MXPA06008675A - Device and method for encapsulation and mounting of rfid devices - Google Patents

Abstract

This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag (100). The encapsulating material (108) may be translucent or opaque, flexible or hard, and has minimal effect on transmission or reception of radio frequency (RF) signals. The invention further involves a stand-off bracket, composed of one or more materials that have minimal effect on transmission or reception of RF signals, for mounting an RFID device on or near materials that impede RF transmission and reception. The encapsulated REID tag and stand-off bracket, separately, may have an adhesive (102) or other attachment means on one of their surfaces so that they may be adhered or otherwise attached to another surface. In one application, an encapsulated RFID tag in the 860-928 MHz range is mounted on a stand-off bracket and may be used for tracking items to which it is attached.

Description

DEVICE AND METHOD FOR ENCAPSULATION AND ASSEMBLY OF RADIO FREQUENCY IDENTIFICATION DEVICES BACKGROUND OF THE INVENTION FIELD OF THE INVENTION The present invention relates generally to radio frequency identification (RFID) devices and in particular to the encapsulation and assembly of RFID devices. Specifically, the present invention relates to the convex encapsulation of RFID transponders and their mounting on surfaces that impede radio frequency (RF) transmissions.

DESCRIPTION OF THE RELATED TECHNIQUE Radio frequency identification (RFID) is an information acquisition technology. RFID systems are generally designed to handle goods of many types. RFID systems are generally comprised of transponders (also known as "tags"), a transmitter to provide power to the tags, a receiver to receive transponder transmissions, and a computer system to process the information received. The transmitter and receiver can be combined into a single device often referred to as an interrogator or reader. Usually, a small RFID tag is fixed to the asset so that the presence of the asset in a certain location can be detected or the good can be identified through the response of the tag to the interrogation either through interrogators portable or interrogators of fixed site that are in the course of the movement of the good. Failure to detect an expected RFID signal can also be used as an indicator. RFID transponders can be exposed to a variety of harmful environments during use. For that reason, labels must be tolerant of many harsh chemicals, abrasives, weather conditions and mechanical stresses. Although RFID devices are generally packaged in a plastic housing, these housings may lack efficient properties to withstand harmful environments for extended periods. The encapsulation of graphic images and advertising materials is a known procedure in the formation of convex labels. A procedure known as "convex encapsulation" provides an encapsulation material on a substrate on which the graphic material or advertisement is placed. Generally, the encapsulation material is translucent, although in some cases it may be colored, it may be dyed, or on the contrary, it may be opaque. The encapsulation material makes the ad or underlying artwork stand out with a three-dimensional "wet" look and protects the artwork. Generally, the encapsulation material is formed by an epoxy for an application where flexibility is not a requirement, or polyurethane when more flexibility is required. Generally, the method of forming domes depends on the surface tension to form a bubble of the encapsulation material on an article that is decorated without leaving the edge of the article. The encapsulation material is applied to the substrate, and if required, is subsequently exposed to a curing or curing process, such as exposure to ultraviolet light or heat. The known uses of the encapsulation process are the creation of identification, advertising and graphic materials used in automobiles, computers and computer cases, name plates and lapel pins. RFID devices are commonly used in or near a number of surface materials. Some of these surfaces that are made up of materials such as for example various metals, prevent or block the transmission and reception of radio frequency (RF) signals by RFID devices. In other cases, materials near the surface on which the RFID device is mounted can prevent the transmission and reception of RF signals by the RFID device. An example would be a glass or plastic container that retains a fluid that interferes with the transmission and reception of RF signals by an RFID device mounted on or inside the container.

Therefore, a method and apparatus is needed to overcome the challenges associated with the use of RFID devices, some of which are given above, including the protection of RFID devices through encapsulation, covering devices with images, and mount the devices so that their reception and transmission of RFID signals is not impeded.

