MXPA06009092A - Overcoat lacquer - Google Patents
Overcoat lacquerInfo
- Publication number
- MXPA06009092A MXPA06009092A MXPA/A/2006/009092A MXPA06009092A MXPA06009092A MX PA06009092 A MXPA06009092 A MX PA06009092A MX PA06009092 A MXPA06009092 A MX PA06009092A MX PA06009092 A MXPA06009092 A MX PA06009092A
- Authority
- MX
- Mexico
- Prior art keywords
- weight
- component
- coating varnish
- varnish
- acid
- Prior art date
Links
- 239000004922 lacquer Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 22
- 239000000194 fatty acid Substances 0.000 claims abstract description 22
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 22
- 229920000180 Alkyd Polymers 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 19
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 7
- RXOHFPCZGPKIRD-UHFFFAOYSA-N 2,6-Naphthalenedicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract 2
- 239000002966 varnish Substances 0.000 claims description 50
- 239000011248 coating agent Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 22
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000003607 modifier Substances 0.000 claims description 5
- QQVIHTHCMHWDBS-UHFFFAOYSA-N Isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N Oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000002274 desiccant Substances 0.000 claims description 4
- GYUVMLBYMPKZAZ-UHFFFAOYSA-N dimethyl naphthalene-2,6-dicarboxylate Chemical compound C1=C(C(=O)OC)C=CC2=CC(C(=O)OC)=CC=C21 GYUVMLBYMPKZAZ-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 4
- 239000011877 solvent mixture Substances 0.000 claims description 4
- DTOSIQBPPRVQHS-PDBXOOCHSA-N α-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 claims description 4
- WHIVNJATOVLWBW-SNAWJCMRSA-N Methylethyl ketone oxime Chemical compound CC\C(C)=N\O WHIVNJATOVLWBW-SNAWJCMRSA-N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 238000006011 modification reaction Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- OYHQOLUKZRVURQ-HZJYTTRNSA-N 60-33-3 Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- GUBGYTABKSRVRQ-UUNJERMWSA-N Lactose Chemical class O([C@@H]1[C@H](O)[C@H](O)[C@H](O)O[C@@H]1CO)[C@H]1[C@@H](O)[C@@H](O)[C@H](O)[C@H](CO)O1 GUBGYTABKSRVRQ-UUNJERMWSA-N 0.000 claims description 2
- 229960004488 Linolenic Acid Drugs 0.000 claims description 2
- 229960002969 Oleic Acid Drugs 0.000 claims description 2
- 239000005642 Oleic acid Substances 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N Phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 2
- 229960001295 Tocopherol Drugs 0.000 claims description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 claims description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 2
- LKVLGPGMWVYUQI-UHFFFAOYSA-L calcium;naphthalene-2-carboxylate Chemical compound [Ca+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 LKVLGPGMWVYUQI-UHFFFAOYSA-L 0.000 claims description 2
- 239000003426 co-catalyst Substances 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- JGJWEXOAAXEJMW-UHFFFAOYSA-N dimethyl naphthalene-1,2-dicarboxylate Chemical compound C1=CC=CC2=C(C(=O)OC)C(C(=O)OC)=CC=C21 JGJWEXOAAXEJMW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 230000002401 inhibitory effect Effects 0.000 claims description 2
- GUBGYTABKSRVRQ-XLOQQCSPSA-N lactose Chemical class O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)O[C@H](O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-XLOQQCSPSA-N 0.000 claims description 2
- 239000008101 lactose Chemical class 0.000 claims description 2
- 229960004232 linoleic acid Drugs 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 235000010384 tocopherol Nutrition 0.000 claims description 2
- 239000011732 tocopherol Substances 0.000 claims description 2
- 229930003799 tocopherols Natural products 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium(0) Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 claims description 2
- 239000003784 tall oil Substances 0.000 claims 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N Toluene diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052803 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 125000005474 octanoate group Chemical group 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 235000019198 oils Nutrition 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N Propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000011152 fibreglass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- -1 selective immersion Substances 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N Isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229920001225 Polyester resin Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- QAEKNCDIHIGLFI-UHFFFAOYSA-L cobalt(2+);2-ethylhexanoate Chemical compound [Co+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O QAEKNCDIHIGLFI-UHFFFAOYSA-L 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ORDSZCXGICENNU-UHFFFAOYSA-L lead(2+) dihydride;octanoate Chemical compound [PbH2+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O ORDSZCXGICENNU-UHFFFAOYSA-L 0.000 description 2
