pads disposed in cirsuite boards and interposed filled channels and passages are the embodiment of the present invention; Figure 3 is an exploded sessional view of the assembly of Figure 2; Figure 4 is an exploded view of another Elestronian assembly of multiple sapes of preferred modality, assembled in accordance with the agreement; Figure 5 is an exploded view of the multi-ply assembly of the preferred embodiment of Figure 4 having sirsuite board tracks and interposed filled-in sapa openings are the composition of the present invention; Figure 6 is an exploded sectional view of the assembly of Figure 5; Figure 7 is a sessional view of a single sirsuite board having a coated track; Figure 8 is a cross-sectional view of the plurality of boards and interfitters illustrated in Figures 4-6 laminated in set; Figure 9 is a side view of a multi-layered elestróniso assembly, illustrating in detail orthogonal trays formed by filled-in channels and openings filled with agreement are the present invention; Figures 10a to 10 illustrate a amorphous coated laminate assembly and its assembly of agreement are the present invention; FIGS. 1 to 1 illustrate a method for fabricating a multi-layered array from single-side assemblies, is a possible version of filled channels, in accordance with the present invention; FIGS. 12a to 12f illustrate a method for fabricating a multi-layered elastronian assembly from sensed side assemblies is another possible version of filled tracks according to the present invention; Figure 13 illustrates a multi-layered assembly formed from a plurality of sirsuite boards or substrates, each having a hardware arranged on both sides, and using lanes lined in accordance with the present invention; Figure 14 illustrates a multi-layer assembly formed from a plurality of cirsuite boards or substrates, each having syringes disposed on both sides, and using closed coated paths according to the present invention; Figure 15 illustrates a multi-layered assembly formed from a plurality of circuit boards or substrates, each having circuits arranged in expensive arrays, and utilizing blind padded tracks according to the present invention; Figure 16 is an exploded view of an electronic component electrically connected and physically fixed to a substrate by a direct microcircuit connection technique in accordance with the present invention; Figure 17 is an exploded detail view of a variant embodiment for providing electrical connection between capture pads in an electronic assembly in accordance with the present invention; Figure 18 is a microphotograph illustrating an electrically conductive microstructure according to the present invention; Figure 19 is a photomicrograph of a filled pathway produced according to the method of the preferred embodiment of the present invention; and Figures 20a and 20b illustrate by microphotography another filled track produced according to the process of the preferred embodiment of the present invention. DESCRIPTION OF THE PREFERRED MODALITIES The present invention provides sinterable compositions for use in electronic assemblies of single and multiple layers, fabricating these assemblies, and forming electrically conductive paths or paths, particularly in layered assemblies. The term "single layer electronic assembly" as used herein, refers to electronic assemblies, components or portions thereof which generally consist of a single, unitary layer or substrate. In this way, that term encompasses single layer circuit boards as well as single layer interleavers defined hereinafter. Accordingly, the term "multi-layer electronic assembly" as used herein refers to electronic assemblies, components or their portions which generally consist of a plurality of substrates or layers. That term encompasses assemblies in layers comprising two or more circuit boards, substrates, interleavers or other layers or films. The present invention provides compositions that sinter in the presence of a liquid phase or reactively sinter with or without the presence of a transient liquid phase formed during lamination. The resulting material is electrically conductive and finds wide application, particularly as a filler material for the track, in the previously mentioned grooves. The preferred embodiments of the present invention are re-sinterable in such a manner that two or more reactive constituents in the composition form an intermetallic composition. The most preferred sompositions of the present invention are shrinkable sinterably, such that the reastive sonicates form a finely divided, relatively homogeneous and sonorous misroestrust that is substantially all intermetallic or other reactive product. The sompositions of the present invention include (i) a phase material in high melting point particles, (ii) a material that is of lower melting point and / or rearrangement are the material of higher melting point, and (iii) an organic porsión. The first somponent is a relatively high-melting particle phase material. The term "high melting point" refers to materials that have a melting point such that the material remains solid at the highest prosecution temperature or temperature of antiplate use that the assembly circuit will encounter. The highest prosecution temperature of the preferred embodiment later on in this dessripsión, is routed during either lamination or assemblies of multiple superspasses or subassembly assemblies. The lamination temperature is from about 20 ° C to about 400 ° C, depending on the separation of materials. Using the most preferred somposission which are above and tin and lead, the lamination temperature is between about 180 and 325 ° C, depending on the separation of dielectric materials in the elastronic assemblies. The first somponent material must be sapaz of at least one of the following: (1) sintering of itself and sirsuite metallisation in the presensia of a liquid phase at or below expected laminating temperatures; and / or (2) rethermatically sintering are one or more somatizers of the low melting point material, either in the solid state or in the presensia of a transient liquid phase which are low melting point material, as they are greater. detail to sontinuasión. Suitable materials for use as the high melting particulate phase material include all metals of group 3A to 6B of the periodic table, excluding Hg, Ga and In. Preferred materials include copper, nickel, gold, silver and their combinations. The most preferred material is about or alloys that are on. It has been ensontrado that refers to use the first somponent in a form of particles. If the somposission is to be deposited in a pathway, the maximum particle size may depend on the diameter of the pathway. However, the typical particle size is in the range of about 1 to about 150 misters. The preferred particle size is from about 0.5 misra to about 15 misras. The most preferred size of particles is in the range of about 1 to about 6 misters is an average particle size of about 3 misters. A wide variety of particle sizes can be employed for the high melting particulate phase material, such as for example but not limited to, spherical, flake or irregular. The spherical is a preferred form since this particle geometry promotes high levels of charge which in turn promote the formation of dense microstructures and elstrisamente sondustoras. The second somponent, the low melting point material, of preferensia are chosen so as to form a transient liquid phase during lamination in the process from the preferred mode to sontinuation. The liquid must at least parsially wet the first somponent previously dessrito. The formation of this transient liquid phase in general is a non-reversible process that occurs once the deposition is at a sufficiently high temperature to melt or parsially melt the low melting point material. The liquid phase promotes sintering in order to form the resulting misroestrust in greater detail to sontinuasion. Alternatively, the second somponent can be chosen to rethermatically sinter are the first somponent in the solid state.

Representative materials to be used as the low melting point material include metals and alloys set forth below in Table 1. The preferred class of materials to be used as the second component are tin or tin-containing elations. An example of this alloy is a eutectic mixture of tin and lead, ie an alloy 63% by weight of tin / 37% by weight of lead. When combined with copper, that is the more preferred high-melting particulate phase material, intermetallic / intermetallic, copper / copper and copper / intermetallic bonds can be formed depending on the relative proportions of material, particle sizes and temperature-time-pressure profile to which the material is exposed. TABLE 1 ALLOY "C ALLOY * C ALLOYMENT" C 0_MEI? L_, 0 METAL P METAL Sn Ga 20 In Ga 16 Ga Zn 25 Ga 30 Sn Pb Bi in Cd 46.5 Sn Pb Bi In 58 Sn Bi In 61 Sn Pb Bi Cd 70 Bi In 72.4 Sn Bi In 79 Pb Bi Cd 91.5 Sn In Cd 91 Sn Pb Bí 95 Sn Bi Cd 103 Sn In 117 Pb Bi 125 In Cd 127 Sn Bi 139 Bi Cd 144 Sn Pb Cd 145 In 157 Sn TI 170 Sn Cd 176 Sn Pb Ag 178 Sn zn 198 Pb Au 215 Sn Ag 221 TABLE 1 (Cont'd) ALLOY ° C ALLOY ° C ALLOY OR METAL OR METAL OR MET Sn 232 Pb Cd 248 Pb Sb 251 Cd Zn 266 Bi 271 Au Sn 280 Pb As 288 Pb Ag 304 Pb Zn 318 Cd 321 Au Ge 356 Au si 370 Sn Pb 183 When using or overlaying the phase material in high melting point particles, the following representative elements can be used as somatifiers in the low melting somponent: dysprosium, erbium, europium, gallium, gadolinium, germanium, hafnium, mersurium, indium, lanthanium, magnesium, neodymium, phosphorus, palladium, praseodinium, platinum, sulfur, selenium, antimony, silisium, samarium, tin, estronsium, tellurium, thorium, titanium, thallium, yttrium, ytterbium, zins, zirsonium and its so binasiones. A most preferred misroestrust is that the sonorous phase is completely or substantially substracted from all intermetallic enlases. The formation of this microstrict is promoted by one or more of the following procedures: use relatively fine particle sizes for the first and second somponents, using partisan relasions of the first and second somponents, exposing the somposission at a particular temperature for a time sanctity sufisiente, ensuring that the sonsentrasiones of somponentes metallis are such that a level of aseptable metal twill is alsanse, and subject the somposision to a pressure of sompression. In the system of envelope, tin and lead previously dessrito, the metal system is subjected to sintering in transient liquid phase during prosesamiento on 183 ° C. Sintering in the transient liquid phase is defined here as a system that produces two or more metallised particles at the melting point of one or more of the metallic particles followed by the liquid phase resulting through diffusion aleasion are a particula metalisa of superior melting point to a solid. The resulting sintered structure is solid even at the original melting temperature of the low melting point particle. As with the first component, it has been found beneficial to employ the second component in the form of particles. If the composition is to be deposited within a path, the size of the particles allowed for the second somponent is limited by the size of the pathway. The size of the particles for the second somponent is typically in the range of about 1 to about 150 misters. The preferred range for the particle size of the second somponent is from about 1 to about 20 misters. The most preferred size for the particles of the second somponent from about 1 to about 10 misters. The propulsion of the first somponent to the second somponent depends on the thickened materials used for somatic sada. The proprosion is chosen to promote the formation of intermetallic pools within the resulting misroestrust. Typically, this propulsion will respond to the molar propions of the reastive soundings in the desired intermetallic structure. However, proxies greater than or less than these propions can also be used. An example of a more preferred metal system is for the first somponent and a tin-lead mixture for the second somponent, preferensia uses those first and second somponents in particular promotions with one another to promote the formation of an interraterial somatic envelope. -tin. A phase diagram Cu-Sn, illustrates that two possible intermetallic settlements can exist at room temperature: Cu3Sn and CUSOs. The molar proporsions sorpressed from above to tin in these compounds are 3: 1 and 1.2: 1, respectively. Of agreement are this, in the example of a more preferred metal system which is over and tin, the proporsion of the first somponent to the second somponent is chosen such that the molar propionion of over to tin is in the range of about 3: 1. at approximately 1.2: 1.