BRIEF DESCRIPTION OF THE INVENTION The present invention overcomes many of the challenges encountered in the art by combining RFID technology with the encapsulation process, and by using a separation or isolation device to mount an RFID device. According to one embodiment of the invention, an RFID device such as, for example, an RFID transponder is encapsulated through convex encapsulation techniques to hide the RFID device and form a protected RFID device for use in harmful environments. In addition, the embodiments of this invention provide a convex encapsulated RFID apparatus and method for forming the same, so that interference, attenuation and absorption of the radio frequency (RF) signal through the encapsulation material and through any surface on which the encapsulated RFID device is placed.

The packaging of RFID devices performs several functions, including protection against the environment and concealment. However, the packaging material must be compatible with the RF performance of the label to avoid performance degradation of the RFID system. The present invention involves encapsulating a standard RFID tag in a manner that protects or conceals the RFID tag. Due to its use in graphic material and labeling, convex encapsulation is relatively inexpensive. An inexpensive way to encapsulate an RFID device is when using a polyester or convex polyurethane process. In one embodiment of the invention, a separation device maintains an RFID device at a distance away from a mounting surface so that RF interference caused by the mounting surface or nearby materials is reduced. In one modality, a graphic image such as a logo, brand slogan, etc. it is encapsulated with the RFID tag, while in other modalities, the RFID device can be encapsulated without said graphic image. In addition, one or more surfaces of the encapsulated RFID tag may comprise an adhesive material to facilitate assembly of the RFID tag encapsulated on a body. One aspect of the invention is an encapsulated RFID device.

Another aspect of the invention is an encapsulated RFID device having a graphic image. Another aspect of the invention is an encapsulated RFID device used to track shipments. Another aspect of the invention is an encapsulated RFID device used to track shipments through attachment to a tractor or trailer. Another aspect of the invention is an encapsulated RFID device so that the RFID device is hidden. Another aspect of the invention is an encapsulated, hidden RFID device having a graphic image. Another aspect of the invention is an encapsulated, hidden RFID device, used for one or more of a tag, identification card, luggage tag, advertisement, remote keychain, emblem, automobile emblem, or decoration. Even another aspect of this invention is an encapsulated RFID device comprised of one or more materials having certain thicknesses so that interference with RF signals is minimized. Another aspect of the invention is an isolation bracket configured to maintain an RFID device on the 860-928 MHz scale at a distance from a support surface.

Another aspect of the invention is an isolation bracket for mounting an RFID device on the 860-928 MHz scale on a surface or near a material that prevents or blocks RF transmission. Another aspect of the invention is an RFID device in the 860-928 MHz scale mounted on an isolation bracket. Another aspect of the invention is an encapsulated RFID device mounted on an isolation bracket. Another aspect of the invention is an encapsulated RFID device, convex, mounted on an insulating bracket. Even another aspect of the invention is an RFID device encapsulated in the mirror assembly of a vehicle. Another aspect of the invention is an encapsulated RFID device mounted on the mirror assembly of a vehicle. Another aspect of the invention is an encapsulated, convex RFID device mounted on the mirror assembly of a vehicle. Even another aspect of the invention is an encapsulated RFID device mounted on an isolation bracket within a mirror assembly of a vehicle. Another aspect of the invention is an encapsulated RFID device mounted on an isolation bracket within a vehicle mirror assembly.

Another aspect of the invention is an encapsulated, convex RFID device mounted on an isolation bracket within a vehicle mirror assembly. These and other aspects of the invention not previously provided are described herein more fully.

