MXPA06008002A - Thermal protection for electronic components during processing - Google Patents

Abstract

A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.

Description

THERMAL PROTECTION FOR ELECTRONIC COMPONENTS DURING THE PROCESS FIELD OF THE INVENTION (1) The present investigation relates generally to a method and device to protect the characteristics of electronic components sensitive to heat by the damage to the temperatures typical of the process.

ANTECEDENTS OF THE INVENTION (2) As electronic products continue to shrink, there is a persistent effort to reduce the size of the integrated circuits (Cl) found in this. In a small architectural dimension, the sensitivity to heat of a Cl increases due to a small and thin contact plate of fine characteristics, which bends easily. Additionally, the Cl are now being designed to use very thin organic and inorganic dielectrics, which also have limited thermal stability, in some cases below 200 ° C. At the same time, the change to lead solder in the Cl has increased the peak that processed temperatures of, for example, around 200 ° C for solders of tin and lead to 245 ° C for tin-silver-copper solders. (3) The problem of thermal sensitivity is more pronounced with chip processors, which develop considerable heat during normal operation. In a common practice, these chips are mounted within a Cl package using a flying micro-chip format. During the high power operation, the heat generated by the flying chip microclip Cl is dissipated through the solder joints of the package to the main circuit board as well as through the package cover. (4) In addition to the Cl, other electronic components such as optoelectronic communication devices (for example, transceivers) and display devices (for example fluorescent vapid displays) suffer from the same sensitivity to heat during various stages of the process. Specifically, optoelectronic communication devices are commonly considered stable at temperatures of around 80 ° C to 90 ° C, whereas vacuum fluorescent displays will be assembled using selected welding techniques due to thermal instability. As with the Cl, the same method of heat dissipation is necessary to maintain the integrity of these electronic components during the process and their use in service. (5) Thermal dissipation devices are commonly used to keep electronic components stable during high temperatures, operating in service. These devices are in thermal communication with the component and generally use conduction, convection or a combination of these to dissipate the thermal energy. Heat sinks in particular are common thermal dissipation devices for in-service operations. The heatsink is typically a mass of materials that are thermally coupled to one of the electronic components with heat conduction characteristics, for example the lid of a Cl package, with grease or thermal adhesive. The heat sinks rely on the conduction to stretch the thermal energy out of a region of high temperature towards the heatsink. The thermal energy is then dissipated from the surface of the heat sink to the atmosphere by convection. (6) The thermal efficiency of a heat sink can be increased by forcing the convection with an air current on the surface, usually with a fan, or in more advanced applications using a liquid to absorb heat from the heat sink. However, the efficiency of a heat sink is necessarily limited by the surface area of the heat sink, that is, the surface area of the convection. In addition, while the heat sink has been used to dissipate heat during the operation in service, these have not been used to address the needs of heat dissipation during the process of elevated temperatures. (7) Reflective thermal screen in the form of metal cap or vegetable fiber masks have been used to try to protect electronic components during the procedure. Nevertheless, these devices act to shield only the covered area to receive the full impact of the ambient heat, rather than currently acting to help extract heat from the electronic component. As a consequence, these devices do not provide protection to infrared heat. If there exists a method of extracting thermal energy from the electronic component during stages of the process at high temperatures, the stability of the heat sensitive components would be increased accordingly.

SUMMARY OF THE INVENTION. (8) Among the various aspects of the invention is to provide a method and devices for electronic cooling components during the process to protect the sensitive thermal characteristics thereof. (9) Briefly, of that, the invention is directed to a method of cooling an electronic component during a high temperature operation during, manufacturing, repairing, or resuming that encompasses bringing a temporary cooling unit into a thermal communication with the electronic component, holding the electronic component in the high temperature operation during which the temporary cooling unit cools the electronic component, and removing the temporary cooling unit from the thermal communication with the electronic component. (10) The invention is also directed to a method for cooling an electronic component during a high temperature operation during manufacture, repair, or resumption thereof, encompassing bringing a cooling unit in the thermal communication with the electronic component, holding the electronic component during the high temperature operation during which the cooling unit cools the electronic component by means of an endothermic reaction inside the cooling unit. (11) The invention is directed, more thoroughly, to a cooling unit for extracting heat from an electronic component during the exposure of the component at a process temperature between 100 ° C and 300 ° C during the manufacture, repair or resumption of the component electronic, the cooling unit encompassing the body of the cooling unit, and a cooling medium within the body of the cooling unit, wherein the cooling medium undergoes an endothermic reaction in the temperature process. (12) Other aspects and features of the invention will be in the evident part, and partly described hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS. (13) Figure 1 is a schematic illustration of a typical flywheel package before the flow process. (14) Figure 2 is a schematic illustration of a typical flywheel package with a cooling unit placed on the lid of the packages. (15) Figure 3 is a schematic illustration of a flying chip pack with a heat sink attached to the lid. (16) Figures 4A-4F are graphs of the data of Example 1, representing the data collected by TI and T2 during the flow at a maximum temperature of 125 ° C. (17) Figures 5A-5F are graphs of the data of Example 2, representing the data collected by TI and T2 during the flow at a maximum temperature of 220 ° C. (18) Figures 6A-6F are graphs of the data of Example 3, representing the data collected by TI and T2 during the flow at a maximum temperature of 260 ° C. (19) The corresponding characters of the reference indicate corresponding parts through the drawings.

