MX9602021A - Procedimiento para la fabricacion de una placa de circuitos impresos y placa de circuitos impresos. - Google Patents

Procedimiento para la fabricacion de una placa de circuitos impresos y placa de circuitos impresos.

Info

Publication number
MX9602021A
MX9602021A MX9602021A MX9602021A MX9602021A MX 9602021 A MX9602021 A MX 9602021A MX 9602021 A MX9602021 A MX 9602021A MX 9602021 A MX9602021 A MX 9602021A MX 9602021 A MX9602021 A MX 9602021A
Authority
MX
Mexico
Prior art keywords
circuit plate
printed circuit
manufacture
printing
components
Prior art date
Application number
MX9602021A
Other languages
English (en)
Other versions
MXPA96002021A (es
Inventor
Andreas Bernhardt
Christian Beuther
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of MXPA96002021A publication Critical patent/MXPA96002021A/es
Publication of MX9602021A publication Critical patent/MX9602021A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Una placa de circuitos impresos 1, que debe equiparse por ambos lados con componentes y debe proveerse con elementos conductores térmicos, se fabrica en las siguientes etapas de trabajo: la placa de circuitos impresos 1 se imprime con pasta de soldar sobre su parte inferior, se equipa con componentes y se suelda; sobre la parte inferior de la placa de circuitos impresos 1 se fija un cuerpo de refrigeracion plano, y la placa de circuitos impresos 1 se imprime con pasta de soldar sobre su parte superior, se equipa con componentes y se suelda. La placa de circuitos impresos equipada se emplea especialmente en aparatos de control de la técnica de automoviles.
MX9602021A 1995-05-30 1996-05-29 Procedimiento para la fabricacion de una placa de circuitos impresos y placa de circuitos impresos. MX9602021A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19519776A DE19519776A1 (de) 1995-05-30 1995-05-30 Verfahren zum Herstellen einer Leiterplatte und Leiterplatte
DE19519776.3 1995-05-30

Publications (2)

Publication Number Publication Date
MXPA96002021A MXPA96002021A (es) 1997-08-01
MX9602021A true MX9602021A (es) 1997-08-30

Family

ID=7763204

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9602021A MX9602021A (es) 1995-05-30 1996-05-29 Procedimiento para la fabricacion de una placa de circuitos impresos y placa de circuitos impresos.

Country Status (4)

Country Link
KR (1) KR960044013A (es)
DE (1) DE19519776A1 (es)
FR (1) FR2734981B1 (es)
MX (1) MX9602021A (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102848B4 (de) * 2000-05-31 2004-04-15 Sebastian Erb Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien
DE102010008553B4 (de) 2010-02-19 2011-09-22 Continental Automotive Gmbh Vorrichtung zur Abschirmung eines Elektronikmoduls

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8114325U1 (de) * 1981-05-14 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Wärmeableitungsvorrichtung
US5078082A (en) * 1989-08-16 1992-01-07 Smt East Corporation Method and apparatus for applying bonding material to a populated mounting surface
DE4222838C2 (de) * 1991-09-21 2002-03-28 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
JPH05343874A (ja) * 1992-06-11 1993-12-24 Mitsubishi Materials Corp ハイブリッドｉｃの放熱構造
DE4234022C2 (de) * 1992-10-09 1995-05-24 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand

Also Published As

Publication number Publication date
FR2734981A1 (fr) 1996-12-06
DE19519776A1 (de) 1997-02-13
KR960044013A (ko) 1996-12-23
FR2734981B1 (fr) 2000-04-21

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