The third component, an organic portion is a material that improves mechanical properties, filling for space, which occupies the interstices of the metallic network of the conductive composition. This third component generally comprises one or more resins, at least one suction or crosslinking agent, an optional fluxing agent and one or more optional rheological agents. In general it is convenient to include an agent that has a flux activity. A conventional fluxing agent can provide this activity. It is not necessary to provide a significant amount of fluxing agent. Alternatively, or in addition, the entanglement agent (s) may provide the desired flux activity. Addition of one or more rheological agents is also optional, and in general depends on specific application requirements. However, these agents may be desired to facilitate subsequent processing such as screen printing or screen printing. An example of a rheological agent that can optionally be incorporated into the composition of the present invention is a dispersing agent that reduces the viscosity of highly charged resins. The third component can be tailored to provide resilience to the resulting structure, thereby reducing the probability of failure. Additionally, the referred resilience or elasticity can also provide better tolerance to thermally induced stress. The third somponent can also be used to provide the somposission are a material of thermal expansion that is similar to that of the substratum or adjacent materials and next to the somposission are arranged in a path or aperture. The preferentially selected somerset is chosen so that the dieser is flowed before suction or other setting operation, is stable to other high temperature processes after rolling, is not corrosive after curing or other curing operation, and is subject to curing or hardening at similar temperatures and pressures of other curable materials used in electronic assemblies using sompositions of the present invention. It is important that the organic portion does not generate adverse amounts of gases during curing or processing of the composition which may affect the performance or the integrity of the laminated assembly elestróniso. It is preferable that the organic somponent does not condense during curing and does not contain solvent, which would have to be removed before lamination. The generation of gases can cause gaps or bubbles in the structure resulting from the sonorous co-positions. Furthermore, in the multi-layered erection of the strata, the generation of gases can prevent damage to the particle laminated stress during temperature increases that prevent gas expansion. In this way, an important sarasteristisation of the present invention is that it does not generate adverse sanctities of gases upon laminating up to about 400 ° C, the maximum temperature employed in the process of the present invention, at a lamination pressure of at least approximately .703 kg / cm2 (10 psi). This phrase "adverse sanctities of gases" refers to a sanctity of gas, which, if it emerges from a full path or opening, is the somposission of the present invention, will damage or adversely affect the performance or physical integrity or the stress of an erethosis assembly. it comprises these openings or stuffed ways. This phrase also covers an amount of gas that, if released from a gapped opening or path and retained within an electronic assembly, would adversely affect or adversely affect the performance or physical integrity or stress of the ballast assembly, if this assembly were subjected to temperatures within its expected operating environment. Preferably, the organogenic somponent is a liquid at room temperature, which binds the first and second somponents and provides a solution that is satisfactory for stamping are stenciling and deposit the resulting composition in ways or openings in an assembly estrolos. As previously noted, the sompositions of the present invention include the use of reologic additives to facilitate these operations. Resins suitable for use as the somersorder include any resin that can be entangled by a curing agent, such as, but not limited to, a metal catalyst, or a reagent containing hydroxyl groups. Resins that fulfill this requirement include, but are not limited to, epoxides, phenoxies, novolase, (both phenois and somnoles), polyurethanes, polyimides, bismaleimides, maleimides, sianate esters, polyvinyl esters, polyesters and polyureas. Other resin systems can be modified to be crosslinkable by a suction agent, for example metal catalyst, or a hydroxyl group containing agent. Examples of these resins are acrylics, rubbers, (butyl, nitrile, ets.), Polyamides, polyacrylates, polyethers, polysulfones, polyethylenes, polypropylenes, polysiloxanes, polyvinyl asetates / polyvinyl esters, polyolefins, sianoasrilates and polystyrenes. Typically, any resin would be adesuada if the resin can be modified to be at least one of the following funsional groups: anhydrides, sarboxílisos acids, amides, imides, amines, alsoholes / phenols, aldehydes / setonas, nitro, nitriles, carbamates, isocyanates , amino acids / peptides, thiols, sulfonamides, semisarbazones, oximes, hydrazones, sialohydrins, ureas, esters / phosphonisosides, esters / thiophosphoresid esters / esters phosphonisoses, phosphites, phosphonamides, esters / sulphide esters, or other functional groups for astuar These are reastive sites for polymerization. For example, a polyolefin is not a preferred resin since it does not have retractive sites for interlacing and has detrimental adhesive properties. However, a sarboxylated polyolefin will function as a preferred resin when adjusted with a suitable interlacing agent. A combination of these and other resins, such as non-crosslinkable thermoplastic resins, may also be employed. In general, although a non-crosslinkable polymer can be used in the compositions of the present invention, it is preferred that only one or more crosslinkable polymers be used. The preferred type of resin is an epoxy. It is preferred to use an epoxy-based material for the third component since that material does not generate water or gaseous byproducts during sweating. The most preferred type of epoxide is diglycidyl ether of bisphenol A. An example of this most preferred epoxy-based material is EPON 828 resin available from Shell Chemical, other types of epoxies can be employed as epoxy novolacs, multifunctional and cycloaliphatic. Representative examples of specific epoxides by type which can be used for the preferred embodiment composition and which are commercially available, include but are not limited to the following: types of Bisphenol A epoxy resins, with average molecular weights similar to Shell Epon 828 including Shell Epon 826, Epon 813, Epon 815, Ciba-Geigy Araldite GY6004, Araldite GY6010, Dow DER 330, D.E.R. 331 and D.E.R. 383. Examples of epoxy novolases that may be employed are Dow D.E.N. 431, D.E.N. 438 and Ciba EPN 1138. Examples of cycloaliphatic epoxides are Ciba CY 179 and CY 184. Examples of multifunctional epoxides are Ciba MY 721 and MY 722. Suitable epoxy interlacing / curing agents include anhydrides of aceid, acidic organes, amines, amides, phenoxies and Lewis satants. Sweating agents, can be used alone or in combination are other surado agents. Preferably, the suction agent has fluxiness that becomes inasticable once it is interlocked. Preferred epoxide sudsing agents are flux sapsity herein referred to as "suction / fluxing" agents, they include saridophilic acid and anhydrides. Examples include but are not limited to harsh abiétiso, harsh adipiso, harsh assórbiso, ashy acid, citris acid, harsh glutámiso, harsh máliso, phthalic anhydride and maléiso anhydride. Asiento máliso is the most preferred. A liquid anhydride stripping agent is also preferred, the most preferred liquid anhydride is dodesenylsinxin anhydride (DDSA). In addition to working as a sleep aid, DDSA reduses the visosity of the sleep and contains a long aliphatic chain that imparts flexibility to the cured system. Other examples of liquid anhydrides that can be employed include methyltetrahydrophthalic anhydride (MTHPA) and methylhexahydrophthalic anhydride (MHHPA). As previously noted, it is important that the first and second somponents are chosen in such a way that the first somponent is moderately wetted by or reached are the second somponent. For those somponente sombinasiones where this wetting or reaction does not occur easily or requires to be improved, it is possible to pre-treat the first somponent in phase of high melting point particles to promote wetting or reassessment by the second low point somponent. of fusion. Typical pre-treatments include chemical etching, thermal treatment in a redustor environment, and plasma etching. Also coated is the high melting point material is the low melting point material. In order to form the sonorous composition of the present invention, it is preferred to form an organismal portion which comprises the formerly desensitized terser, is to include one or more resins, and at least one suction or interlacing agent, an opsional fluxing agent and an additive of ophional rheology. The organic portion then mixes are appropriate sanctities of the first and second somponents. Table 2, stable to sontinuation, supplies the permissible and preferred promotions of the various ingredients that constitute the organic portion of the somposision of the present invention. TABLE 2 Component f% / weight) Permissible (% / weight ^ Preferred f% / pésol Resin 1-98 46-69 Curing Agent 1-60 17-46 Cure / Flux Agent 0-60 9-13 Rheology Additives 0 -10 0.5-5 Table 3, stable to sontinuation, gives ranges of permissible sonification of somponents in the present invention.Table 3 also establishes preferred and more preferred sonsension ranges for the first and second somponents and the organic portion for a system that is oversupplied for the first somponent, and a 63% by weight alenation of tin / 37% by weight of lead, the second somponent is TABLE 3 Perraissible Preferred Most Preferred Component% by weight% by weight% e weight of high melting point particles 2--90 10--90 Copper 2--90 10--90 17.48-47.74 Low melting particulate phase 4--93 10--90 Aleasion 63% tin weight / 37% lead weight 4--93 10--90 37.31-72.85 Organese Porsy 1--35 3--30 5-25 Values of I feel in weight listed in the most preferred solumn of Table 3, they correspond to the molar propions of over and tin from 3: 1 to 0.9: 1. The lower ratio of 0.9: 1 is less than the molar ratio of 1.2: 1 for the metal system previously discussed more preferred which comprises copper and tin. The reason for this is that in many applications, it is particularly convenient to provide an excess of tin to be re-routed with any copper present in circuit traces, capture pads or inner walls of coated tracks. Another preferred formulation for the sinterable composition of the present invention comprises 21-26% by weight of copper particles having an average particle diameter of from about 1 to about 6 microns, 61-68% by weight of tin alloy particles. eutectic lead having an average particle diameter from about 1 to about 10 microns, and 10-14% by weight of an organic portion comprising EPON 828 59% resin, 30% DDSA and 11% malic acid. A broad set of additives and other components can be added to the composition of the present invention. Solvents may be added to reduce the viscosity of the composition to facilitate processing. Nevertheless, any added solvents should be removed before lamination. Examples of suitable solvents include, but are not limited to, butyl carbitol acetate, benzyl alcohol, butyl cellosolve and butyl carbitol. If the solvent evaporates or generates gases released at temperatures lower than the maximum liming or liming temperature in the process from the preferred mode to solvent, the solvent must be removed. However, it is preferred that these solvents have not been used. Retractive thinners can be added to reduce visuosity and increase flexibility. Examples include glisidyl ethers, aliphatic ethers or redox epoxy flexibilizers. Additives can be used to affine rheology, mesanistic properties, dimensional stability or to add in disperse. The preferred embodiments of the present invention provide a relatively homogenous thin misroestrust, of low resistensia, by using finely divided particles and partial relasions of high and low melting phases. When sweating, an interstellar estrustura eléstrisamente continuous sonductora is formed in the composition. The resulting microstructures formed from the compositions of the present invention typically have less than 50 ohm ohm resistors. It is noteworthy that formulas of low resistances eléstrisa, such as those of the present invention can be achieved without insorporar protected surado agents or phases in particles resistant to oxidation or employ rapid speed profiles of "peak" of ascent. This is considered to result from the pressure used during rolling. The particular techniques of the present invention allow the use of fine particles without need by surface treatment of specific particles such as by coating a low melting point tin phase onto a high melting point phase. In addition to the previously dissonant sompositions, the present invention also provides for single and multiple-splice assemblies that utilize the scattering sompositions in both the sintered and unsintered states as well as an elastically conductive binding agent. Although the compositions of the present invention can be used in binding aplombassions, this binding function is auxiliary to its primary function, that of providing elastically-stable papers in substrates and electronic assemblies. In a preferred embodiment, a multi-layered assembly with electrically interconnected perpendicular to the sirsuite webs, is formed by filling gates in sirsuite boards and / or openings in one or more interlayer webs, described below and performing a single step. operasión of laminasión with the compositions previously dessritas. The term "opening" as used herein generally refers to a track in an interlayer, and if so, is used interchangeably with "track" here. Although it is preferred to form the assemblies described herein using a single rolling operation, it is within the scope of the present invention to use multiple lamination operations. During lamination, the constituents electrically dispose of the somposission form metallurgical joints and are also metallurgically joined to any traces of metallic circuits or metallized track side walls that these constituents have. The metallurgical union is superior to the contasto sondusción point achieved are poluérisos stuffed sonvensionales. The multilayer shell can be constructed from single-sided circuits comprising a conductive layer and a dielectric layer or double-sided sirsuits that comprise a dielectric web disposed between two sounding webs. Double-sided cylindrites typically have metalized through-holes or coated paths that are a sounding sapa are the other. When double-sided sirsuitos are used, a sapa entresaladora dessrita are more detail to sontinuasión, preferensia is used among the sirsuitos. When sapa sensilla sirsuites are used, pathways are typically formed by any suitable means, such as drilling, punching, laser drilling or etching in the sirsuite after an adhesive is applied to the dielectric side of the sirsuite. The adhesives can be of liquid or brains, thermoplastic or terjofix, and filled or unfilled. The preferensia adhesive is adjusted for envelope expansion and dielectrics. Possible dielectrics include those sonosides in the manufacture of the previous tetanus of syrahs formed additively or substratively.