DESCRIPTION OF THE COVERAGE (S PREFERRED.) (20) The invention involves the electronic cooling components during the process.While the invention can be used to dissipate heat through various high temperature operations, some process steps of the package where is the sensitivity of the heat particularly in the edition includes the stage of the flow, the stage of preheating before the welding of the wave, and any requirement, resumption or repair of stage.The flow process will be used attached for illustrative purposes. the invention has a potential application for innumerable types of electronic components that are exposed in high temperature processes, for example packaged CPs, multi-chip modules, optoelectronic communication devices, or electronic displays, a pack of flywheel Cl will be used together for illustrative purposes. (21) With refere ncia to Figure 1, a micro-tablet pack 28 comprises a substrate 22 with a bonding area of the plate for mounting a semiconductor plate 16 thereon and a semiconductor plate with two sides, a side with electrically active characteristics and a plurality of contact areas , and the other side without any electrical characteristic. The semiconductor plate 16 is oriented in such a way that the electrically active side faces towards the substrate 22, which is electrically connected by a plurality of WELDING TOPETONS 18. The substrate 22 contains electrical traces, such as barrels or tracks, which facilitates the electrical connection between the semiconductor plate 16 and the device to which the package is ultimately attached by the solder balls 24. Filling material and composite molding, collectively 20, are applied to the side of the substrate plate to provide the support lateral and underlying to the semiconductor plate 16. A cover 14 is placed on the inactive side of the plate, such that the cover 14 abuts both the plate 16 and the composite molding 20. (22) Then the lid 14 joins the assembly, the package can be placed on other electronic components, such as a printed circuit board (PCB), which is used attached for illustrative purposes only nte. After assembling the packages, you will subsequently experience process steps at elevated temperatures. In accordance with this invention, the heat is extracted from the electronic package during these stages of the above process in use in service, for example, the PCB. (23) Specifically, this invention relies on an endothermic reaction or process taking place in proximity to the electronic package to extract the internal heat thereof for the period between the packages of the assembly and is operation in service, or by a segment thereof. In the preferred coverages of the invention and with reference to the schematic illustration in Figure 2, a cooling unit is joined with the lid 14. A cooling unit is a structure specifically designed to be in a thermal communication with the electronic package, of such mode extracting and dissipating heat from the electronic package during the stages of the process with primary aid for a cooling medium. Bringing the cooling unit within thermal communication with the electronic component comprises positioning the unit in sufficient proximity for the component to allow significant heat transfer from the component to the cooling unit. This typically involves the placement of the cooling unit in the component. (24) While the body of the cooling unit provides a certain measure of the heat extraction in the conduction, the endothermic reaction or process takes place inside the body of the cooling unit the typical process temperatures assist in cooling the electronic component . The invention can rely on the cooling medium by undergoing any endothermic process such as phase change, e.g., melting, vaporizing or sublimation, or any endothermic reaction. The temperature with which the cooling medium undergoes that change in endothermic phase or reaction under standard conditions may be moderate under the process of temperature, conditions provided under which the component is subjected to high temperature operation such as that cooling medium It continues to have the capacity to extract heat in the process of temperature. For example, water, which has a vaporization temperature of 100 ° C. can be used for cooling during an operation of 150 ° C, the operation is brought up to 150 ° C fast enough that all the water in a cooling unit does not evaporate before reaching the temperature process of 150 ° C. In particular the hedges below, the vaporization of volatile species is used for illustrative purposes. (25) In a coverage, the cooling unit is a structure made of an inorganic material. In this coverage, two representative inorganic materials are hydrated CaS 4 (Paris Plaster) and cross-linked Zirconia foam (RZF), which is commercially available for Vesuvius Hi-Tech, Inc. of Alfred Station, New York. In the CaS04 employment coverage as the inorganic material, the cooling unit is formed to create and solidify a rack process at room temperature. The CaS04 is mixed with additives, by the instructions of the substitutes, and approximately 50% of previous water for the frame. The desired dimensions can be achieved with casting in single molds