- 238000011068 load Methods 0.000 description 2
- 101700000038 mpas Proteins 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- CCEFMUBVSUDRLG-BBBLOLIVSA-N (+)-trans-limonene oxide Chemical compound C1[C@H](C(=C)C)CC[C@]2(C)O[C@@H]21 CCEFMUBVSUDRLG-BBBLOLIVSA-N 0.000 description 1
- CCEFMUBVSUDRLG-KXUCPTDWSA-N (4R)-limonene 1,2-epoxide Natural products C1[C@H](C(=C)C)CC[C@@]2(C)O[C@H]21 CCEFMUBVSUDRLG-KXUCPTDWSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- BDQNKCYCTYYMAA-UHFFFAOYSA-N 1-isocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1 BDQNKCYCTYYMAA-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- JFMGYULNQJPJCY-UHFFFAOYSA-N 4-(hydroxymethyl)-1,3-dioxolan-2-one Chemical compound OCC1COC(=O)O1 JFMGYULNQJPJCY-UHFFFAOYSA-N 0.000 description 1
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-Methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 1
- OXQXGKNECHBVMO-UHFFFAOYSA-M 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)[O-])CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-M 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bis(4-hydroxyphenyl)methane Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N Diphenylmethane p,p'-diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N Hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N Isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N Methyl isopropyl ketone Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 1
- 240000005158 Phaseolus vulgaris Species 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N Phenylisocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001228 Polyisocyanate Polymers 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N Propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N acetic acid ethyl ester Chemical group CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000003197 catalytic Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical group CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 150000002597 lactoses Chemical class 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical group C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPYXFMVJXTUYRV-UHFFFAOYSA-J octanoate;zirconium(4+) Chemical compound [Zr+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O BPYXFMVJXTUYRV-UHFFFAOYSA-J 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N γ-lactone 4-hydroxy-butyric acid Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention relates to an overcoat lacquer containing a) at least one binding agent containing alkyd resins made from tris-(2-hydroxylethyl)-isocyanurate, 2,6-naphthaline dicarboxylic acid, drying fatty acids, and, optionally, other components known from alkyd resin chemistry, b) at least one solvent or at least one technical solvent or mixture thereof based on hydrocarbon and c) at least one siccative or at least one mixture of siccatives or several anti-skinagents.
Description
VARNISH FOR COATING The present invention relates to an air-dried varnish particularly suitable for coating flat modules in electronics, hybrids, SMD modules, and printed circuit boards which is subject to a high thermal load. The varnish can also be used to impregnate electrical windings or as a protective varnish for electrical windings. A coating varnish for flat modules, hybrids, SMD modules and other components used in printed circuit boards is required to protect varnished components from moisture, chemicals, dust, etc. The additional intention is that the protective coating should increase the safety of electronic modules with respect to weather and tracking current. The capacity to withstand the thermal load must be correct for the field of use. Typical varnishes have a temperature index (T > I) of 130. The desire, particularly in the automotive industry, is that a coating varnish has an TI greater than 155. Effective adhesion is assumed to be a reality. to a variety of substrates. The processing is typically by selection, coating, selective immersion, spray or injection process. With a varnish of this type, a thickness of the film is 10 μm or more.