Preferred multi-layer electron assemblies of the present invention may utilize one or more intercalators, each disposed between adjacent circuit boards. The term "interleaver" as used herein refers to a relatively planar, sheet-like member. Preferred interleavers for use in the multilayer electronic assembly of the present invention have a particular combination of features as follows. The material used for the interlayer should have a coefficient of thermal expansion similar to other components and materials in the assembly. The material should also cure at relatively low temperatures and at conventional curing parameters. The interlayer material should also be suitable for stamping processing. The intertheater can be formed from a wide set of materials that exhibit the above characteristics. Examples of these materials include, but are not limited to, laminated composite polyamide adhesive films on both sides of a dimensionally stable material such as Kapton or Upilex. other film adhesives include but are not limited to thermoplastic polyimides, epoxy, acrylic, polyetherimide, cyanide ester, bismaleimide, triazine and bismaleimide / epoxy. The interleaver may consist of a thin layer or film of a single material such as a film adhesive without connection to a dielectric nouvelle. Examples of suitable PVC film adhesives include bondply DuPont Pyralux, LF 111, Roger's Flex-i-mid 3000, Courtauld's CFK 111, Ultem, Sheldahl MKC 111, DuPont KJ and Nippon SPB. A preferred interslator is formed from an adhesive film of a thermoset polyimide on both sides of the Kapton. Interns can also be formed from various reinforced materials. These reinforced materials, in general, provide improved dimensional stability or thermal soundness. Reinforced reinforced materials include reinforced epoxy or polyimide are glass or Aramid fibers. * Examples of somersially available reinforced materials are included, but are not limited to reinforced epoxy prepegs are FR4 glass and DuPont Thermount products. Typical thickness for interlayer sapa it is generally in the range from about .00508 sm (0.002 inch) to about .0127 sm (0.005 inch). Higher or smaller thicknesses may be employed depending on the end-use application and the desired espetic properties. a preferred embodiment of multiple lens array 10, which comprises a plurality of boards 20 and a plurality of interleaving webs 50 disposed between panel board 20 in a stacked assembly.It will be understood that none of the above-mentioned figures is shown. illustrates a partially constructed assembly 10. Figure 1 also illustrates the alternate configuration of boards 20 and interpersons 50. Defined in one or more operators are openings 52. Figure 2 shows the assembly 10 which also includes one or more sirsuite traces 22, somatic elses 24 and one or more capture soya 70, arranged on boards 20. The term "soprano de saptura" is used here to refer to a region or portion of a trace of sirsuite elstrisamente sondustor or distal end thereof, which is, or will be in asosission eléstrisa are a trayestoria lasestrisa proportioned for example through a full path are the somposission of the present invention, a trace of sirsuite or some other somponent of the erelestron montage. These suction sops may be in the form of an elstrustually sonder-shaped rim or annular ring disposed about the opening of a track, or an enlarged terminal end of a sirsuite stroke such as in the form of a circle or oval. With further reference to Figure 2, preferably disposed within each of the openings 52 is the elastically spacing somposistion 40 of the present invention. 70 preferential saptura cushions are placed on the board 20in such a way that the stacked assembly 10 is formed, a filled opening is arranged between the two suction sops 70, such as in two boards 20 adjacent to the parting sapper sap. Saptura cushions 70 primarily serve to bridge a saddle stroke in a first board 20 to a filled aperture resident within an interlayer layer. A sopping soup 70, arranged on a second adjacent board 20 on the opposite side of the stakeholder 50, electrically connects other strokes or somponents to the filled opening and therefore to the stroke in the first board. Figure 3 is a cross-sectional view of the assembly illustrated in Figure 2, and illustrates alignment of sampler sojines 70 in boards 20 and filled openings 52 in interleaving webs 50. It will be understood that the sirsite boards 20 illustrated in Figures 2 and 3 they have sirsuito traces 22 and / or somatic elongated 24 on their lower sides. In some cases it may be preferred to provide coated channels in boards 20. The coated tracks comprise an elusively sounding wall extending over the inner periphery of the track. Preferably, the elastically sounding wall extends over the entire length of the track, from one side of the board 20 to the other side. It may also be preferred to provide a sapure sojín or elvistrisamente sondustor rim on the side or side of a board, extending around a coated track, and an asosysation elstrisa with it. The term "coated track" as used herein encompasses tracks having electrically conductive walls, which are formed by methods in addition to coating projections.

Since the objective in designing most of the multilayer electronic assemblies is in miniaturization, tracks formed in cirsuito boards advantageously have very small diameters. Accordingly, when an electrically-conductive wall material is coated within a track, it is possible for these tracks to be "closed". For these closed routes, it is not necessary to try to fill in additionally with the composition of the invention. For coated routes that are not closed, the composition of the invention can be deposited there. Figures 4-6 illustrate, in exploded views, another multilayer electronic assembly of preferred embodiment 90, comprising a plurality of boards 20 and a plurality of interleavers 50 disposed between each board 20 in a stacked assembly. Figure 4 illustrates the alternating configuration of boards 20 and interleavers 50. One or more boards 20 are defined as coated tracks 26. Electrically conductive, coated or padded tracks, for example, provide electrical paths between opposing faces of a board 20. Defined in one or more intercalators 50 is the opening 52. Figure 5 illustrates the assembly 90 further comprising one or more circuit traces 22 and electrically conductive upper capture cushion 30 disposed on the board 20 around the perimeter of the track 26, and a cushion electrically lower conductor catch 32 (not shown) on the opposite side of the board 20, which also extends around the perimeter of the track 26. Preferably disposed between one of the tracks 26 and openings 52 is the position 40 of the present invention Figure 6 is a cross-sectional view of the assembly illustrated in Figure 5. Figure 7 is a cross-sectional view of the parsial detail of the board 20 of the assembly 90, which comprises a plurality of traces 22 in both of sleep, and a covered track 26 that extends through the thickness of the board 20. Arranged in a first board 20 is the sock of sapure upper wall 30, and arranged in a second sara opposite to the first sara is the lower sucking sock 32. Arranged on the inner wall of track 26 in ascending relation are both lower suction sops 30 and 32, there is a sonar wall elastically 28. It is possible to fill the coated line 26 with the embodiment of the present invention, as illustrated in Figures 5, 6, 8 and 9. Figure 8 is a cross-sectional view of the set illustrated in Figures 4 - 6 after assembly, it is desira laminasión. The resulting relief of aligned filled-in channels and filled openings forms elliptical passages that extend through the assembly 90 in a direction perpendicular to the sirsuite webs. The region A of Figure 8 illustrates a through orifice or passage extending from an exposed outermost sara of the assembly 90 to the other outer exposed sara of the assembly 90. Residing within the sonorous passage formed by the tracks 26 and openings 52, all aligned in region A, is the elastically sounding composition 40, which provides elongated connection from one side of assembly 90 to an opposite side. The region B illustrates a buried suya way is filled the somposision 40, provides electrical connection between the inner boards 20, these boards are linked by other boards and thus, are not audible to the outside of the assembly 90. The region C illustrates a way The suar is filled with the composition 40, provides an electrical connection from the outside of the assembly 90 to the strokes or components of the interior of the assembly 90. Figure 9 illustrates formed sheets formed when aligning the tracks 26 and openings 52, filled somesissionately sonar 40, in the multilayer electronic assembly 90. Those are skill in the technique they will apresiarán that Figures 8 and 9 are not to essala and that the ways illustrated there in the prástica are significantly smaller than illustrated. The laminated assembly 90, which comprises the alternating layers of dielectric boards 20 and interleavers 50, is eltrastrisamente tested to one or more sources of energy or signal, represented by the terminals 60, 62 and 63. It will be expedited that the connection of the testers can be established from one region to another in an assembly as illustrated in Figures 8 and 9, when using unfilled lined tracks. These tracks can also be filled as illustrated.

The present invention also provides a coated laminate assembly, from a binder filler sheet or interleaver laminate assembly from a composite binder sheet or interleaver layer, having one or more channels or filled openings as illustrated in the drawings. Figures 10a to lOe. With reference to Figure 10a, the tie layer 100 comprises a dielectric layer 110 having adhesive tapes 120 disposed on opposite sides of the dielectric sheet 110. It will be understood that only one of many types of tie-plate configuration has been illustrated and that the joining web can have all the possible sonsions possible as previously described here for interlayer layers. Figure 10b illustrates a plurality of tracks 130 defined in the joining web 100. The tracks 130 extend through the mirror of the binding web 100. Figure 10 illustrates full lines 130 are an effessive sanctity of the present invention Invention, designated as 140. FIG. 10 illustrates a coated laminate 150 that projects the binding sampler 100 of FIG. 10 which has envelope overlays 160 disposed on one side thereof. FIG. 10 illustrates a amorphous coated laminate 170 formed from coated laminate 150 of FIG. 10O when seperatively etching or otherwise removing overprint region 160, thereby forming circuits 165.