or units that saws from a larger mold of the bulk. As CaS04 in the process of the frame is in a process of room temperature, organic materials are acceptable as well as the material of the mold. In the cover, RZF is used as well as the inorganic material, the cooling unit is formed via a ceramic formation at high temperature with the frame of the invention. An open cell foam is impregnated with a mixture of zirconia-based ceramic. The impregnated organic foam is then dried and fried, during which the process of the organic foam is eliminated. The result of the organic foam has the same rough pore of the same size and density as the organic foam, meaning that these variables can be altered and choosing or designing an organic foam with the desired values. The cooling unit in this instance is physically characterized by a multicell configuration, each with a "cell" having substantially continuous walls and an annulled center, but with a certain degree of porosity to allow the impregnation of the volatile species in the liquid phase and in the liquid phase. the degassing in the vapor phase. In one coverage, the cooling unit has length and width in accordance with the lid package and a thickness of around 1cm to about 3cm. (26) The body of the cooling unit is impregnated with a cooling medium that is compatible with the reflux equipment, the flying microtip pack and the PCB, if applicable. The cooling medium is a solid or liquid substance, for example a volatile liquid species, which has the function of undergoing a reaction or a phase change process thereby causing heat to be transmitted away from the component. In the invention, "volatile species" refers to any species having heat of vaporization under the process of temperature of the stage during which the cooling unit is designated to extract heat from the electronic component. In one of the coverages, the volatile species is comprised of volatile components normally found in a solder flux. One of the fluxes is Alpha NR330, which is available for Alpha Metals of Jersey City, NJ, and which encompasses succinic acid, tetraethyl glycol, and ether dimethyl, glutaraldeide. In a second coverage, the volatile species is water. In a third coverage, the volatile species is a solution of water and a soluble inorganic or organic species which may undergo an endothermic reaction or process such as water that vaporizes and / or may alter the temperature of water vaporization. Based on the selection of the inorganic or organic species and the variety of their concentration, the vaporization temperature of the solutions can be adapted to satisfy the specific characteristics of the heat dissipation that the operator desires. By increasing the temperature of the species vaporization, the maximum efficiency of the heat dissipation can be altered to match the process temperature, maximum component temperature, and the characteristics of the heat stream in order to best protect the component. In a preferred coverage, the soluble inorganic or organic species is selected from a group consisting of mineral salts, ethylene glycol, and any combination of these. In a fourth cover, the volatile species is a solution of a cooling liquid and a soluble inorganic or organic species which can alter the temperature of the vaporization of the cooling liquid or additionally provide endothermic cooling after the cooling liquid has vaporized. In a preferred coverage, a solution of water and borax, (borate sodium hydrate) can be used for example the volatile species, wherein the borax provides additional endothermic cooling after the water is vaporized. (27) The cooling body is typically brought into thermal communication by attachment to the component using any acceptable means that it is temporary, which will ensure the unit for the component during the operations of the process, and that does not irreparably alter the integrity of the components. In a cover, the body of the cooling unit can simply be placed on top of the components of the cover, relying on gravity to keep the unit in contact with the component during the process. Other coverage uses accessory techniques such as a mechanical meaning, thermal grease, and sticky flow. In Figure 2, the body of the cooling unit is shown to be joined by the thermal grease or the sticky flow, collectively represented as 12. (28) With reference to Figure 2, to attach the micro-tablet to the PCB, 24 spheres solders are positioned on the surface 22. The package is then heat treated to adhere the soldered spheres to the package. The package is then submerged in a flow to provide temporary adhesion between the welded spheres and the substrate. After that the package is oriented on the PCB such that the welded spheres are in contact with the electrical contacts on the PCB, which have generally been pretreated with rubber from the welder. The PCB, with at least one pack of flying micro-pads also having a cooling unit attached, is then placed in a furnace from the flow to the flow of the welded spheres. Typical stopping time of the flow hormone is around 2 minutes around 5 minutes, with the particular dependent of the stopping time in the process of the temperature, the thermal mass of