The cutting-edge technology is the use of air-dried or oven-dried varnishes. The binder is typically an alkyd resin, an acrylic resin or a polyurethane resin. It has been known for a long time about alkyd resins for surface protection and has also been described for a long time (W. Oburger, Die Isolierstoffe der Elektrotechni, Springer 1957. Tillar Shugg, Handbook of Electrical and Electronic Insulating Materials IEEE Press 1995) . Alkyd resins can be formulated as such or as modified resins (imide, urethane), without or with additional curing agents (melamine resins, phenolic resins, (blocked) isocyanates) in organic solvents. These varnishes are of low viscosity and in addition to the binders comprise catalysts and additives. It is known that alkyd resins are not particularly stable at temperature, but have the advantage that, given the correct composition of binders, they can be dried by air, and thus allow an effective process in cost. Where tris (2-hydroxyethyl) isocyanurate is incorporated into branched polyester resins or modified polyester resins, products are obtained which have a relatively high thermal rating (K-.Lienert, Poly (ester-imide) s for industrial use, p 48,
in Progress in Polyimide Chemistry, vol. 1441, 1999). Moreover, EP 0 813 580 describes how using the naphthalenedicarboxylic acid structures in place of the typical structures of terephthalate in modified polyesters and polyesters likewise leads to an improvement in the thermal properties. The problem is solved by the present invention by providing a varnish for air-dried and low viscosity coating for coating flat modules, hybrids, SMD modules, etc., which can be processed with typical lines and having an IT or IEC 60216 of at least less 155. This problem is solved by a coating varnish comprising: a) at least one binder comprising alkyd resins synthesized from tris (2-hydroxyethyl) isocyanurate, 2,6-naphthalene dicarboxylic acid, drying fatty acids, and, if desired, additional known components of the alkyd resin chemistry, b) at least one solvent of at least one technical solvent mixture thereof comprising at least one solvent containing hydrocarbons, and c) at least a secant or at least a mixture of siccatives and one or more anti-scaling agents. According to the invention, the alkyd resin is dissolved in the solvents together with the siccatives and others
auxiliary This produces a varnish that, depending on the concentration of agglutinator and solvent composition, has different viscosities. Typically, varnishes for coating flat modules in electronics, hybrids and SMD modules have viscosities of between 100 mPas and 400 mPas, depending on the application, the processing technology and the thickness of the desired layer. According to the component of the invention a) it comprises at least one binder which is prepared through the reaction of tris (2-hydroxyethyl) isocyanurate, 2,6-naphthalene dicarboxylic acid, drying fatty acids and other known components of the alkyd chemistry.
Preferably component a) consists of a binder. Preferably the binder contains 33.0% - 50.0% of tris (2-hydroxyethyl) 9-isocyanurate, preferably 37.0% - 45.0%, more preferably 38.0% - 43.0% 14.0% - 20.0% of dimethyl-2,6-naphthalene-dicarboxylate, preferably 15.0% - 19.0%, more preferably 16.0% - 18.0% 34.0% - 47.0% talloyl fatty acid, preferably 38.0% - 44.0%, more preferably 40.0%
- 42.0%. This resin can, according to the invention
contain 1.0% - 15.0% of a modifier, an example is a mixture of toluene 2,6- and 2,4-diisocyanate. The preparation of alkyd resins is common knowledge and can be found in several standard works of the chemical literature. It involves the heating of the components, with or without an esterification catalytic, typically at temperatures between 190 and 240 ° C. The reaction is typically carried out under an inert gas. In order to facilitate the expulsion of the formed water it is possible to use an azeotropic mixture, an additional agent, and / or vacuum. The monitoring of the condensation course is typically achieved by determining the acid number and / or the condensation viscosity. The constituents of an alkyd resin are polyols, polycarboxylic acids, and fatty acids. Polyols that may be used include, in addition to the tris (2-hydroxyethyl) isocyanurate of the invention, ethylene glycol, propylene glycol, glycerol, trimethylolpropane, etc. Preference is given, according to the invention, to the use of tris (2-hydroxyethyl) isocyanurate. The polycarboxylic acids which can be used, in addition to the 2,6-naphthalene dicarboxylic acid of the invention, are phthalic acid, isophthalic acid, terephthalic acid, etc. Typically the corresponding dimethyl esters or the acid anhydrides are used with the
In order to accelerate the synthesis of the agglutinator. Preference is given to using 2,6-naphthalenedicarboxylic acid or dimethyl 2,6-naphthalenedicarboxylate. As a fatty acid, from an air drying system, a drying fatty acid or a mixture of fatty acids is used, such as linolic acid, linolenic acid, oleic acid, talloyl fatty acid, etc. Instead of a polyol and a fatty acid it is also possible when the binders of the invention are prepared, the drying acids boiled, the examples are flax seed oil, bean bean oil with degree of coating, etc. The alkyd resins synthesized from the described components can, according to the invention, be modified. For the alkylic modifier resins it is possible to use a variety of components that react with the hydroxyl groups and / or the acid groups of the resins. Reacting with the hydroxyl groups are mono- or polyisocyanates, which may be aromatic, aliphatic or cycloaliphatic such as phenyl isocyanate, naphthyl isocyanate, toluene 2,6- and 2,4-diisocyanate or a mixture of both, 4, 4 ' diisocyanatodiphenylmethane, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, etc. Other components that react with the hydroxyl groups are, for example, resins or melamine resins.