The electronic assemblies of the present invention are initially constructed by several methods. An electronic assembly can be formed for example by (i) using circuit boards that have circuits on only one side, (ii) using circuit boards that have circuits on both sides and using an interlocking sapa or joining sape that has one or more gaps or openings filled with the composition of the present invention or (iii) when using combinations of (i) and (ii). With respect to the first technique (i), FIGS. 1 to 1 illustrate forming a multilayer assembly from single side substrates or boards while also illustrating the formation of these assemblies providing through holes. FIG. 1a, illustrates providing a coating laminate 200 which preferably comprises a copper coating sheet 210 disposed in a dielectric layer 220 and fixed thereto by adhesive layer 205. It will be understood that the adhesive layer is optional and that the mounting 210 can also be of various constructions without adhesive. One or more tracks 230 are formed in the coated laminate 200 as illustrated in Figure 11b. Appropriate circuits 240 are formed by selectively removing, such as by etching, regions of copper plating 210 as illustrated in Figure 11c. It is preferred to provide capture pads 250 around the periphery of each track 230, or better illustrated in Figures 11c and llf. The tracks 230 are filled by an effective amount of the composition of the present invention, designated in Figure 1, L, and L, as 260. Figure 1 illustrates a twist board 270 having circles 240 on one side of the board and it also has a plurality of filled channels. Figure 1 illustrates a multi-layered assembly 295 formed by stacking a plurality of single-sided boards 270 such that the hardware 240 on the board is in electrical asosiation by way 230 filled with the composite 260. A plurality of the tansy (i. ) to form a multi-layered assembly from solid-side boards, is illustrated in Figures 12a to 12f. An assembly of multiple sapae 395 constructed in accordance with this scheme is comprised of one or more molding lines, illustrated in section 330, filled with the embodiment of the present invention 360. FIG. 12a illustrates a coated laminate 305 which preferentially comprises a coating saucer. on 310 disposed in the dielectric layer 320 and fixed thereto by a layer of adhesive 308. It will be understood that the adhesive layer is optional and that the assembly may also be of different construction and adhesion. Cirsuites 340 are formed by seletively removing such somo by etching, coated regions of about 310 are illustrated in Figure 12b. When these sirsuites are formed, it is preferred to provide sapure 350 sojines in the desired location or blindness of a blind way 330, as best illustrated in Figure 12f. One or more blind tracks 330 are formed in the coated laminate 305 as illustrated in Figure 12s. The mowing paths 330 are then filled with appropriate amounts of the composition of the present invention illustrated in 360 in Figure 12d. Figure 12e illustrates the multi-ply assembly 395 formed in stacking a plurality of side-side boards 305 such that the circuits 340 in each board are in appropriate asosisation asosisation via the filled way 330 are the somposission 360. Referring to the second technique ( ii) to form an electronically manifold assembly from sirsuite boards having sirsuites on both sides, Figure 13 illustrates a multi-ply assembly 495, which includes a first sirsuite board 410 having pins 440 disposed on both sides. its sides, a second cirsuite board 420 having cirsuitos 440 dispueetoe at menoe in one, and preferensia in amboe de eue ladoe, and an interlayer sapa 430 having at least one opening 435 there formed and filled with an effective amount of composition elstrisamente sondustora of the present illustrated invention Somo 438. Boards of sirsuitos 410 and 420 sada one preferably provide one or more vias r 460. As previously described, it is preferred to provide trap pads 450 disposed around the periphery of a track 460. It may also be desired not to fill one or more tracks 460 that are provided in boards 410 and 420 as illustrated in FIG. Figure 13 In a plurality of the tansy (ii) to form an multi-layered elestróniso assembly from sirsuite boards having syringes on both sides, Figure 14 illustrates a multilayer assembly 595 formed from cirsuite boards having lanes serrated by coated. The assembly 595 generally comprises a first sirsuite board 510 having circuits 540 disposed in a manner of the upper and lower faces. The cirsuito 540 of the preferensia 510 board ends in sojines de tablero 550 that are disposed adyasentes and in asosiasión eléstrisa are a serrated way by coating 560. The assembly 595 also somprende a second board of sirsuito 520 that somirrende appropriate sirsuitos 540 and sojines of saptura 550 arranged in both of sueras. Between the first and second boards 510 and 520 is disposed an interleaving sapa 530 having one or more aperture 535 filled is an effetive sanctity of the somorese elstrisamente sondustora iluetrada somo 538. In another manifold of the second teasin (ii) to form an assembly The multiple-sapphire array of circuit boards having cirsuitoe on both sides, FIG. 15 illustrates a multiple-ply assembly 695 that comprises a first sirsuite board or substrate 610 and a second board or sub-board 620, with one having sirsuitoe 640 diepueetoe in amboe sides. Preferred sirsuitos 640 use sucking soaps 650 which are disposed adjacent and in electrical association with blind ways 660. Assembly 695 further comprises an interlayer layer 630 having one or more openings 635. Preferably, blind tracks 660 and openings 635 they fill with appropriate amounts of electrically conductive composition 638. Another application of the present invention relates to direct microcircuit connection (DCA) techniques. As will be appreciated by those skilled in the art, methods of connecting direct microuting are known, wherein an electronic microcircuit or other component having one or more welding points, capture pads or electrical connection points on its underside, it is connected directly electronically to a receiving region on a substrate face. Once electrically connected, a liquid filler material, typically a fluid dielectric adhesive, is injected between the underside of the component and the substrate receiving face. The liquid filler material before sufficient curing or hardening, provides or promotes significant assembly reliability during thermomechanical stress as found in thermal cycling. As illustrated in Figure 16, the present invention provides both physical connection and electrical connection between the electronic microcircuit 710 and a circuit board or other substrates 720 having circuit traces 730 and capture pads 740 disposed on a receiving face of the substrate. 720 The microstrip 710 has one or more electrical connection points 715 arranged on its underside. The interseller 750 somprende one or more aperture 760 full are an effetive sanctity of somoresis eagerly sound of the present invention illustrated 770. The connection assembly of microsirst diresto 795 ee shape aligning the misrosirstuite 710, interseller 750 and substrate 720, so such that one of the points 715 is in asosysation, the is a sucking sore 740 through a filled aperture 760. After appropriate solosion, the re-assembled assembly proceeds to a scalping operation under precession, where the misrosirstite 710 is physically fixed to the substrate 720. In all the above embodiments, the eléstrica connection from a first capture cushion disposed on one face of a circuit board or other substrate, and a second capture cushion arranged on an adjacent face of another board of cirsuito or substrate, can be achieved by multiple openings or full roads are the somposision of the p Resent invention. For example, as illustrated in Figure 17, a first sub-stratum 810 has a sucking sock 815 disposed in a sara 818, is aligned is an interlayer sabre 820 having a plurality of openings 825, a full one is an effusive sanctity of somposission elstrisamente sondustora of the present invention, designated somo 830, and also aligned are a second eubstrato 840 that has a sojin de saptura 845 arranged in his sara 848.

The components 810, 820 and 840 are then stacked and laminated appropriately or otherwise fixed together. The assemblies of the present invention do not require one-to-one dedication between a sampura sojin, stuffed or stuffed aperture. The present invention also provides a simple lamination process. That is, when a multi-layered array is formed, the modules only need to be subjected to a lamination operation. Typically, this results in multi-layer assembly subjected to relatively high lamination temperatures only once. Multiple or sequential laminating operations, as required by prior approval, are formed by mowing and buried, are not necessary. The assembly or fabrication of the multi-layered multi-layered assembly of the present invention having full openings or openings is the somposisions here dessritae, it is preferentially filled by a vacuum-layered lamination process as follows. One or more boards of cirsuitoe and one or more intersalary that have the opening and filling are the sompoeission, they are solosan in a laminating press. A vessel is formed inside the lamination press. The preemption within the preferensia prenea is approximately 1 mm Hg. Once having formed a wide respect for the mounting of the bracket, lamination pressure is applied to the bracket assembly, which is kept low inside the press. Laminating pressure or surface force is applied to the mounting in a manner generally perpendicular to the planar, intersalaring and other sapae boards which constitute the assembly. It is preferred that the lower limit for the lamination preion be sufficient to prevent the material from flowing in the assembly to sirsulen, or to dissipate and to force air or other volatiles from the assembly and to separate the material. Preferentially, the lamination pressure must be sufficiently high to prevent the adhesive materials from spraying and assisting in the inter-dressing. When lamination is performed under pressure, that is assisted by vacuum, the minimum lamination pressure is approximately 703 kg / cm2 (10 psi). The maximum lamination pressure is a pressure that achieves the above objective, yet it does not result in damage to the assembly. Eeta Maximum maximum lamination pressure is generally dictated by the rigidity and strength of the assemblies that are manufactured. Once the desired rolling force or rolling pressure has been applied to the assembly, i.e. at least about 703 kg / cm 2 (10 psi), while the assembly is kept under vacuum in the press, a heating step is initiated . In general, it is preferred to heat the electronic assembly, under a vacuum, and to apply a laminating force at a temperature to the superatmospheric solution, forming a traneitor liquid fae. As previously noted, this is from about 20 ° C to about 400 ° C and preferably from about 180 ° C to about 325 ° C when the composition uses copper, tin and lead.The upper temperature of about 400 ° C in general is It is limited by the superstring surfaces or flow of the interlayer material, once it reaches the rolling temperature, it maintains that temperature or maintains for a particular period of time which is primarily a function of the interlayer material and the electrically conductive composition used in the assembly Typical retention times are in the range of about 5 minutes to about 1 hour.It is preferred that the organic component of the composition cure during lamination, although a step-curing step may be added to the process, if necessary. maintain the electronic assembly to the vasio, at the temperatures and pressures of lamination prev Just described, for the period of time noted, the assembly is allowed to cool, preferably at room temperature. It is important that the rolling pressure is maintained until the assembly has at least cooled below the glass transition temperature of the flowable materials. Upon cooling, the rolling pressure and vacuum are released and the laminated assembly is removed from the press.

The derision of the previous prosee are referensia to a pre-line of Pasadena Hydrauliss, Ins., Model B256-C-X1-3-5-20 are salting eléstriso, water cooling, and a pre-line of Wabaeh Metal Producte Company, model 3- 8 with electrically heating and water cooling. A means of embolization are varied to the extent that it adapts to use ambae prenemes previously mensioned. Although the previously preferred process has been carried out with the aid of a vessel, the methods of the present invention do not require this assistance. Depending on the interleaver and the track filling material, it will be possible to produce multi-layered strains. This is a time / temperature / pressure profile similar to a "Hot Bar" operasion. they are dexterity in the teas. Eetae operacionee of Barra Caliente, as you will understand, in thickeys of lamination espesífisae de eitio, highly losalizadae. Lae somposisionee of the present invention can be undertaken both sintered reastivo somo and / or sinterizado not reastivo to form misroestrusturae lasestrisamente sondustorae. Lae unionee intermetálisae or of the metal mérame relict give to lae misroeetrusturae a performance that can include sarasterietisae intermetálisae or sarasterietisae ein aleasión. The prosesoe of the present invention can be tailored to the measure and ingredients in the somposission are chosen in such a way that the somposission is subjected to sintering non-retractive, sintered reastive or varying degrees of both. The somposisions of the present invention provide a misroestrustura that suffers a metallurgical union formed by stacking salor and pressure to a metal powder or somposission that are the same. The diffusion of surface directed by superfisial energy, results in transport of material to the sontasto points of partisulas, resulting in the sresimiento of a sollo of material that are this to the two particles. Metal-to-metal bonding, without the formation of a joint (intermetallum or otherwise) in the joint weld, is defined for the purpose of this non-shrinkage, sintered, non-shrinking. Sintered solid-state non-shrinking, requires temperatures in the order of half the absolute melting point of the materials involved to proceed to a suitable volatility. The sintering temperature can be reduced substantially by the preeensity of a liquid fae due to improved fire. The sríticos fastoree to consider in this aspect are the layering of the liquid phase to wet the solid, the sapasidad of the liquid to form intermetálisos are the eolid phase (which can cause a dip to reactive sintering), the solubility of the liquid in the liquid faee and the liquid in the liquid phase and the solid-solid ratio and the propulsion of superfisial energies solid-liquid and solid-solid. The preferred method for joining and forming an elastically distorted shell is the involuntary sintering reastive. For the purposes of this dessripsión, sinterizado reastivo is defined as a proseeo of einterizasión, where the formaión of sompuestos within interpartísulas unions soneume one or more components of the original mixture. For example, copper can be bound with tin using reactive sintering. Something or all of the tin and copper originally present can coneumiree in the formations of the interstellar overlays that link the original envelope and tin particles to each other. The thermal properties and mesanisae of the intermetallic are very different from the material of starting and starting material. The intermetallic junction can be formed completely by solid state diffusion. However, high temperature above the melting point of one of the substituents, greatly ensured the diffusion proseration. To reduce the temperature to the sual eete proseeo of rapid diffusion osurre, one of the elements of intermetallic formations (eetaño, in this saso) can form aleasión are one or more materials that will form a faee of inferior fueión. Examples can be found in Table 1. In this case, the final metallurgical union will be made of intermetallic over-tin and the residual alloy element. It is also possible to use a reactive sintering tin in which all or a part of the copper or tin component is consumed and a portion of the tin or copper component remains. Figure 18 is a microphotograph illustrating an electrically conductive microstrust comprising a substantially monolithic intermetallic phase formed from (i) at least one high melting point particulate material, (ii) at least one low point material of fusion. This raicrophotograph illustrates the extensive intermetallic phase formed from a composition of the present invention comprising (i) copper particles having a size in the range of about 0.5 miera to about 15 micras, and (ii) a eutectic tin mixture. and lead in the form of particles having a size in the range of about 1 to about 20 misters. The molar ratio of copper to tin was 1.2-1. The amount of (i) and (ii) in the composition was about 87% by weight. It can be seen that the intermetallic phase is monolithic or substantially, with few interruptions or structural discontinuities. It has surprisingly been found that the most preferred electrically-sounding compositions of the present invention after sintering and curing generally have a greater degree of electrical and structural continuity than known prior art compositions. When compared to cured compositions of the prior art, the resultant misothermicity has a sonorous fate of overstamped intermetalism. This strut allows a very robust connection between opposing capture pads and high temperature expo- sure, such that it can be found in lamination substep operasions. Example 1 discloses a preferred somposision and its preparation, according to the present invention. Examples 2 and 3 demonstrate multi-layered elastronic assemblies using the sonodrug suspension in Example 1. Example 4 demonstrates an addional pathway filling material and its preparation. Example 5 desserts a more preferred track filler material. Example 6 dessribe an assembly of the multiple layers of agreement is the invention, using the dessrita somposission in Example 4. Example 7 dessribe a somession elstrisamente esdustora preferred of the invention that does not shake gases during the operasiones of laminasión and surado suando shape a multilayer laminate or multi-layered mounting. Example 8 demonstrates an ereostronic assembly of dual assessaves is the invention using the composition of Example 7. Example 9 describes forming a metaleese layer structure using the composition of Example 4. Example 10 of forming a laminate using the sompoesion of Example 1.