the board and components, its thermal stability, and the type of welding which is used. The typical furnace temperature of the flow is around 100 ° C to 300 ° C. (29) During the high temperature process, the heat is conducted from the electronic component through the body of the cooling unit to the cooling medium. The body of the cooling unit is then cooled by the transition of the volatile species from the liquid to the vapor of the phase, for example, vaporization. The endothermic nature of the vaporization allows the cooling unit to produce more efficient cooling when compared to the cooling characteristics of a traditional reflective heat shield. Specifically, a reflective heat shield only assists in cooling the package by reflecting a portion of the heat directed towards the package and by a minimal conduction through the material. The efficiency of the reflective heat protector is limited by its reflective characteristics, which can not protect the infrared heat component, and by its surface area, which impacts its conduction properties. In contrast, the cooling unit of the invention dissipates heat by (1) driving heat away from the package; (2) heating the liquid phase of the volatile species to its heat of vaporization; (3) heating the volatile species by the latent heat of vaporization within the vapor phase; and (4) bringing heat from the cooling unit to the atmosphere furnace by degassing the vapor phase, from the volatile species. The general evolution of the heat path the cooling unit is represented by 3 arrows dashed in Figure 2. (30) Advantageously, the cooling unit does not prevent heat conduction by the PCB during the thermal process. This makes it possible to melt the solder paste, which facilitates the attachment of the spheres welded to the PCB, by the heat conduction by the board while maintaining a thermal slope by the assembly with the highest temperatures on the side of the package board . More specifically, the thermal slope produced by using the cooling unit allowing the common formation of welding or the reconstruction of high temperatures while protecting the heat sensitive characteristics within the package. The thermal slope is such that the high temperature near the soldering or reworking operation on the tips of the pack drops at a safe temperature on the internal characteristics of the pack. The specific characteristics of the heat reduction of the invention in various process conditions are further detailed in the following Examples. (31) As an optional aspect of the invention, the vapor formed from volatile species can be trapped by the recycling of the management system. Vaporized volatile species may then allow you to return to its liquid phase and be rejected in subsequent cooling units. Such recycling prevents adverse effects on the assembly package of the flying microchip, the PCB, the furnace, and the environment, while simultaneously improving the efficiency of the system cost. (32) In a cover, the cooling unit of the invention includes a piece attached to the sheet. In a cover, the sheet is placed at the bottom of the cooling unit, between the package cover and the cooling unit. In this coverage, the sheet acts to prevent contamination of the package during the endothermic process. In an alternative cover, the sheet is applied to the cover of the cooling unit. In this coverage, the sheet facilitates the operation of collecting and putting operations using the vacuum taken from the heads. In another cover, the sheet is placed on both the bottom and the cover of the cooling unit. Any acceptable accessory mechanism can be used to secure the sheet to the cooling unit, such as the cooling unit being molded into an organic mold or glued in place after the cooling unit has been formed. (33) In addition to the reflow process, electronic components are exposed to a process of high temperatures during the preheating stage before welding the wave, resumption stages and repair stages. During the preheating stage before welding the wave, the electronic component may be exposed to temperatures between 100 ° C and 200 ° C. A resumption stage is required when a component has undergone a normal process and is potentially viable, but some correctable process error must be addressed before use, for example, localized welding repair. During the resumption process, the localized temperatures are elevated to the reflow of the weld, for example, between about 100 ° C to 300 ° C. Similarly, the repair process is required when a discrete part of the electronic component is the root cause of the missing components. In order to return the component to the operating order, it is typically necessary to heat the localized area including and surrounding the discrete source of the fault at elevated temperatures similar to the resumption levels. In any of these or other stages of high temperature processes, a cooling unit may be attached to the electronic component to aid in heat dissipation. (34) In one of the coverages, after the process step is completed, the cooling unit is removed. In this regard, the invention involves bringing a temporary cooling unit within the thermal communication with the electronic component during