BRIEF DESCRIPTION OF THE DRAWINGS Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein: Figure 1A is a schematic view of the components comprising an exemplary convex encapsulated RFID tag; in one embodiment of the invention; Figure 1 B is a schematic view of the components comprising an exemplary convex encapsulated RFID tag in another embodiment of the invention; Figure 1 C is a schematic view of the components comprising an exemplary convex encapsulated RFID tag in another embodiment of the invention; Figure 1 D is a schematic view of the components comprising an exemplary convex encapsulated RFID tag in another embodiment of the invention; Figure 2A is a schematic view of the components comprising an exemplary convex encapsulated RFID tag in one embodiment of the invention having a base substrate; Figure 2B is a schematic view of the components comprising an exemplary convex encapsulated RFID tag in another embodiment of the invention having a base substrate; Figure 3 is an image of the fabrication of an exemplary convex encapsulated RFID tag, wherein the liquid encapsulation material is placed on the base substrate, RFID device and graphic image; Figure 4 illustrates an exemplary graphic image that an RFID device can cover in one embodiment of the invention; Fig. 5 illustrates another exemplary graphic image that may cover another embodiment of an RFID device in an embodiment of the invention; Figure 6A is a horizontal plane of an exemplary encapsulated RFID tag having a graphic image, in one embodiment of the invention; Figure 6B is a horizontal projection of an exemplary encapsulated RFID tag having a graphic image, in another embodiment of the invention; Figure 7 is an exemplary illustration of two embodiments of an encapsulated RFID tag mounted on mirrors of a vehicle; Figure 8A is a horizontal projection of an embodiment of an isolation bracket for an RFID device having an exemplary encapsulated RFID device mounted thereon; Figure 8B is a horizontal projection of an embodiment of an isolation bracket of an RFID device that does not have an RFID device mounted thereon; Figure 8C is a cross-sectional view of an embodiment of an isolation bracket for an RFID device having an exemplary encapsulated RFID device mounted thereon; Figure 8D is a cross-sectional view of an embodiment of an isolation bracket for an RFID device that does not have an RFID device mounted thereon; Figure 9 is a side view of an embodiment of an encapsulated RFID device; Figure 10A is a cross-sectional view of an embodiment of an isolation bracket for an RFID device having an exemplary encapsulated RFID device mounted thereon and having a layer of adhesive for mounting; Figure 10B is a cross-sectional view of an embodiment of an isolation bracket for an RFID device that does not have an RFID device mounted thereon but having a layer of adhesive for mounting; Figure 11 illustrates a flow diagram of a method for encapsulating and covering an RFID device; Figure 12A illustrates a flow chart of a method for manufacturing an encapsulated RFID tag; and Figure 12B illustrates a flow chart of a method for manufacturing an encapsulated RFID tag by covering an RFID tag with a graphic image and encapsulating the RFID device and the graphic image.

DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described more fully with reference to the accompanying drawings, in which some, but not all, modalities of the invention are shown. Of course, this invention can be modalized in many different ways and should not be interpreted as limited to the modalities set forth herein; rather, these modalities are provided so that this description meets the applicable legal requirements. Similar numbers refer to similar elements. Figure 1A is a schematic view of the components comprising an exemplary convex encapsulated RFID tag 100 in one embodiment of the invention. In this embodiment, an adhesive layer 102 formed by an acrylic adhesive coating approximately 2 millimeters thick is substantially fixed and underlies an RFID device 104, although other thicknesses and types of adhesive may be used.