A large number of these compounds are available industrially. The acid group of the alkyd resins can easily react with epoxy resins. Examples of epoxy resins include diglycidyl ether of bisphenol A and diglycidyl ether of bisphenol F, limonene oxide, e, 4-epoxycyclohexylmethyl 3 ', 4-epoxycyclohexanecarboxylate, and also monofunctional oxiranes such as glycidyl phenyl ether, for example, glycidyl ethers of long-chain alcohols or polyalkylene glycols. A further modification of the alkyd resins consists of boiling them with natural drying oils, with natural resins, with maleic anhydride, etc. Mention of these possibilities is by way of example and does not restrict the varnish binders of the invention. The binder of the invention can be prepared preferably from 33.0% - 50.0% tris (2-hydroxyethyl) isocyanurate, preferably 37.0% - 45.0%, more preferably 38.0% - 43.0% 14.0% - 20.0% of 2.6. dimethyl naphthalenedicarboxylate, preferably 15.0% - 19.0%, more preferably 16.0% - 18.0%
34. 0% - 47.0% talloyl fatty acid, preferably 38.0% - 44.0%, more preferably 40.0% - 42.0%. This resin can, according to the invention, be modified with 1.0% - 15.0% of a modifier, for example, a mixture of toluene 2,6- and 2,4-diisocyanate. The right solvents or solvent mixtures
(component b) includes mixtures of aliphatic and / or aromatic hydrocarbons that are known in varnish chemistry, such as Shellsol D25 and D40, Solvesso 100 and Solvesso 150, toluene, xylene, and distillation cuts comprising them. These solvents are typically but not necessarily used in a mixture with esters, ketones, lactose and other typical varnish solvents. The following description is intended to illustrate the diversity of compounds that may be employed: esters for mention herein including ethyl, isopropyl and butyl acetate; ketones such as ethyl methyl ketone, methyl isopropyl ketone, isoamyl methyl ketone and isophorone which can be used in the same way. Gamma-butyrolactone is a representative of the class of lactose. Other typical varnish solvents are hydroxy esters such as methoxypropanol and -butanol, ether esters, such as methoxyprop-2-yl acetate and cyclic esters such as propylene carbonate and glycerol carbonate, for example. Reference can be made here to the
technical literature related to varnish solvents. Component c) comprises metal salts, such as lead, cobalt and zirconium octoate, manganese, vanadium, and calcium naphthenate or combinations of these dryers, which catalyze the crosslinking of the alkyd resins through atmospheric oxygen. Anti-scaling agents included in component c), such as ethyl methyl ketoxime, tocopherol, Ascinin® Atiskin VP 242 (available from Borchers, Germany), prevent the formation of a film layer on the surface of the varnish during storage of the varnishes of the invention in the containers. Typically, and which also depends on the use of the varnish, the alkyd resin varnishes can, if desired, include co-catalysts, corrosion inhibitors, defoamers, flow control agents, and wetting agents. Reference can be made here to the relevant varnish manuals. To prepare the coating varnish of the invention it is preferred to dissolve the existing binder in component b), to carry out the modification if desired, to carry out the heating if desired and then add component c). The coating varnish of the invention can preferably be used to coat wires
electrical, electric windings, as a coating on flat modules in electronics, hybrids, SMD modules, assembled printed circuit boards and to impregnate electrical windings. The invention is described in more detail below with reference to the examples. The tests are carried out in accordance with the DIN and IEC standards. EXAMPLES Example 1 1044 g of tris (2-hydroxyethyl) isocyanurate