EXAMPLE 1 A buffering filler material is the invention, which exhibits both reactive and non-reactive sintering is produced as follows. 1.3 grams of flux are prepared from Alpha 611 RMA flux supplied at 37 per cent. We also feel at stages at 82 ° C to remove 60 +/- 1% of the volatile content. 7.8 grams (7.8 weight percent) of a phenolic resole resin with 70% solids (Oxychem Methylon 75108MB) were mixed with 1.3 gram of flux. 30.3 grams of elastomer particles of lead / lead 63/37 of 10 micrae, and 60.6 grams of above-field particles of mesh -325, were eroded in the mixture of flux of reein. The envelope powder was first reduced to form gae at approximately 315 ° C for one hour to ensure cleanliness. Approximately 0.5 gram of also benzylish is added to adjust the visosity to an added value for stagnated by eetarside. EXAMPLE 2 An interconnection structure of 6 metal plates is fabricated from single-sided circuit layers using the track filling material of Example 1 as follows. Single-sided circuits are produced from thin metallic copper foil adhesively bonded to polyimide film by standard eubstractive etching techniques. The polyimide film was DuPont Kapton H "* and the adherent was DuPont Pyralux" *. The thin sheet metal is rolled and resosen 28.35 g (1 ounce) of sachet. The material of adhesive / Kapton is passed under the name Pyralux soraersial LF-9120. Artistic work that corresponds to the desired sirsuite pattern in one of the 6 layers of metallic circuit is produced and used to expose Pyralux LF material coated with photoendurbable subetancy. The photoequitable euboenea is revealed and the exposed envelope is biting using a mordant based on a ferrous slurry. The photo-efficient subetansia is removed and a thermo-modified epoxy adhesive sheet adheres to the dielectric side of the panel which contains the sirsuitoe mordentadoe. The adhesive was Courtalds Z-Flex ™ .0254 mm (1 mil) supplied in a .0254 mm (1 mil) mylar release sheet. The individual sirsuite saplings were sorted from the panel and pits of .1016 and .2032 mm (4 and 8 mils) in diameter were punched through superfisies in the envelope tracings using a numerically numbered punch. The die-to-matrix eepasiamientos were sonarized to produce pathways of the highest salinity. The pattern of sirsuito and via selessionó to demonstrate routes stacked, mowed and buried in the final estrustura. Each sachet of spiked sirsuite is then filled is via the track filling material of Example 1 as follows. The sirsuito solos in the vasario bone of the stamper stamping or serigraphy machine, on the side of sirsuito hasia below. Using mylar punching method, a sontaste machine and using stencil stamping parameters or relatives to those with skill in the art, the tracks were filled with the track filling paste. The track-filled laminates were then assembled into multi-layered circuits. Circuit layers filled with individual tracks were stacked in a laminating accessory that ensures alignment of the individual lane tracks. The rolling program consists of pressure systems between 35.15 and 70.3 kg / cm2 (500 and 1000 psi) at room temperature to remove the laminated air, followed by pressure reduction at 17.58 kg / cmKR (250 psi). The press platens are then salted at approximately 19 ° C for a period of 20-25 minutes.The system is maintained at a temperature and pressure for 70 minutes and then cooled to room temperature for a period of 15 minutes while maintaining The entire structure contains buried and stacked blind tracks with diameters of both .1016 and .2032 mm (4 and 8 mils) on larger surfaces.The tracks of .1016 mm (4 mils) had a lower resistance to 50 milliohms Transverse sections of the ways are illustrated in Figure 19 and illustrate both reactive and non-reactive sintering The locations of the photograph labeled by number 1 are copper junctions, while those labeled as 2 are intermetallic junctions.

EXAMPLE 3 A strut of soft metal sheets is fabricated from double-sided sirsuits, which are through-lined orifices using the track filler material of Example 1 as follows. The double-sided sirsuites are produced by vacuum metallization on one side of a polyimide copolymer (Upilex) with a chrome "seed" layer / punch, puncturing the track pattern, then metallizing the second side and the tracks. The photoseneible substances were laminated to amboe ladoe and revealed in such a way that the seed sapa is exposed in areas where the metal is desired on. It is coated on electrolysis. When the expected thickness of the envelope is reached, the photosensitive substance is released and the seed layer snaps instantaneously. The resultant cirsuites were approximately 15.24 x 15.24 sm (6 x 6 inches) and are approximately .0406 mm (1.6 mils) apart by spacing of .0457 mm (1.8 mile) on the first side and a baee plane of about eubetansially sontinuous on the second side. More than two thousand five hundred metallic roads with a diameter of .0635 mm (2.5 mil) were set on both sides. Estrusturae containing four layers of metalliferous strands are stacked and fabricated from pairs of double-sided sirsuites when interlacing folds of junction between double-sided sirsuitos. The joining webs were manufactured by first adhesive lamination and a release sheet on both sides of the Upilex film. The adhesive was Courtalds Z-Flex "* are .0254 mm (1 mil) thickness on a polyester release sheet (Mylar ™) .The same pattern of path present in the double-sided sirsuite flexible is punched on the sap of union are a punch of .2032 mm (8 mils.) A punch of .2032 mm (8 mil) instead of .0508 or .1016 mm (2 or 4 mils) is used simply for reasons of sohveniensia. of .2032 mm (8 mil) was also punched in a metal sheet of .0508 mm (2 mil) creating a metal stencil for filling the track. The stander pattern is registered in the stannous pattern and is recorded to the circuit track pattern or junction fold The track filler material of Example 1 is applied to the stancil and using family stencil parameters to those with skill in the technique, a paste of tracks is printed on the tracks of sirsuito or fold of joined N. Three types of multi-layered assemblies were fabricated. Cirsuitos stuffed with laminating tracks are filled folds of track to a metal reinforcement to form the first assembly. Non-filled cirsuites that are laminated are filled folds of track without a reinforcement to form the second assembly. Rail filled inserts were laminated with joint fills without a reinforcement to form the third type of assembly. In all cases, the rolling program was from insulation to stack pressure between 35.15 and 703 kg / cm2 (500 and 1000 pei) at room temperature to deeprender the laminated air followed by pressure redussing at .1758 kg / cm2 (250 psi). The prenea plates then came out at 194 ° C for a period of 25 minutes. The system was maintained at temperature and pressure for 70 minutes and then cooled to room temperature for a period of 15 minutes, while remaining under lamination pressure. The sommelite laminates are available. Figure 20a shows that the lanes were formed by both non-retractive and reusable sintering, as shown in 1 and 2, and Figure 20b shows a stratum of the stratus from less amplification where the lae sapae and sirocose are visible. EXAMPLE 4 A road filler material according to the present invention is prepared as follows. A mixture of 84.3% in peel of epoxy Epoxy Shell Epon 828 and 15.7% by weight of malic acid is heated on a hot plate set at 150 ° C until the solution became clear. 2.3 grams of dodecenylsinxin anhydride are added to 2.7 grams of the above mixture and shaken. 7.7 grams of spherical envelope powder with a particle size distribution where 90% of the particles are less than 6 micras with an average of 3 micras added and stirred are a spatula. The envelope powder was first redused to form gas at approximately 315 ° C for 15 minutes.

The envelope mix is then formulated in a mill. They are laboratory rollers to disperse and reduct the agglomerates in the envelope powder. 16.6 grams of tin / lead solder powder 63/37, are partisulae size of -10 misrae is added to 9.2 grams of the envelope mix and formula are a high volatility mezzanine. The resulting paste is aerated for 15 minutes at ambient temperature in order to remove trapped air.

A preferred mode track filler material is prepared as follows. A mixture of 84.3% by weight of Epoxy Epoxy Shell Epon 828 and 15.7% by weight of rough maly, was salted in a protruding pad adjusted to 150 ° C until the solusion became clear. 0.9 gram of dodesenilsussiniso anhydride are added to 2.0 gram of the above mixture and shake. 4.4 grams of powder from overburden somo ee deesribe in Example 4, add and stir are a spatula. The copper mix is then formulated in a laboratory roller mill to dissolve and redistribute the agglomerates in the envelope powder. 9. 1 grams of the tin / lead solder powder 63/37 somo ee deesribe in Example 4, were added to 5.0 gram of the copper mix and mixed with a high speed mixer. The resultant fae undergoes vacuum for 15 minutes at room temperature in order to remove trapped air.

A four-layer metal structure is fabricated from double-sided circuits with through-holes coated using the track filler material of Example 4 as follows. The double-sided circuits were manufactured by Sheldahl from flexible Novaclad "circuit material. * The circuit layers were formed in patterns with through holes, some of which were plugged by coating.The cirsuits were of .0508 lines. mm (2 mils) and spaces of .0508 mm (2 mils) and tracks of .1016 - .1524 mm (4 and 6 mils) A structure with 4 layers of metal circuit is manufactured from pairs of double circuits side when interlaying tie layers between double-sided circuits The bonding layer material was DuPont 300KJ, a 3 mils thick thermoplastic polyimide film The same path pattern present in the flexible circuit double side is punched into the joint layer with a punch of .1016 mm (4 mils) .The joint fold layer is placed in the vacuum nest of the stencil printer.The pattern of track in the metal stucco registers in the union fold path pattern. The track filling material of Example 5 is applied to the stencil and using stencil parameters familiar to those skilled in the art, the via paste is printed on the binder fold pathways.

The assembly is stacked are 2 pairs of sirsuitos of double side without filling, interspersed are a sapa of fold of union stuffed and laminated in a prenea hydraulisa. The program of lamination soneiete of saltntar lae platinae of prenea at 300"C during a period of 25 minutes under a pressure of 28.12 kg / cm2 (400 pei) .The system is maintained at a temperature under pressure of 28.12 kg / cm2 (400 psi). ) for 30 minutes and then cooled to room temperature for a period of 30 minutes, while remaining at the lamination pressure.The somatic laminates are provided by the sonicator, all of which have a resistivity of less than 50 misro ohm.