In one embodiment, this adhesive layer 102 has an adhesive on its exposed surface so that it can be adhesively mounted to another surface and an adhesive on the surface that is substantially in contact with the RFID device 104 so that the adhesive layer 102 adheres to the RFID device 104. In various embodiments, the adhesive layer 102 may be sized to extend beyond each edge of the RFID device 104 when the adhesive layer is substantially adhered to the RFID device 104, the Adhesive layer 102 may have the same dimensions as RFID device 104 to which it is substantially adhered, or adhesive layer 102 may have smaller dimensions to RFID device 104 to which it is substantially adhered. In the particular embodiment of Figure 1, a pixel layer 106 formed by a polyester image layer of approximately 2.4 mil extends substantially over the RFID device 104, although in other embodiments, the image layer 106 may extend substantially under the RFID device 104, it can be omitted completely, or it can be composed of different materials and / or thicknesses. At least one surface of the photo layer 106 is substantially adhered to the RFID device 104. If the photo layer 106 extends substantially below the RFID device 104, a surface of the photo layer 106 adheres to the RFID device 104 and a second surface of the image layer 106 adheres substantially to the adhesive layer 102. If the image layer substantially extends over the RFID device 104, a surface of the image layer adheres to the RFID device 104 and a second surface of matrix layer 106 substantially adheres to a convex layer 108. Convex layer 108, such as for example a flexible, transparent polyurethane dome, is placed over image layer 106 or , if the image layer 106 is omitted or extended substantially below the RFID device 104, the convex layer 108 is placed over the RFID device 104. If the adhesive layer 102 is sized to extend beyond any dimension of the RFID device 104, then the convex layer 108 may be in contact with the adhesive layer 102, thus encapsulating the RFID device 104. In other embodiments, the convex layer 108 may have the same dimensions as the underlying RFID device 104, or the convex layer may have smaller dimensions than the RFID device. The RFID device 104 is substantially sealed to atmospheric exposure, protected, or hidden through encapsulation. Figure 1 B is another embodiment of the encapsulated RFID device shown in Figure 1A. In the embodiment of FIG. 1B, the encapsulated RFID device 110 is formed by an adhesive layer 112, an RFID device 114, and a convex layer 116. The image layer is omitted from this mode, as compared to the modality of figure 1A.