the high temperature operations where the temporary cooling unit cools the electronic component and subsequently removes the temporary cooling unit from the thermal communication with the electronic component. A particular coverage involves holding the electronic component to an operation of high temperatures, temperatures between about 125 ° C and 300 ° C. (35) After the removal of the cooling unit, an alternate heat dissipating device can be attached to the electronic component, such as the heat sink 10 attached to the lid 14, as seen in Figure 3. The standby device Heat dissipation can be attached using thermal grease or glue, collectively represented as 12. This alternate heat dissipating device will provide permanent, heat dissipating service for the package. In other coverages, the cooling unit remains in the component after the process. In one of such coverage, the cooling unit is a temporary unit in that even when it remains in the component, it does not serve additional functions in a significant cooling or heat sink. In another coverage, the cooling unit also serves as a permanent cooling unit in this configuration is such that the functions as a heat sink during operation in service even after the cooling medium is exhausted. In this coverage, the cooling unit can be formed into a typical heatsink configuration shape, including cooling fins, as seen in heatsink 10 in Figure 3. (36) The following examples will illustrate the future the invention: EXAMPLE 1: MAXIMUM TEMPERATURE 125 ° C: (37) Commercial Grade Paris plaster (75% CaS04) power was mixed with water at a 2: 1 weight ratio. Lcm racks were thickly formed into an organic mold of the tray, then cut into six 3 cm samples. x 3 cm x 1 cm using a band saw. The samples were then stored in a desiccator to dry the samples. Samples were weighed at an average weight of 10.75 g. Two samples were soaked in water at room temperature for two hours. Two samples were soaked in the NR330 flow (solid content of 4% and p H of 2.6) at room temperature for two hours. The four soaked samples weighed an average of 13.45 g. To compare the affect, if any, of the printed circuit goes up to thickness, the three tests were made on three boards with a thickness of 60 milli inches, and three tests were made on three boards with a thickness of 90 milli inches. A thermal pair was placed in the center of a semiconductor package in each board (represented by TI), while another thermal pair was placed approximately 1 cm. of the edge of the same semiconductor package (represented by T2). The six samples were then exposed to the reflux process at a maximum temperature of 125 ° C.

Results: (38) The results of these six samples are graphically illustrated in Figures 4A-4F. (39) The thickness of the board did not appear to have a consistent effect on the performance samples. (40) For the two dry samples, there was virtually no weight loss. The maximum temperature of TI was approximately 9-12 ° C lower than that of T2. (41) For the two samples soaked in water, there was a reduction of approximately 10-20% of the weight of water absorbed. The maximum temperature of TI was approximately 58-63 ° C lower than in T2. Some residue from the boards was evident when the samples were removed after the process. (42) For the two samples soaked in flow, there was a reduction of approximately 10-20% of the absorbed weight of the flow. The maximum temperature of TI was approximately 35-45 ° C lower than in T2. Some residue from the board was evident when the samples were removed after the process.

EXAMPLE 2: MAXIMUM TEMPERATURE 220 ° C: (43) The experimental setup of Example 1 was duplicated to produce six additional samples, 2 of which were dried, two of which were soaked in water, and. two of which were soaked in flow. The experimental procedure was carried out in a temperature process of 220 ° C.

Results: (44) The results of these six trials are illustrated graphically in Figures 5A-5F. (45) The thickness of the board does not seem to have a constant effect on the performance of the samples. (46) For the two dry samples, there was a reduction of approximately 7-8% by weight, which represents the residual water from the hydration of the mixing process of the original sample. The maximum temperature of TI was approximately 43-48 ° C lower than in T2. (47) For the two samples soaked in water, there was a reduction close to 100% of the weight of the water absorbed. The maximum temperature in IT was approximately 67-88% lower than in T2. Some residue from the board was evident when the samples were removed after the process. (49) For the two samples soaked in the flow, there was a reduction of approximately 94-97% of the absorbed weight of the flow. The maximum temperature in TI was approximately 32-70 ° C lower than in T2. Some residue on the board was evident when the samples were removed after the process.

EXAMPLE 3: MAXIMUM TEMPERATURE 260 ° C: (49) The experimental setup of Example 1 was duplicated to produce six additional samples, two of which were dried, two of which were soaked in water, and two of which were soaked in water. flow. The experimental procedure was removed to a process of maximum temperature of 260 ° C.