A preferred track filler material is prepared as follows. A mixture of 81.9% Shell Epon 828 epoxy resin and 18.1% by weight of rough maize was ground until the rough maize was milled and mixed with the resin to a lechoe appearance. 3.6 grams of copper powder as described in Example 4 are added to 2.4 grams of the above resin mixture. The copper mixture is then added in a laboratory roll mill to die and reduce the agglomeration in the copper powder. 7.2 gram of tin / lead eolder powder 63/37 as described in Example 4, they are added to 3.9 grams of the copper mix and mixed with a high speed mixer. The resulting paste is subjected to vacuum for 15 minutes at room temperature in order to remove trapped air. AXLE 8 Structures with the two intercontracted circuit layers are the tie-fold layer using track filler material of Example 7, were manufactured as follows. The one-sided tubes are manufactured by Sheldahl from Novaclad ™ flexible liquid material. The cirsuitos formed in patterns are 4 grids of segment that are soneieten of paree of .1524 or .254 mm (6 or 10 mils) are states of strokes of .1524 mm (6 mils) and designed in such a way that the eegmentoe ee sonestaron eléstrisamente deede lae sapae de sirsuito through viae in lae sapae of union fold. The crepe sapa material was a laminate of thermofixed polyimide adhesive, with a thickness of .0254 mm (1 mil) thermoformed on both sides of DuPont Kapton ™ of .0254 mm (1 mil). A track pattern was punched with .1016 and .1524 mm (4 and 6 mile) orifices in the joint folds, so that the .1524 mm (6 mile) lines lined up are the .254 mm soya ( 10 mils) in the folds of sirsuite and the tracks of .1016 mm (4 mils) lined are the .1524 mm (6 mils) cushions and in the cirsuito folds. There were 2,400 tracks in total and 600 tracks in each of the 4 gratings screened per junction fold.

The joining fold flaps were loosened in the vault assembly of the stationary printer. The pattern of via in the metal ethereal was recorded in the pattern of junction fold pathway. Track filler material of Example 7 is apposed to the stensil and using parameters of family structure to which the dexterity is in the teresis, the track palette is printed in the connecting fold path. The assembled piled up are 2 strands of sirsuito of a single side interspersed and lined up they are a sapa of union fold stuffed and laminated in a hydraulics press. The lamination program was prepared by pressing the press plates at 200 ° C for a period of 25 minutes under 21.09 kg / cm2 (300 psi) of pressure. The seventh ee keeps at a temperature ?? (300 pei)? for 1 hour and then cooled to room temperature for a period of 30 minutes while being maintained under lamination pressure. Values of inessial resistances were read for the laminated sadatenae in sada. The assemblies were subjected to air-to-air thermal shock test, -55"C to 125 ° C, 3 shekels per hour, to 2.00 cisloe, and the tests were less than 5% sambio in resistance.

EXAMPLE 9 A six-layer metal structure fabricated from double-sided cirsitutes are through-holes coated using the track filler material of Example 4 as follows. A structure with 6 layers of metallic circuits is fabricated from pairs of double-sided syringes when interlacing joining folds between the double-sided circuits. The double-sided circuits were manufactured by IBM. The cirsuitos were designed are sentral grids of .508 mm (20 mils) of vias are three types of track / surface patterns; .1016 mm (4 mils) holes on surfaces of .1016 mm (4 mils) holes of .1016 mm (4 mils) on surfaces of .1524 mm (6 mils) and holes of .1524 mm (6 mils) on surfaces of .0254 mm (10 mils). All holes were punched in size before coating. Each track hole / previous surface type is implemented in three sub-grids of 480 track connections each of stacked configuration (connects layer 1 through layer 6), buried (connects layer 2 through the layer 5) and blind (connects layer 1 through layer 5). The binding fold material was a laminated composite of terraofija polyimide adhesive with thickness of .0254 mm (1 mil) heat-bonded on both sides of DuPont Kápton "* of .0254 mm (1 mil). the union folds with tracks of .1016 mm and .1524 mm (4 and 6 mils), so that the lanes of .1524 mm (6 mils) aligned are the routes of .1524 mm (6 mil) or sojines of .254 mm (10 mils) in the sirsuite pits and the .1016 mm (4 mils) tracks lined the .1016 mm (4 mil) tracks in .1016 mm or .15.24 mm (4 or 6 mil) ) in the circuit layers, the joining folds and the circuit layers were individually placed in the vacuum assembly of the stencil printer, and the stickerets were punched with the track pattern for each layer. The metallic fillings were recorded with the corresponding track patterns in the cirsuite and junction fold layers. With stancing and using stamping parameters with stenciling with skill in the art, the track paste was printed on the joining fold pathways. The layers were then spread or subjected to stages under a nitrogen atmosphere for 30 minutes at 100 ° C. The sapas were stacked are three-sided sirsuito sapas, interspersed and aligned, they are filled filler seams and laminated in a hydraulic press. The lamination program was used to disperse the pressure plates at 200 ° C for a period of 25 minutes under pressure of 21.09 kg / cm2 (300 psi). The system was maintained at 200 ° C and pressure of 21.09 kg / cm2 (300 psi) for 1 hour and then cooled to room temperature over a period of 30 minutes, while adhering to the lamination preion.

They were read valium of inisial resietensia for the 9 gratings densified in the laminate. The assemblies were subjected to a variety of aseleradas tests. One assembly was tested air-to-air heat shock from -40 to 135"C per 1,000 systems and completed the test without replenishment on all the grids.A second mount was exposed to 1,000 systems of air-to-air heat shock. 55 to 125 ° C are eimilaree results.A terser montage exposed to 300 liquid-to-liquid thermal shocks of -55 to 125 ° C are eimilaree result EXAMPLE 10 Eretrusturae are two intersubstantial metallized layers are a joint fold sapae using track filling material of Example 1, were fabricated as follows: Untreated 28.35 g (1 oz) sachet sheets were laminated on both sides of a tie-forming sap formed in pattern are .2032 mm (8 oz. mils) and filled are the filled-in-place somposistion of Example 1. The bonding material was a three-sstrussion .0762 mm (3 mils) of Courtauld Z-flex adhesive of .0254 ram (1 mil) coated on both sides of .0254 mm (1 mil) polyimide film. The joining fold is supplied with a polyester (Mylar ™) .0254 mm (1 mil) release film bonded to both adhesive surfaces. Union fold sheets were added at 12.7 x 12.7 sm (5x5 inch) and punched in .2032 mm (8 mils) orifices in a grid pattern spaced 1.143 sm (0.45 inch). The folds are tapered or adhered to a stamping assembly by date and using the sheet for stapled release of the sonosat more than a sontaste and using stamping parameters for family stanzas. These are dexterity in the stain, the staple are filled with the staple. Filling paste tracks. The release sheets were then removed from the amboe ladoe of the attachment fold. A filled binder fold is then stacked in a laminating hole between 12.5 x 12.7 cm (5 x 5 inches) sheets of untreated 28.35 grams (1 oz) copper and rolled in a hydraulic press. The press platens were heated at 200 ° C for a period of 25 minutes.The system is maintained at 200 ° C for a period of 60 minutes and then cooled to room temperature for a period of 15 minutes while maintaining a preemption of The copper on one side of the laminate is chemically etched in a grid pattern of sapure cushions in such a way that all of the soya were in sontasto are one way and hisiera connection are the way and through the joint sapa the sheet of envelope on the other side of the joining fold The laminate is filled with 223 ways are connections from the background plane to the sojinee of individual sapure.

While the above details are considered to be the preferred embodiments of the invention, no material limitations are intended to the scope of the claimed invention. In addition, characteristics and design alternatives that may be apparent to a person of ordinary skill in the art are considered incorporated herein. The scope of the invention is established and particularly described in the claims to continuation.

Claims (109)

1. An interoperable sompoeission adapted to form an elastically hard-to-sound, sarasterized somposision because it comprises: (i) at least one material in the phase of high-melting particle; (ii) at least one material of low melting point; and (iii) an organic portion that dyes a resin and an entanglement agent, wherein the organic portion does not generate adverse gassing sanctities upon salting out the sompoeition at a temperature of about 400 ° C at a pressure of at least about 703 kg. / cm2 (10 pei).

2. The composition of sonicity with claim 1, characterized in that the high-melting partisulae fae material is chosen from the group of all metals of group 3A to 6B of the Periodic Table exluding Hg, Ga and In.

3. The soniposity somposission is claim 1, which is sarasterized because the material in the high-melting particle phase is chosen from the group consisting of envelope, nickel, gold, silver and its symbiones.

4. The sompoeisión of sonformidad are the reivindisasión 1, sarasterized because the material of high melting point is on and the material of low melting point somprende an agent eelessionado of the group that were: dysprosium, erbium, europium, gallium, gadolinium, germanium, hafnium, mersurium, indium, lanthanium , magneium, neodymium, phosphorus, palladium, praedemimium, platinum, sulfur, selenium, antimony, silisium, samarium, tin, estronsium, tellurium, thorium, titanium, thallium, yttrium, ytterbium, zins, zirsonium and their symbiones.

5. The somiposity of sonformity are the claim 1, characterized in that the material of low melting point is tin or alloys containing tin.

6. The composition according to claim 1, characterized in that the material in phase of high-melting particles is over, the material with low melting point is eetaño or aleasión sonetiéeta eetaño, and the molar proporsión of the envelope to eetaño It is in the range of approximately 3: 1 to approximately 0.9: 1.

7. The somposission of sonformity is the reivindisasión 1, sarasterizada because the resin is an epoxy.

8. The statement of conformity with the claim 7, characterized in that the epoxy is diglycidyl ether of bisphenol A.

9. The formulation according to claim 1, characterized in that the material in phase of high melting point particles comprises copper particles < Having an average particle diameter of from about 1 to about 6 microns, the low-point material of the presentment contains eutystissed stalk / pseudo allelision particles which have an average particle size of from about 1 to about 10 misrae, and organelle comprises epoxy, dodesenileussiniso anhydride and harsh malyx.

10. The sompoesion of sonformity is claim 9, which is sarasterized because the epoxy is diglycidyl ether of bisphenol A. il.

A somposistion adapted to form an electrically conductive myopressurgery, the somposission is sarasterized because it comprises: (i) from about 2 to about 90% by weight of at least one material in the phase of high melting point particles; (ii) from about 4 to about 93% by weight of at least one low melting point material? and (iii) from about 1 to about 35% by weight of a combination of at least one resin and at least one entanglement agent.

12. The composition according to claim 11, characterized in that the material in fae of high melting point particles is chosen from the group consisting of envelope, nickel, gold, silver and its sobinasiones.

13. The sompoeission of sonformity with claim 12, sarasterized because the low point material ie tin oxide or an aleasion containing ethane.

14. The sempoeición of sonformidad with the reivindisasión 13, sarasterizada porqué the material in faee of partisulae of high melting point is on and the molar proporsión of on to tin, it is in the range of approximately 3.1 to approximately 0.9: 1.

15. The somposision of conformity with claim 11, sarasterized because the resin is epoxy.

16. The somposission of sonformity is the reivindisasión 11, sarasterizada because the composition forms a misroeetrustura that somprende a faee intermetálica subetancialmente sontínua.

17. The somporeality of the deformation with claim 11, characterized in that the material of high-melting particle fraction comprises from about 10 to about 90% by weight of the deposition, the low-melting material constitutes from about 10 to about 90% by weight of the composition and the resin At least and the minimum interlacing agent is from about 3 to about 30% by weight of the deposition.

18. The compliant composition according to claim 17, characterized in that the composition forms a misro-structure comprising an intermetallic phase substantially sonicate.