Figure 1C is another embodiment of the encapsulated RFID device shown in Figure 1A. In the embodiment of Figure 1 C, the encapsulated RFID device 118 is comprised of an RFID device 120, an image layer 122, and a convex layer 124. The adhesive layer is omitted from this mode, as compared to the modality of figure 1A. Figure 1 D is another embodiment of the encapsulated RFID device shown in Figure 1A. In the embodiment of FIG. 1 D, the encapsulated RFID device 126 is comprised of an RFID device 128 and a convex layer 130. The adhesive layer and the image layer are omitted from this mode, as compared to the embodiment of FIG. of figure 1A. In another embodiment of the invention, as shown in the schematic view of Figure 2A, an exemplary convex, encapsulated RFID tag 200 is comprised of a substrate layer 202, an RFID device 204, a graphic image 206, and a convex layer 208. In this embodiment, the substrate layer 202 can be formed by a flexible, rigid or semi-rigid material such as for example plastics, ferrous or non-ferrous metals, ceramics, mixed materials, alloys, etc. The substrate layer 202 may have an adhesive on its exposed surface to attach the encapsulated RFID tag 200 to another surface. In some embodiments, the substrate layer 202 may have fixed or embedded magnets for affixing the encapsulated RFID tag 200 to a surface containing magnetic material. In other embodiments, the substrate layer 202 itself may be magnetized, making it capable of being fixed to a surface containing magnetic material. Even in other embodiments, the substrate layer 202 may have other means of attachment to another surface such as a clasp or clamp for attachment to an article of clothing, a split ring, rope, snap, buckle, screw, fastener, etc. . An RFID device 204 is substantially fixed to the substrate layer 202. In one embodiment, the RFID device 204 is substantially adhered to the substrate layer 202; Nevertheless; in other embodiments, the RFID device 204 can be fastened, screwed, welded, nailed, stapled, stitched, magnetically held, or otherwise adhered to the substrate layer 202. The RFID device 204 is substantially encapsulated in a carrier material. encapsulation 208, thereby providing protection to the RFID device 204 and, in some cases, concealing the RFID device 204. In one embodiment, a graphic image 206 such as for example the logo or trademark of a cooperation or other form of entity, covers the RFID device 204 and is substantially encapsulated in the encapsulation material 208 together with the RFID device 204. Figure 2B is a schematic view of the components comprising an exemplary convex encapsulated RFID tag 210 in another embodiment of the invention that has a base substrate 202. In this embodiment, the encapsulated RFID tag 210 is comprised of a base substrate 212, a device RFID 214, and an encapsulation material 216. Compared to the embodiment shown in Figure 2A, Figure 2B illustrates an embodiment of an encapsulated RFID tag 210 wherein the graphic image layer is omitted. Figure 3 is an image of a manufacturing process for an exemplary convex encapsulated RFID tag, wherein a liquid encapsulating material 302 is placed on a substrate 304 formed by an RFID device and graphic image. The encapsulation material 302 may be translucent or opaque, such as a dark or colored substance. The encapsulation material 302 can be formed of polyurethane, epoxy, acrylics or other resins or suitable materials such as for example, polyethylene, polypropylene, polystyrene, polyester, etc. Generally, the encapsulation material 302 is formed by an epoxy for an application where flexibility is not a requirement or polyurethane when more flexibility is required. The method of forming domes depends on the surface tension to form a bubble of the encapsulating material 302 in an article that is decorated without leaving the edge of the article. The encapsulation material 302 is applied to the substrate 304 and, if required, it is subsequently exposed to a hardening or curing process, such as exposure to ultraviolet light or heat. Fig. 4 illustrates an exemplary graphic image layer 402 that can cover an RFID device 402 in one embodiment of the invention. In one embodiment, the graphic image layer 402 is comprised of a polyester image substrate of approximately 2.4-mil, although other thicknesses and materials may be used. The actual image 406 in the graphic image layer 402 can be screen-printed, painted, drawn, stamped, embedded, or otherwise placed on or within the graphic image layer 402. In other embodiments, the image layer 402 is conformed by an emblem, novelty, badge, etc. three-dimensional In embodiments of the invention having a graphic image layer 402, the encapsulation material is generally translucent, so that the graphic image layer 402 is substantially visible through the encapsulation material. Figure 5 is an alternative exemplary graphic image layer 502 covering an alternative RFID device 504 in one embodiment of the invention, as compared to the embodiment shown in Figure 4. The RFID device of the various embodiments of the invention can be for example an active or passive RFID transponder, as is commonly known in the art. The RFID device can be flexible, rigid or semi-rigid. The RFID device may be contained within a housing, or it may be based on the encapsulation material to provide a housing. In one embodiment, the RFID device is a user-programmable flexible RFID transponder such as those available from Alien Technologies Corp. of Morgan Hill, California; although other types of RFID device made by other manufacturers can be used. Other manufacturers of RFID devices include but are not limited to: Matrics, Inc. of Columbia Maryland; Phillips Electronics of Eindhoven, The Netherlands and Texas Instruments Incorporated of Dallas, Texas. In one embodiment, the RFID device is a Class 1 electronic product code (EPC) transponder from Alien Technologies. The RFID device includes devices that comply with standard 18000-6 of the International Organization for Standardization (ISO), which includes but is not limited to ISO 1800-6 types A and B. ISO 18000-6 covers the air interface for labels of RFID that operate at ultra high frequency (860-930 MHz). The RFID device also includes devices that comply with the other parts of ISO 18000 (for example, 18000-1, 18000-2, etc.), since these parts are approved and adopted. The ISO 18000-6 standard, and all variants (for example, Type A and B, etc.), are incorporated in their entirety as a reference and form part of this. The RFID device also includes devices that comply with the standards, specifications and guidelines of the Electronic Product Code (EPC) that were initially developed by Auto-ID Center, including no limit to EPC 0-1 classes. The EPC standards are also fully incorporated herein and are a part of it. Figure 6A is a previous, horizontal projection of an embodiment of an encapsulated RFID tag 600 having a graphic pattern 604. Figure 6B is a horizontal, prior projection of an alternative embodiment of an encapsulated RFID tag 602 that it has a graphic image 606. Other modes (not shown) may have omitted the graphic image or may be in other configurations.