Results: (50) The results of these six trials are illustrated graphically in Figures 6A-6F. (51) The thickness of the board does not seem to have a constant effect on the performance of the samples. (52) For the two dry samples, there was a reduction of approximately 8% by weight, which represents the residual water of the hydration for the sample mixing process. The maximum temperature is TI was approximately 47-49 ° C lower than in T2. (53) For the two samples soaked in water, there was a reduction of approximately 100% of the weight absorbed in water and approximately 2% of the dry weight of the samples, representing a loss of all the water absorbed during the two hours of soaking plus one portion of the residual water of the hydration in the sample. The maximum temperature in IT was approximately 67-68 ° C lower than in T2. Some residue on the board was evident when the samples were removed after the process. (54) For the two samples soaked in flow, there was a reduction of approximately 100% of the weight of the flow absorbed and approximately 10% of the dry weight of the samples, representing a loss of the entire flow absorbed during two hours of absorbing more than one portion. of the residual water of the hydration in the sample. The maximum temperature was approximately 73-85 ° C lower than in T2. Some residue on the board was evident when the sample was removed after the process. (55) When introducing elements of the present invention or of the preferred coverages, the articles "a", "an", "the" and "said" are attempts to signify that there are one or more of the elements. The terms "encompassing", "including" and "tending" are thought to be even a meaning that there may be other additional elements of the listed elements. (56) Due to the aforesaid, it will be seen that several objects of the invention are achieved and other advantageous results achieved. (57) As several changes can be made to the following methods and products without departing from the scope of the invention, it is thought that all the matter contained in the above description and demonstrated in the accompanying drawings will be interpreted as illustrative and not in a sense limited.

Claims (51)

1. CLAIMS: 1. A method for cooling an electronic component during a high-temperature operation during processing, repair, or resumption thereunder: by bringing a temporary cooling unit in a thermal communication with the electronic component; subjecting the electronic component to said high temperature operation during which the temporary cooling unit cools the electronic component; and removing the temporary cooling unit from the thermal communication with the electronic component.
2. 2. The method of claim 1 wherein the temporary cooling unit comprises the body of the cooling unit and a cooling means within the body of the cooling unit.
3. 3. The method of claim 1 wherein holding the electronic component in the said high temperature operation comprises holding the electronic component in the temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises a cooling medium; and whereby the cooling medium undergoes a phase of change in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process.
4. 4. The method of claim 1 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in the temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises the body of the cooling unit and a cooling liquid within the body of the cooling unit; and where the cooling liquid has a vaporization temperature between 100 ° C and said temperature process, whereby the cooling liquid undergoes vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process .
5. 5. The method of claim 1 wherein the temporary cooling unit cools the electronic component by means of an endothermic reaction or process within the cooling unit.
6. 6. The method of claim 1 wherein the temporary cooling unit cools the electronic component by means of an endothermic process between melting, vaporization and sublimation within the cooling unit.
7. 7. The method of claim 1 wherein the temporary cooling unit comprises an inorganic cooling unit body and a cooling medium within the body of the cooling unit.
8. 8. The method of claim 7 wherein the inorganic material is selected from a group consisting of CaS04 hydrate and crosslinked zirconium foam.
9. 9. The method of claim 1 wherein the temporary cooling unit comprises a cooling medium within the body of the inorganic cooling unit formed by ceramic material which casts into a temporary mold of the foam.
10. 10. The method of claim 1 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in a temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises water within the body of the cooling unit; and wherein the water undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process.
11. 11. The method of claim 1 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in the temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises the body of the cooling unit and a cooling liquid comprising water and soluble inorganic or organic species within the body of the cooling unit; and wherein the Cooling Liquid has a vaporization temperature between 100 ° C and said temperature process, wherein the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process .
12. 12. The method of claim 1 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in a temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises the body of the cooling unit and a cooling liquid comprising a soluble inorganic or organic species within the body of the cooling unit; wherein the cooling liquid has a vaporization temperature between 100 ° C and said temperature process, wherein the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process; and wherein the inorganic or organic soluble species provides additional endothermic cooling after vaporization of the cooling liquid.
13. 13. The method of claim 1 wherein holding the electronic component to said high temperature operation comprises holding the electronic component in a temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises the body of the cooling unit and a cooling means comprising the material of the welding flow within the body of the cooling unit; and wherein the cooling medium has a vaporization temperature between 100 ° C and said temperature process, wherein the cooling medium undergoes a vaporization in the endothermic temperature process thereby extracting value from the electronic component in the process of cooling. temperature.
14. 14. The method of claim 1 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in a temperature process between 125 ° C and 300 ° C; wherein the temporary cooling unit comprises the body of the cooling unit and a cooling liquid within the body of the cooling unit; wherein the cooling liquid has a vaporization temperature between 100 ° C and said temperature process, wherein the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process; and where the fourth method involves capturing and recycling steam from the vaporization of the cooling liquid.