19. The sonority chemistry is claim 16, characterized in that the high-melting particulate phase material is copper and constitutes from about 17 to about 47% by weight of the composition, and a low melting point material. A eutheist mixture of ethanol and lead that is from about 37 to about 72% in the case of somposission.

20. The sonformity somposission is the claim 19, characterized in that the resin and the entanglement agent constitute from about 5 to about 25% by weight of the somposission.

21. A somposition adapted to form a microstrict isdústora, sarasterizada the somposision because somprende: (i) sobre or aleasiones that are on, in partisulas and tin or aleasiones that tin tin, in particles, selected in appropriate proporsiones to allow the formaión of a subetansially sontinuous phase of a super-tin intermetalism in the microstructure; and (ii) from about 5 to about 25% by weight of a corabinasion of at least one resin and at least one entanglement agent,

22. The dissolution of sonification is claim 21, characterized in that the composition forms the substantially continuous phase of the intimated overprinting in the misroestrustura to menoe partly by a proseeo in transient liquid faee.

23. An electrically conductive misroestrustura adesuada to form a stuffed or filled aperture in an erelestronic assembly, the misroeetrustura somprende a phase intermetálisa subetansially monolitisa formed from (i) to me? Oe a material in phase of particles of high melting point and (ii) to the materials a low melting point.

24. The electrically sound mississtructuring structure is claiming 23, which is sarasterized because the subestansially fflonolytic intermetallial phase is formed at least in part by a transient liquid phase which suffers from the material of low melting point as a minimum.

25. The misestruuture eléstrisaraente sondustora in accordance with claim 23, sarasterizada because the material in phase of particles of high melting point ee chooses the group that were of Copper, nickel, gold, silver and their sombinations.

26. The conductive electrically conductive misrostructure is claim 25, characterized in that the low melting point material is tin or a aleasion which are tin. 2Í.

The conforming electrically conductive misroestrust is claim 26, characterized in that the misroestrust has an elusive resistivity of less than 50 micro ohm centimeters.

28. The electrostatic dielectric microstrip is the claim 26, which is sarasterized because the high-melting partisulae de fae material is envelope particles having a particle size of about 1 to about 6 misrae, and the molar propionization of the about the eetaño eetá in the range of approximately 3: 1 to approximately 0.9: 1.

29. An electrically conductive mis-structure adesuada to form a stuffed or filled-in aperture in an astronomical assembly, the microtexture presents a copper-stained intermetallic structure, in which the intermetallic structure represents at least a majority of the misroestrustura.

30. The misroestrust in accordance with claim 29, characterized in that the intermetallic composition is selected from the group consisting of Cu3Sn, Cu6Sns, and combinations thereof.

31. The misroestructure according to claim 29, sarasterized because the intermetallic fillet substantially resists all the misroestrustura.

32. A sub-stratum having an elusively scattering tray that extends through the substrate to provide an elongated connection from one substrate sara to another one from the sub-stratum; the substrate defines a passage that extends through the substrate from one sara to the other sara; and a misroestrustura eléstrisamehte condustora dispueeta in the paeaje, misroeetrustura somprende a substantially continuous intermetallic phase formed of (i) at least one material in phase of particles of high melting point, and (ii) at least one material of low melting point .

33. The substratum of sonformity are the claim 32, characterized in that the material in phase of high melting point particles is chosen from the group consisting of copper, nickel, gold, silver and their combinations.

34. The sonformidád substrate are the reivindisasión 33, sarasterized because low melt weight material is tin or a tin-containing aleasion.

35. The substrate in accordance with the claim 34, sarasterized because the material in phase of high melting point particles is over and the reversion of the envelope to tin is in the range of about 3: 1 to about 1.2: 1.

36. The substratum of sonformity is the vindication 32, sarasterized because the substrate has at least one sojin of squeeze or a trace of sircuito disposed on the face and in sontasto eléstriso are the misroestrustura.

37. Uh subetrato having an electrically sound tray extending across the sub-stratum to provide elongated connection from one side of the substrate to another side of the substrate; the subetrato defines a passage that extends through the subetrato from one side to the other; and an electrically dispersed misroestrust in the paeaje, the mise-structure comprises an intermetallic copper-ethane compound, wherein the intermetallic composite constitutes at least a majority of the microstrict.

38. The substratum of sonformity is the vindication 37, sarasterized because the intermetallic set is chosen from the group that was made up of Cu3Sn and its sombinasiones.

39. A substratum comprising a first sara, a second sara, and an elastically conductive coating disposed at least on one of the first side and the second side, the substrate defines a passage extending through a substrate from the first side. face to the second face, and an elastically disposed microstrust disposed in the passage, the misroestrusture has been produced from a somposission that is: (i) from about 2 to about 90% by weight of at least one material in phase of particles , high point of fire, (ii) from about 4 to about 93% by weight of a low melting point material, and (iii) from about 1 to about 35% by weight of at least one resin of less MU entanglement agent.

40. The substrate according to claim 39, characterized in that the somposisance ranges from about 10 to about 90% by weight of (i), from about 10 to about 90% by weight of (ii), and from about 3 to about 30% in payment of (iii).

41. The eformtrato of sonformidad are the reivindisasión 39, sarasterizado because the misroeetrustúra somprende a faee intermetálisa eubetansialmente continuous.

42. The conformity eubstrato is the reivindisasión 40, sarasterizado because the misroestrustura comprises a substantially continuous intermetallic faee.

43. A sub-stratum having an electrically-spacing trajectory extending through the sub-stratum to provide stratification at the bottom of a revealing layer is metal substantially from the substrate to another surface of the substrate; the substrate defines a passage extending through the substrate from one face to the other face; and an elastically slashed microstrust disposed in the passage, the mise-structure comprises a submetallically intermetallic fae of the intermetallic superimposed interoperability, the microetrustura has been produced from a sompoeission that appears (i) over or overlays that are in partisuiae, and tin or aleasion that are tin in particles, selessionadoe in appropriate proporsionpe to result in the subetanosially sontinuous phase of copper-tin intermetallic compound in the microeetrustura? and (ii) from about 5 to about 25% by weight in the combination of at least one resin and at least one entanglement agent.

44. The substrate according to claim 43, characterized in that the substantially continuous interstate phase is formed at least in part by a transient liquid phase.

45. An eclostróniso assembly, sarasterizado pprque somprende: a dielectric sapa that defines at least a passage that extends through the thickness of the sapa; and a somposission disposed within the passage, the somposisance (i) ranges from about 2 to about 90% by weight of at least one material in high-melting particle phase, (ii) from about 4 to about 93 in weight of at least one material of low point of fire and (iii) from about 1 to about 35% by weight of a combination of at least one resin and at least one entanglement agent.

46. The sonorous resonance assembly is claim 45, which is sarasterized because the somposisance ranges from about 10 to about 90% by weight dp (i), from about 10 to about 90% by weight of (ii) and from about 3 to about 30% by weight of (iii).

47. The electrostronic assembly of sonformity is the claim 45, characterized by the fact that the somposission produces an electrically conductive microstrust that has an electrothermal phase subetansially continuous before euphoric heating of the composition subjecting the ossioion to a suction pressure less than 703 kg / sm2 (10 psi).

48. The elestróniso assembly of sonformidad are the reivindisacióh 46, sarasterízado because the somposission produced an estrustrically conductive misroestrustura that has a substantially intermetallic phase Continuous before sufisiente saltiness of the sompoeisión under a pressure of at least 703 kg / sm2 (10 psi) •

49. The assembly of the sonority sonority is the vindication 45, characterized in that the sape dleléstritia has a first sara, a second sara opposite the first sara, and a plurality of passages extending through the sapa dieléstrisa, the assembly also somprende: a electron electron arranged in a first sara of the sapa dieléstrisa, the somponente elestróniso has one or irjás points on its lower side for connection sesestrisa; and a Substrate disposed next to the second sara of the dielectric sap, the substrate having one or more suction saps which correspond to the points on the lower side of the dielectric component; where the somposission is arranged in the plurality of passages defined in the sapa dieléstrisa.

50. The sonorous sonority assembly is the claim 49, which is sarasterized because the dispyeeta somposission in the plurality of passages defined in the dielectric sap provides the connection between the points for connection ßléstriaa dpi somponente elestróniso and the substrate of the substrate.

51. The electrostronic assembly of the sonformity is the claim 49, which is sarasterized because the dielectric sap is a film adhesive which, after proper heating, reliably fixes the electronic component to the substrate.

52. The electronic assembly is sarasterized because it appears: a dielectric sap that defines suas minus a passage that extends through the thickness of the sap; and a soraposisión diepüesta dpntro of pa ae, the sompoeisión somprende (i) on or alloy that contains on, in partisulas, and eetaño or aleaéión that are éetaño, in partisulae, eelessionadas in appropriate proporsiones to result in a substantially substantial air of sommet intermetáliso of over-eetaño before euphoric salinity of the cPmposisipn under a pressure of at least 703 kg / cm2 (10 psi); and (ii) from about 5 to about 25% by weight of a spmbinasion of at least one resin and at least one entanglement agent.

53. The conformity assembly according to claim 52, is sarasterized in that the somposistion is adapted to form the substantially continuous fasp of the intermetallic sPbre-tin assembly at least in part by a transient liquid phase process.

54, A multi-layered elestronic assembly, characterized in that it comprises: a first dielectric sirsuite board defining a first path extending through the first board; a second dielectric sirsuite board that defines a second path that extends across the second board; an interleaving sapa disposed between the first sirsuite board and the second sirsuite board, the interleaver layer defines an opening through the interleaver, wherein the first track; the second track and the opening are all aligned and immediately adjacent to each other; and an elastically disposed microeStricture disposed within at least one of the first pathway and the second pathway and the aperture, the microstrict is formed from a somposistion that is (i) from about 2 to about 90% by weight of at least one high-melting particulate phase material, (ii) from about 4 to about 93% by weight of at least one low-melting point material, and (iii) from about 1 to about 35% ert weighed from a at least one resin and at least one entanglement agent.

55. The electrostronic assembly of multiple sonicity sags is the vindication 54, sarasterized because the somposisance is approximately 10 to about 90% by weight (i) from about 10 to about 90% by weight of (ii) and from about 3 to about 30% by weight of (iii).

56. The multi-layered assembly of multiple Conformity flaps is claim 54, caratherized because the elastically conductive misroestrust has a substantially sonic intermetallial phase.

57. The electronic assembly of multiple layers of conformity cpn the reivindisasión 55, sarasterizado because the misrestricture lasestrisamente conductive has a phase intermetáüsa substansialmente sontínua.

58. A multi-layered elestronic assembly, characterized in that it comprises: a first dielectric truss board defining a first path extending through the first board; a second dielectric sissy board defining a second path extending through the second board; a sapa interposer sampler between the first cirsuito board and the second board of sircuito, the interlayer layer defines an opening through the interposer, where the first track, the second track and the opening, all are aligned and laid immediately adjacent to each other , and a sinterable and dispueeta somposition in at least one of the first way, the second and the opening, the composition somprpnde (i) on or aleasión ^ ue are on in partisulas and tin or aleasión that are eetaño Pn partisulas, sPlecaionadas in appropriate propions to allow for the formation of a substantially sonic phase of an over-tin intermetallic overlay; and (ii) from about 5 to about 25% by weight of a symbiosis of at least one resin and at least one entanglement agent, wherein before sufficient heating, the composition produces a microstrust comprising a subetansially continuous intermetall phase.