Figure 7 is an exemplary illustration of two embodiments of an encapsulated RFID tag 702 mounted on a mirror 704 of a vehicle. In a typical use of said encapsulated RFID tag, information about the location of the vehicle, its cargo, property, identity, existence, etc. it can be programmed into the RFID tag or it can be received by one or more RFID readers properly placed in response to a question mark. Even in another embodiment (not shown), an RFID device is mounted within a mirror 704 of a vehicle. This assembly will help protect the RFID device from environmental exposure, damage and theft. It will also hide the RFID device. A method to mount an RFID device in the mirror of a vehicle 704 is by removing the neoprene, rubber, or other sealing material that surrounds the mirror of your body or head, placing the RFID device inside the body or head so that it does not interfere with the replacement of the mirror or that is damaged by moving parts inside the head, and replace the mirror and its sealing material. In other types of mirrors, other methods can be used to place an RFID device inside the body of the mirror. The embodiments of this invention provide encapsulation materials that are comprised of such materials that interference or impairment of RFID signals transmitted to or from the encapsulated RFID device is minimized or absent. further, if the encapsulated RFID device is to be placed on or near a ferrous surface, or other material that tends to detrimentally affect RF transmissions, the space between the encapsulated RFID device and the RF resistant materials caused by the encapsulation material tends to improve the transmission and reception properties for the RFID device. In other embodiments, an isolation bracket is used to further separate the RFID device from the RF resistant materials. Figures 8A-8D illustrate embodiments of an isolation bracket for use with an RFID device. Figure 8A is a horizontal projection of an embodiment of an RFID device assembly 800 formed by an isolation bracket 802 for an RFID device and an exemplary encapsulated RFID device 804 mounted thereon. Section A-A of Figure 8A is illustrated in Figure 8C. The bracket 802 is comprised of one or more materials such as for example injection molded plastic, paper (eg, cardboard), corrugated plastic, etc., which have minimal adverse effects on the RF signals moving to and from the RFID device 804. As shown in Figure 8C, bracket 802 has a first surface 812 for mounting or adjustment on a mounting surface or support and a second surface 810 on which the RFID device is fixed or positioned. The first surface 812 can be glued, nailed, bolted, stapled, clamped or otherwise adhered to the mounting surface, or it can be held in place simply by friction or gravity. The second surface 810 is raised at a distance from the first surface 812 so that the RFID device 804 is held at a distance, d, from the mounting surface to which the bracket is attached or positioned, as shown in FIG. Figure 8C. Generally, the space 808 between the bottom of the second surface 810 and the mounting surface 812 is hollow, although in other embodiments, the space 808 can be filled or partially filled with one or more materials that are permeable to RF, or with the same material comprising the bracket 802. The isolation bracket 802 allows the RF signals to travel in the space between the mounting surface and the RFID device 804, thus allowing a better transmission and reception of RF signals by the RFID device 804. Figure 8B is a horizontal projection of an embodiment of an isolation bracket 802. This embodiment is illustrated without an RFID device mounted thereon. Section B-B of the embodiment of Figure 8B is illustrated in Figure 8D. Figure 8C is a cross-sectional view of an embodiment of an insulation bracket assembly 800 having an exemplary encapsulated RFID device 804 mounted thereon. Figure 8C illustrates section A-A of Figure 8A. The RFID device 804 is shown mounted on the upper surface 810 of the isolation bracket 802, thus providing a distance, d, between the RFID device 804 and any mounting surface. The first surface 812 is for mounting or adjusting the insulation bracket 802 on a mounting support surface. Figure 8D is a cross-sectional view of one embodiment of an insulation bracket assembly 800 without an RFID device mounted thereon. Figure 8D illustrates section B-B of Figure 8B. Although the embodiments of the isolation bracket 802 shown in FIGS. 8A-8D are square, this only has exemplary purposes. In other embodiments, not shown, the isolation bracket may be rectangular, circular, oval triangular, spherical, hemispherical, or any other shape that provides a separation between the assembled RFID device and the mounting surface. Figure 9 is a side view of a modality of a convex encapsulated RFID tag 900 that can be mounted on an isolation bracket 802. A particular embodiment of the encapsulated RFID tag, convex 900 uses an RFID device that complies with ISO 18000-6, as is known in the art, although other RFID devices (e.g., compliant with EPC) may be used. The RFID tag 900 of the embodiment of Figure 9 is comprised of four layers, although in other embodiments, more or less layers may be present. The layers of the RFID tag 900 of FIG. 9 are formed by a layer of adhesive 908, an RFID device 906, a graphic layer 904, and a layer of encapsulating material 902. These various layers have been previously described in the present. The RFID tag 900 can be affixed to the top surface 810 of an isolation bracket 802 to provide separation of the RFID tag 900 and the mounting surface for better RF transmission and reception. Figure 10A is a cross-sectional view of an embodiment of an isolation bracket 802 for an RFID device having an exemplary encapsulated RFID tag 804 mounted thereon and having a layer of adhesive 1002 for mounting. The adhesive layer is fixed to the first surface 812 of the insulation bracket 802. At least one external surface of the adhesive layer is formed by an adhesive material that can be used to adhere the insulation bracket 802 to a surface of assembly. The adhesive layer 1002 also increases the separation between the mounting surface and the upper surface 810 of the insulation bracket 802, where an RFID device can be mounted. Figure 10B is another cross-sectional view of an embodiment of an isolation bracket for an RFID device. In this mode, an RFID device is not mounted on the isolation bracket 802; however, the insulation bracket 802 is further formed by a layer of adhesive 1002 for mounting. Figure 11 illustrates a flow chart of a method for encapsulating and covering an RFID device. The process starts in step 1100.