15. 15. The method of claim 1 wherein bringing the temporary cooling unit in a thermal communication with the electronic component comprises joining the cooling unit to the electronic component by a technique selected from a group encompassing gravity, mechanical meanings, thermal grease, and sticky flow , and any other combination.
16. 16. The method of claim 2 wherein the future cooling unit comprises at least one sheet of the sheet.
17. 17. The method of the future claim 1 encompasses attaching a device of heat dissipation to the electronic component after said removal of the temporary cooling unit.
18. 18. A method for cooling an electronic component during a high temperature operation during manufacture, repair or resumption, from that, including: bringing a cooling unit in a thermal communication with the electronic component; holding the electronic component of said high temperature operation during which the cooling unit cools the electronic component by means of an endothermic reaction inside the cooling unit.
19. 19. The method of claim 18 wherein the cooling unit comprises the body of the cooling unit and a cooling means within the body of the cooling unit.
20. 20. The method of claim 18 wherein holding the electronic component in said operation of high temperature covers holding the electronic component in a process of temperature between 125 ° C and 300 ° C; wherein the cooling unit comprises the body of the cooling unit and a cooling liquid within the body of the cooling unit; and wherein the cooling liquid has a vaporization temperature between 100 ° C and said temperature process; where the cooling liquid undergoes a vaporization ene. Process of endothermic temperature thereby extracting heat from the electronic component in the process of temperature.
21. 21. The method of claim 18 wherein the cooling unit cools the electronic component by means of an endothermic reaction or process within the cooling unit.
22. 22. The method of claim 18 wherein the cooling unit cools the electronic component by means of an endothermic process selected from melt, vaporization, and sublimation within the cooling unit.
23. 23. The method of claim 18 wherein the cooling unit comprises the body of an inorganic cooling unit within the body of the cooling unit.
24. 24. The method of claim 23 wherein the inorganic material is selected from a group consisting of CaS? 4 hydrate and crosslinked zirconia foam.
25. 25. The method of claim 18 wherein the cooling unit comprises the cooling medium within the body of a cooling unit formed by ceramic material that casts into a temporary foam mold.
26. 26. The method of claim 18 wherein holding the electronic component in said high temperature operation comprises holding the electronic component to a process of temperature between 125 ° C and 300 ° C; wherein the cooling unit comprises water within the body of the cooling unit; and wherein the water undergoes a vaporization in the process of endothermic temperature thereby extracting heat from the electronic component in the process of temperature.
27. 27. The method of claim 18 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in a process of temperature between 125 ° C and 300 ° C; wherein the cooling unit comprises a body of the cooling unit and the cooling liquid comprises water and organic inorganic soluble species within 1 body of the cooling unit; and wherein the cooling liquid has a vaporization temperature of between 100 ° C and said temperature process, whereby the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat for the electronic component in the temperature process.
28. 28. In the method of claim 18 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in the process of temperature between 125 ° C and 300 ° C; wherein the cooling unit comprises the body of the cooling unit and the cooling liquid comprising soluble inorganic or organic species within the body of the cooling unit; wherein the cooling liquid has a vaporization temperature of between 100 ° C and said temperature process, such that the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the process Of temperature; and wherein the inorganic or organic soluble species provides an additional endothermic cooling after the vaporization of the cooling liquid.
29. 29. The method of claim 18 wherein holding the electronic component in said high temperature operation comprises holding the electronic component in a process of temperature between 125 ° C and 200 ° C; wherein the cooling unit comprises the body of the cooling unit and the cooling medium comprising the material of the welding flow within the body of the cooling unit; and wherein the cooling medium has a vaporization temperature of between 100 ° C and said temperature process, whereby the cooling medium undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the process Of temperature.
30. 30. The method of claim 18 wherein holding the electronic component in said operation of high temperature covers holding the electronic component in a process of temperature between 125 ° C and 300 ° C; wherein the cooling unit comprises the body of the cooling unit and the cooling liquid within the body of the cooling unit; wherein the cooling liquid has a vaporization temperature between about 100 ° C and said endothermic temperature process extracting heat from the electronic component in the temperature process; and where the future method involves capturing and recycling steam from the vaporization of the cooling liquid.
31. 31. The method of claim 18 wherein bringing the cooling unit in a thermal communication with the electronic component comprises joining the cooling unit to the electronic component by a technique selected from a group comprising gravity, mechanical significance, thermal grease and sticky flow, and any combination of these.