(THEIC), 460 g of dimethyl 2,6-naphthalenedicarboxylate
(NDC), 1085 g of oil tall fatty acid, and a typical esterification catalyst are used to prepare an alkyd resin having an acid number of less than 5 mg KOH / g. The resin is dissolved in 700 g of methoxyprop-2-yl acetate and 1700 g of benzene with degree for coatings. The solution is mixed with 208 g of a technical mixture of toluene 2,6- and 2,4-diisocyanate and heated until the IR band of the NCO group is no longer visible. 10 g of lead octoate and 10 g of cobalt octoate and 44 g of ethyl methyl ketoxime are also added. Using about 354 g of methoxyprop-2-yl acetate and about 852 g of benzene with degree for coating, the varnish is adjusted to a
ISO 6 flow time of 38 s. A printed circuit board is immersed in the varnish and then allowed to cure at 90 ° C for 1 hour. The formed film is smooth and free of traces. The quantities in cross section to GT 0 B (DIN 53151). The resistance broken down to DIN EN 60464-2 is found to be l * l16Ocm-1. IT, through mass loss of fiberglass to IEC 60216 is 166. The varnish is used to impregnate drill rods to IEC 61033 (method A), and after curing (1 hour at 110 ° C), it is measures the baking resistance. At 23 ° C it is 47 N. Example 2 522 g of (THEIC), 210 g of NDC, 498 g of oil tall fatty acid and 56 g of a technical mixture of toluene 2,6- and used 2, 4 -diisocyanate as described in Example 1 to prepare a resin and formulated analogously with the amounts of solvents, siccatives and descaling agent indicated. The varnish can be used to varnish and cure easily. The TI through mass loss in the fiberglass to IEC 60216 is 157. Comparative Example 3 The experiment of Example 1 is repeated except that the resin is not modified with the toluene mixture 2,6- and 2, 4 -diisocyanate. After varnishing and healing,
Sticky films are obtained. Therefore, subsequent tests are unnecessary. Comparative Example 4 1044 g of (THEIC), 314 g of isophthalic acid, 185 g of talloyl fatty acid and 208 g of technical mixture of toluene 2,6- and 2,4-diisocyanate were used as described in Example 1 to prepare a resin and are formulated analogously with the indicated amounts of solvent, drying agent and descaling agent. The varnish is varnished and easily cured. TI through the loss of mass on glass fiber to IEC 60216 is only 140. Comparative Example 5 536 g of trimethylolpropane, 460 g of NDC, 1085 g of talloyl fatty acid and 208 g of a technical mixture of toluene 2,6- and 2,4-diisocyanate were used as described in Example 1 to prepare a resin and are formulated analogously with the amounts of solvent, drying agent and descaling agent indicated. The varnish is varnished and easily cured. TI through the loss of mass on the glass fiber to IEC 60216 is only 139. Comparative Example 6 536 g of trimethylolpropane, 314 g of isophthalic acid, 1985 g of talloyl fatty acid and 208 g of
Technical mixture of toluene 2,6- and 2,4-diisocyanate were used as described in Example 1 to prepare a resin and are formulated analogously with the indicated amounts of solvent, drying agent and descaling agent. The varnish is varnished and easily cured. TI through the loss of mass on fiberglass to IEC 60216 is only 132.
Claims (19)
- CLAIMS 1. A coating varnish comprises a) at least one binder comprising acrylic resins synthesized from tris (2-hydroxyethyl) -isocyanurate, 2,6-naphthalenedicarboxylic acid, drying fatty acids and, if desired, also known components of the alkyd resin chemistry, b) at least one solvent or at least one technical solvent or solvent mixture comprising at least one hydrocarbon-containing solvent mixture, And c) at least one siccative or at least one mixture of siccatives and one or more anti-scaling agents.