In step 1102, the decision is made to encapsulate an RFID device. If in step 1102 the answer is NO, then the process continues to step 1 114 where the process ends. If in step 1102 the answer is YES, the process continues to step 1104 where the decision is made to cover an RFID device. If in step 1104 the answer is NO, the process continues to step 1110 wherein the RFID device is substantially encapsulated in an encapsulation material. The encapsulation material is subsequently cured in step 1112. The process continues to step 1114 where it ends. However, if in step 1104 the answer is YES, the process continues at step 1106 where the RFID device is covered with a graphic image layer. The process continues to step 1108 wherein the RFID and graphic image are substantially encapsulated in an encapsulation material. The process continues to step 1112 where the encapsulation material is cured. The process continues to step 1114 where it ends. Figure 12A illustrates a flow diagram of a method for manufacturing an encapsulated RFID tag. The process starts at step 1200. The process proceeds to step 1202 where a viscous encapsulation material is placed on at least one surface of an RFID device. The process continues to step 1204 wherein the encapsulating material is cured to a non-viscous state. The process then terminates at step 1206. Figure 12B illustrates a flow diagram of a method for manufacturing an encapsulated RFID tag by covering an RFID tag with a graphic image and encapsulating the RFID device and graphic image. The process starts at step 1210. The process continues to step 1212 where at least one surface of an RFID device is covered with a graphic image. The process proceeds to step 1214 where a viscous encapsulation material is placed on at least one surface of the RFID device and graphic image. The encapsulating material is cured to a non-viscous state in step 1216. The process ends later in step 1218. Many modifications and other embodiments of the invention set forth herein will come to the mind of the person skilled in the art to whom this invention pertains. that have the benefit of the teachings presented in the above descriptions and the related drawings. Therefore, it will be understood that the invention is not limited to the specific embodiments described and that the modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. 11. - The method according to claim 9, further characterized in that substantially encapsulating the RFID device comprises using a translucent encapsulation material. 12. A method for encapsulating and covering an RFID device, comprising: covering the RFID device with a graphic image; substantially encapsulating the RFID device and the graphic image in an encapsulation material; and curing said encapsulation material. 13. The method according to claim 12, further characterized in that covering the RFID device with the graphic image comprises using a graphic image layer formed by a 2.4-mil polyester substrate image. 14. The method according to claim 12, further characterized in that encapsulating the RFID device and graphic image comprises using a translucent encapsulation material. 15. The method according to claim 12, further characterized in that encapsulating the RFID device and graphic image comprises using an opaque encapsulation material. 16. A method for manufacturing an encapsulated RFID tag, comprising: covering a graphic image on at least one surface of an RFID device; placing a viscous encapsulation material on at least one surface of the RFID device and graphic image; and curing the encapsulating material to a non-viscous state.