32. 32. The method of claim 18 wherein the future cooling unit comprises at least one piece of the sheet.
33. 33. The method of claim 18 comprising joining a heat dissipation device to the electronic component after removing the cooling unit.
34. 34. The method of claim 18 wherein the cooling unit comprises the body of the cooling unit having a heat sink configuration and a cooling means inside the body of the cooling unit.
35. 35. The method of claim 18 wherein the cooling unit encompasses the cooling unit body and a cooling medium within the cooling unit body, wherein the cooling unit body has a heat sink configuration for the cooling unit. provide cooling during the operation of the electronic component.
36. 36. The method of claim 18 wherein the cooling unit comprises the cooling unit's body and a cooling medium within the cooling unit's body, wherein the cooling unit's body, in which the body of the cooling unit The cooling unit has a heat sink configuration including cooling fins to provide cooling during the electronic component operation.
37. 37. A cooling unit to extract an electrical component during the exposure of the component in a process of temperature between 100 ° C and 300 ° C during the manufacture, repair, or resumption of the electrical component, the cooling unit covers a unit of the unit cooling and a cooling medium inside the body of the cooling unit, wherein the cooling unit undergoes an endothermic process or reaction in said temperature process.
38. 38. The cooling unit of claim 37 wherein the cooling medium within the cooling unit body is a cooling liquid; and wherein the cooling liquid has a vaporization temperature between 100 ° C and said temperature process, such that the cooling liquid undergoes a vaporization in the process of endothermic temperature of such node extracting heat from the electronic component in the process Of temperature.
39. 39. The cooling unit of claim 37 wherein the cooling unit cools the electronic component by means of an endothermic process selected from beating, vaporization, and sublimation within the cooling unit.
40. 40. The cooling unit of claim 37 wherein the cooling unit's body comprises an inorganic material.
41. 41. The cooling unit of claim 40 wherein the inorganic material is selected from a group consisting of CaS04 hydrate and crosslinked zirconia foam.
42. 42. The cooling unit of claim 37 wherein the cooling unit comprises a cooling medium within a core of the inorganic cooling unit formed by ceramic material casting into a temporary foam mold.
43. 43. The cooling unit of claim 37 wherein the cooling medium encompasses water within the cooling unit body; and in such a way that the water experiences a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process.
44. 44. The cooling unit of claim 37 wherein the cooling medium encompasses water and soluble inorganic and organic species within the cooling unit cell; and wherein the cooling medium has a vaporization temperature between 100 ° C and said temperature process, whereby the cooling medium undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process.
45. 45. The cooling unit of claim 37 wherein the cooling medium encompasses a cooling liquid and soluble inorganic or organic species within the cooling unit cell; and wherein the cooling liquid has a vaporization temperature of between 100 ° C and said temperature process, whereby the cooling liquid undergoes a vaporization in the endothermic temperature process in such a way that extracting heat from the electronic component in the process of temperature; and wherein the inorganic or organic soluble species provides an additional endothermic cooling after the vaporization of the cooling liquid.
46. 46. The cooling unit of claim 37 wherein the cooling medium encompasses the material of the weld flow within the cooling unit body; and wherein the cooling medium has a vaporization temperature between 100 ° C and said temperature process, whereby the cooling medium undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the process of cooling. temperature.
47. 47. The cooling unit of claim 37 wherein the cooling medium encompasses a cooling liquid within the cooling unit body; wherein the cooling liquid has a vaporization temperature between 100 ° C and said temperature process, whereby the cooling liquid undergoes a vaporization in the endothermic temperature process thereby extracting heat from the electronic component in the temperature process; and where the future method involves capturing and recycling steam for the vaporization of the cooling liquid.
48. 48. The cooling unit of claim 37 wherein the future cooling unit comprises at least a part of the sheet.
49. 49. The cooling unit of claim 37 wherein the cooling unit encompasses a cooling unit body having a heat sink configuration and a cooling medium within the cooling unit body.
50. 50. The unit of claim 37 wherein the cooling unit comprises a cooling unit body and a cooling medium within the cooling unit body, wherein the cooling unit body has a heat sink configuration for the cooling unit. provide cooling during the operation of the electronic component.
51. 51. The cooling unit of claim 37 wherein the cooling unit comprises a cooling unit body and a cooling medium within the cooling unit body, wherein the cooling unit body has a heatsink configuration. thermal including cooling fins to provide cooling during the operation in service of the electronic component.