- 2. The coating varnish of claim 1, characterized in that component a) further comprises ethylene glycol, propylene glycol, glycerol, trimethylolpropane or mixtures thereof.
- 3. The coating varnish of any of the claims, characterized in that component a) further comprises phthalic acid, isophthalic acid, terephthalic acid or mixtures of these compounds.
- 4. The coating varnish of any of the preceding claims, characterized in that at least part of the dicarboxylic acids are in the form of dimethyl esters.
- 5. The coating varnish of any of the preceding Claims, characterized in that the component a) comprises as fatty acids, linolic acid, linolenic acid, oleic acid, talloyl fatty acid or mixtures of these compounds.
- 6. The coating varnish of any of the preceding claims, characterized in that component a) comprises modified alkyd resins.
- The coating varnish of any of the preceding claims, characterized in that the component a) contains 1. 33.0% - 50.0% by weight of tris (2-hydroxyethyl) isocyanurate, preferably 2. 14.0% - 20.0% by weight of dimethyl 2,6-naphthalenedicarboxylate, 3. 34.0% - 47.0% by weight of talloil fatty acid 4. 1.0% - 15.0% by weight of modifier (s), the percentages by weight in this case add up to 100.0% by weight.
- The coating varnish of any of the preceding Claims, characterized in that the binder of component a) contains 37.0% - 45.0% by weight of tris (2-hydroxyethyl) isocyanurate, 15.0% to 19.0% by weight of 2, 6- dimethyl naphthalenedicarboxylate and 34.0% - 47. 0% by weight of talloil fatty acid, the percentages of weight added in this case are 100% by weight.
- 9. The coating varnish of any of the preceding claims, characterized in that the binder present in component a) contains 38.0% - 43.0% by weight of tris (2-hydroxyethyl) isocyanurate 16.0% - 18.0% by weight of 2.6 dimethylnaphthalenedicarboxylate 40.0% - 42.0% by weight of talloyl fatty acid, the weight percentages in each case add up to 100.0% by weight.
- 10. The coating varnish of any of the preceding claims, characterized in that component b) comprises mixtures of aliphatic or aromatic hydrocarbons or mixtures thereof.
- 11. The coating varnish of any of the preceding claims, characterized in that component c) comprises an additional solvent of the class of esters, ketones, lactose or other typical solvent for varnish.
- 12. The coating varnish of any of the preceding claims, characterized in that the component c) comprises lead, cobalt or octoate of zirconium, manganese, vanadium or calcium naphthenate or combinations of one or more of these drying agents.
- The coating varnish of one of the preceding claims, characterized in that the component c) comprises, as anti-scaling agents, ethyl methyl ketoxime, tocopherol, Ascinin® Antiskin VP 242 or mixtures of these substances.
- 14. The coating varnish of one of the preceding claims, characterized in that component c) further comprises co-catalysts, corrosion inhibitors, defoamers, flow control agents, and wetting agents.
- 15. The process for preparing a coating varnish of one of Claims 1 to 14, characterized in that the binder present in component a) is dissolved in modified component b) if desired, heated, if desired, and then add component c.
- 16. The process of the Claim <; sic > 16, characterized in that after the addition of component b) a modifier is added.
- The process of Claim 16, characterized in that toluene diisocyanate is used for the modification.
- 18. The process of Claim 17, characterized in that 1.0% - 15.0% by weight of a mixture of toluene 2,6- and 2,4-diisocyanate is used. The use of the coating varnish of any one of Claims 1 to 14 for coating electric wires and electrical windings and also as a coating on flat modules in electronics, hybrids, SMD modules, assembled printed circuit boards, for impregnating the electrical windings .
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004006239.0 | 2004-02-09 |
Publications (1)
Publication Number | Publication Date |
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MXPA06009092A true MXPA06009092A (en) | 2007-04-10 |
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