Claims (5)

1. NOVELTY OF THE INVENTION CLAIMS 1. - An encapsulated radio frequency identification tag ("RFID") comprising: an RFID device; an encapsulation material; and a graphic image layer embedded within said encapsulation material.
2. 2. The encapsulated RFID tag according to claim 1, further characterized in that the graphic image layer is formed of polyester.
3. 3. The encapsulated RFID tag according to claim 1, further characterized in that it additionally comprises a layer of adhesive for adhering the encapsulated RFID tag to a surface.
4. 4. The encapsulated RFID tag according to claim 1, further characterized in that the encapsulation material is selected from the group consisting of polyurethane, polyethylene, polypropylene, polyethylene, polyester and epoxy, and combinations thereof.
5. 5. The encapsulated RFID tag according to claim 1, further characterized in that the encapsulation material is translucent. 6. - The encapsulated RFID tag according to claim 1, further characterized in that it additionally comprises a substrate layer, wherein the RFID device is placed on the substrate layer and the encapsulation material is placed on the RFID device. 7. The encapsulated RFID tag according to claim 1, further characterized in that the encapsulated RFID tag is used for tracking articles to which it is fixed. 8. The encapsulated RFID tag according to claim 1, further characterized in that the encapsulated RFID device is used for one or more of a tag, identification card, luggage tag, advertisement, remote keychain, emblem, automobile emblem, and decoration. 9. A method for encapsulating an RFID device comprising: substantially encapsulating the RFID device in an encapsulation material; embedding a graphic image layer within said encapsulation material; and curing said encapsulation material. 10. The method according to claim 9, further characterized in that substantially encapsulating the RFID device comprises using an encapsulation material selected from the group consisting of polyurethane, polyethylene, polypropylene, polystyrene, polyester, epoxy, and combinations thereof. same. 17. - A method for manufacturing an encapsulated RFID tag, comprising: covering a graphic image on at least one surface of an RFID device; place the RFID device and graphic image on a base substrate; placing a viscous encapsulation material on at least one surface of the RFID device and graphic image; and curing the encapsulating material to a non-viscous state. 18. An RFID assembly comprising: an isolation bracket and an encapsulated RFID device mounted thereon, wherein said RFID device is comprised of an RFID device of a scale of 860-928 MHz; an encapsulation material; and a graphic image layer embedded within said encapsulation material; and wherein the isolation bracket further comprises: a first surface for mounting said insulation bracket on a mounting surface or support; a second surface for mounting the encapsulated RFID device, wherein said first and second surfaces are spaced a certain distance apart. 19. The RFID assembly according to claim 18, further characterized in that the distance between said first and second surfaces comprises a hollow space. 20.- The RFID assembly in accordance with the claim 18, further characterized in that the distance between said first and second surfaces comprises a filled space. 21. - The RFID assembly according to claim 20, further characterized in that said filled space is filled with one or more materials that are permeable to RF. 22. The RFID assembly according to claim 20, further characterized in that said filled space is filled with the same material comprising the isolation bracket. 23. The RFID assembly according to claim 18, further characterized in that said first surface is joined to a mounting surface or support through gluing, nailing, screwing, stapling, clamping or any combination thereof. 24.- The RFID assembly in accordance with the claim 18, further characterized in that said isolation bracket is formed of a material selected from the group consisting of injection molded plastic, corrugated plastic, paper (cardboard), and any combination thereof. 25. The RFID assembly according to claim 18, further characterized in that the isolation bracket can be rectangular, circular, oval, triangular, spherical, hemispherical or any other shape. 26.- The RFID assembly in accordance with the claim 18, further characterized in that said RFID assembly is mounted in a mirror assembly of a vehicle.