59. The electronic assembly of multiple sonicity sags is claim 58, which is sarasterized because the intermetallial phase substantially is formed at least in part by a transient liquid phase process.

60. The multi-layered assembly of multiple sounding savers is the prestressing 58, sarapterized because the opening defined in the interlayer sapa has the arrangement there disposed,

61. The multi-layered elestróniso assembly in accordance with claim 60, sarasterized because the first lane defined in the first board of sirsuito dieléstriCo has the somposision there disposed.

62. The multi-strand assembly of multiple sounding webs is the cross-strand 60, which is screwed in because the first path defined in the first sylsuite dielectric board is a first coated track.

63. The multi-sag assembly of multiple sapphires is claim 62, characterized in that the first coated path is a first serrated coated path.

64. The multi-layered assembly of multiple sonicity sags is the prestressing 62, which is sarasterized because the first coated path has the arrangement therein disposed.

65. The elestróniso assembly of multiple conformity sags are the reivindisasión 64, sarasterizado because the second via is a second coated route.

66. The elestróniso assembly of multiple splice savers is the reivindisasión 65, sarasterizado because the SPgunda via is a second serrated coated path.

67. The multi-strand assembly of multiple sonicity sags is the prestressing 65, sarasterized because the second coated path has the somposission there diepueeta.

68. The multi-layered elestróniso assembly according to claim 54, sarasterized because it also somprende: a suction sausage eléstrisamentp sondustor arranged around dp the periphery of at least one of the first path and the second via.

69 ,. A multi-layered elastronic assembly, characterized in that it comprises: a plurality of sirsuite boards arranged in stacked configuration, in the panel board generally superimposes a board, and at least one of the boards defines a path extending through the board; at least one interleaving sapa disposed between two of the plurality of sirsuite boards, wherein at least one interleaving saper defines an opening extending through the interleaver; and an electrically conductive misro structure disposed less suya in one of the path and the aperture, the misroestrusture formed by a somposission sonpiste esensialmentp of (i) a phase in particles of high melting point, (ii) a material of low melting point and (iii) an organic portion comprising an epoxy resin, an entanglement agent and a suction-fluxing agent, wherein the organisation does not generate adverse sanctities of volatile gases when salting at a temperature of 400 ° C at a pressure of 50 ° C. minus .703 kg / cm2 (10 pei).

70. The erection of multiple sonicity sapes is the claim 69, characterized in that the plurality of cirsuite planks include a first board that has the track, a second board that comprises a cushion dp elstrisamente sonductor and the opening defined in the sapa intérsaladora has the somposision there disposed.

71. An electronic assembly characterized by the fact that it consists of a symmetric dielectric board that defines a path that extends through the thickness of the board; an interlocking sapa arranged adjacent to the sirsuite board, the sapating saper defines an opening extending through the interlayer; and a stratigraphically strained misroestrust disposed less in one of the pathway and aperture, the mistrust comprises a substantially monolithic intermetallic faεe formed from (1) at least one material in the phase of high melting point particles and (ii) at meno§ a material dp low melting point.

72. A sonorous resonance assembly is claim 71, which is sarasterized because the misestrument is die in the aperture defined in the interlayer sap, and the material in high-melting particle phase is selected from the group consisting of sap, nickel, gold, silver and its sombihasipnes.

73. The sonority sonority assembly is the claim 72, characterized in that the phase in high melting point particles comprises envelope particles having an average particle size in a range from about 1 to about 6 misters, the low point material. When melting is tin or a aleasion which is tin in the form of particles having an average diameter of about 1 to about 10 misters, the reversion of over to tin is in the range of about 3: 1 to about 0.9: 1.

74. an erelestronic assembly, sarasterized because it consists of: a dielectric sirsuite board that defines a path through the thickness of the board; an interlayer sapa arranged adjacent to the sirsuite board, the interlayer sapa defines an opening that extends through the intersalary, and an electrically dispersed missile structure suando menoe in one of the path and an opening, the misroestrustura somprende a sommet intermetalism of saber- Tin, where the intermetallic set consists at least a majority of the misroestrustur.

75. The erection of the solenoid is of the strength of claim 74, characterized in that the misrostructure is arranged in the opening extending through the irttprpaiador and the intermetallic compound is selected from the group consisting of Cu3Sn, CußSnB, and their combinations.

76. The electrosurgical assembly of the sonformity is the claim 75, drastically because the intermetallic set up sub-substansially reflects the totality of the misesteem.

77. h montage elestróniso, sarastPrizado because somprende: a first dielectric eubetrato that somprénde a first sojín of saptura eléstrisamente sondustor in a sara of the first eubstrato; a second dielectric subetráte comprising a second electrically sondust capture pad in a beam of the second substrate; an interleaver sapa placed between the first substrate and the second subetrato, the interleaver layer defines at least one opening; and an electrically conductive misroestrustura disposed suando menoe in an aperture defined in the intersailer, the mistrust consists of an interweaved eubetansialmertte sontínua fae formed from (i) at least one material in phase of high melting point particles and (ii) at least a material with a low melting point.

78. The eiestróniso assembly in accordance with claim 77, characterized in that the first capture sojín, the second sop dp capture and at least one aperture ti nen the microstrust there arranged and are aligned with each other and form a tray lasestrisamente sondustora.

79. The sonoreson mounting of sonfrmity is claim 77, characterized in that the interlayer saper has a plurality of openings, wherein all the pluralities of openings have the misrostructure therein disposed.

80. A method for forming an electrostatic assembly of multiple stacked piles, which includes at least one serving board, at least one interposing sap, and at the other a spacing-like misroestrust which extends through the intermesher and a supraphysie adyasente of at least a board, the prosheoper sarasteriza because somprende: provide at least one board of cirsuito and to mehos a sapa intersaladora, the entresalador defines an opening that extends through the entresalador; The filling of the opening is an electrically sound scattering which includes (i) a material in the phase of high melting point patties, (ii) a material of low point of fire and (iii) an organic portion having a rpsin and an agent of interlacing; splodging the minimum cube board and the intervener as a minimum in a configuration stacked inside a lamination press; apply a rolling force to the assembly; heating the assembly to a lamination temperature while maintaining the laminating force; maintain the lamination temperature until the vacuum is sure to be dry; they are 10 that the composition produced a misroestruotura eléstrisamente sondustora.

81. The sonification procedure is the claim 80, which is sarastérized because, in addition, it consists of forming a rhapsum of at least one sirsuite board and at least one interleaver in the stacking configuration in the lamination press.

82. The sonic restructuring is the re-indistinction 81, which is characterized by the vacuum formed with respect to the stacked sonication, which is approximately 1 mm Hg. 33.

The resiliency of the sonformity is the superstructure 81, which is sarasterized because the laminating force is at least about 703 kg / cm2 (10 psi).

84. The performance of the soundness is the claim 80, which is sarastered because the lamination temperature is in the range of about 20 ° C to about 400 ° C.

85. The performance of the sonformity is claim 84, characterized in that the lamination temperature is in the range of about 180CC to about 325 ° C.

86. The sonic deformation is the sanding, 80, because the lamination temperature is maintained for a period of about 5 minutop to about 1 hour.

87. The performance of the sonformity is the claim 80, which is sarasterized because the assembly of multiple flats is subjected to the lamination temperature only once during profiling.

88. The resiliency of the sonformity is the prestressing 80, characterized in that the compsisión comprises from about 2 to about 90% by weight of (i), from about 4 to about 93% by weight of (ii), and from about 1 to about 35% by weight of (iii).

89. The pseudo-sounding condition is claim 88, characterized in that the deposition comprises about 10 to about 90% by weight of (i), about 10 to about 90% by weight of (ii), and about 3 to about about 30% by weight of (iii).

90. The method according to claim 88, characterized in that the misroestrustura subtransially synthetizes an interstate phase.

91. The restructuring of the sonformity is the reinvindisation 89, which is sarasterized because the misroetrustura suffers a substantially stylistic interstellar phase.

92. The restructuring of the conformability is the vindication 90, sarasterized because the somposisium is formed on or alloy that contains copper, in particles and tin or alloy that optiniPne tin, in particles, selessionadas in suitable proporsiones to result in the subetanpially continuous phase of the intermetallic compound of copper-tin in the micro-crevice, and from about 5 to about 25% by weight of the composition of at least one resin and at least one entanglement agent, wherein the resultant misroestrust is a continuous substantially continuous intermetallic phase.

93- The procedure of soundness is the rpivindisasión 92, sarasterizado because the fae intermixed eubstansially continuous is formed at least in part by a prosheo in fae liquid traneitoria.

94. The multi-layered multi-layered sapae stacking assembly is the claim 80.

95 * The multi-layered moiety of multiple layered piles of sonicity is claim 81.

96. The electronic assembly of multiple layered piles of lamellae is claim 87.

97. The electronic assembly of multiple stacked layers of soundness is the claim 91.

98. A step to form a multi-layered, multi-layered assembly, sarasterized because a first substrate having sondust material disposed less sura in a sara, a second substrate that defines a passageway extending through the second substrate from a first side to a second side and a diepoetal somposibition in the payee, the soraposission ranges from about 12 to about 90% by weight of at least one high-phase particulate phase material melting point, from about 4 to about 93% by weight of at least one mater With a low melting point, and from about 1 to about 35% by weight of a combination of at least one resin and at least one interlacing agent, the process is sarasterized because the first substrate and the second substrate in the arefiguration stacked inside a lamination press; to apply a lamination force to PrPrPr and SGgun substrates; discharging the first and second suction at a laminating temperature while maintaining the laminating force; and keep the temperature of the lamination until the somposission sura to form a misroestrustura eestrisamente sondustora.

99. The resiliency of the sonformity is the prestressing 98, which is sarasterized because the composition ranges from about 10 to about 90% by weight of at least one material in the high-melting particle phase, from about 10 to about 90% by weight of the material of low point of fire somo minimum, from approximately 3 to approximately 30% in peeo of the symbiosis of at least one resin and at least an entanglement agent.

100. The prosedimiento dP sonformidad are the reivindisasión 98, sarasterizado because the myostructure somprende a fasp intermetálica eubstánsialmente sontínua.

101. The prosecution of sonforraidad are the reivindisasión 99, sarasterizado because the misroestrustura soraprende a phase intermetálisa substansialmente sontínua.

102. The performance of the sonformity is claim 98, characterized in that the somposission comprises over or allegation that they are on, in particles and tin or aleasion which are tin, eh particles, selected in suitable proportions to result in a substantially continuous phase of intermetallic compound. copper-tin in the microstrict and from approximately 5 to approximately 25% by weight dP at least one resin and at least one entanglement agent, wherein the somposission produced the misrastress that results in a substantially tin-copper intermetallic phase. .

103. The restructuring of the sonformity is the PRIORIZATION 102, which is sarasterized because the intermetallic phase of over-tin is formed at least partially by a traedient liquid phase.

104. The erelestronge assembly of multiple eaves formed by the sonicity method is the reivindisasión 98.

105. The electronic assembly of multiple layers formed in the shape of the sonde is the claim 99.

106. The multi-sapphire assembly of multiple sap formed in the shape of the sonde is the claim 100.

107. The assembly of the multipronse dP sapphire formed in the shape of the sonde is the claim 101.

108 The electronic multiple-layer assembly is formed in accordance with claim 102.

109. The multi-layered, multi-layered assembly formed of the sonde with the claim 103.