MX9202019A - Proceso para la formacion de configuraciones en un area de una pieza de trabajo metalica. - Google Patents

Proceso para la formacion de configuraciones en un area de una pieza de trabajo metalica.

Info

Publication number
MX9202019A
MX9202019A MX9202019A MX9202019A MX9202019A MX 9202019 A MX9202019 A MX 9202019A MX 9202019 A MX9202019 A MX 9202019A MX 9202019 A MX9202019 A MX 9202019A MX 9202019 A MX9202019 A MX 9202019A
Authority
MX
Mexico
Prior art keywords
configurations
formation
area
metallic workpiece
workpiece
Prior art date
Application number
MX9202019A
Other languages
English (en)
Inventor
James F Rooney
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX9202019A publication Critical patent/MX9202019A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
MX9202019A 1991-05-03 1992-04-30 Proceso para la formacion de configuraciones en un area de una pieza de trabajo metalica. MX9202019A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,058 US5144709A (en) 1991-05-03 1991-05-03 Formation of shapes in a metal workpiece

Publications (1)

Publication Number Publication Date
MX9202019A true MX9202019A (es) 1992-11-01

Family

ID=24791379

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9202019A MX9202019A (es) 1991-05-03 1992-04-30 Proceso para la formacion de configuraciones en un area de una pieza de trabajo metalica.

Country Status (4)

Country Link
US (1) US5144709A (es)
AU (1) AU2265292A (es)
MX (1) MX9202019A (es)
WO (1) WO1992019396A1 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312080A (en) * 1992-03-12 1994-05-17 Walbro Corporation Fuel regulator mounting plate and forming process
US5410809A (en) * 1993-03-30 1995-05-02 The Torrington Company Method of making a bearing cage with depressed slot end
US6271584B1 (en) * 1996-02-28 2001-08-07 Siemens Aktiengesellschaft Arrangement of electronic components on a bearer strip
US5735155A (en) * 1996-10-24 1998-04-07 Morton Manufacturing Company Method for manufacturing patterned tread plates
US6364260B1 (en) * 1998-02-26 2002-04-02 Moore Push-Pin Company Reusable single part bend to grip partition and door hardware
US6660562B2 (en) * 2001-12-03 2003-12-09 Azimuth Industrial Co., Inc. Method and apparatus for a lead-frame air-cavity package
US7566587B2 (en) * 2001-12-03 2009-07-28 Azimuth Industrial Co., Inc. Method and apparatus for packaging electronic components
JP3654296B2 (ja) * 2002-08-20 2005-06-02 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
ITPD20020274A1 (it) * 2002-10-22 2004-04-23 Pegasus Srl Metodo per la lavorazione di tranciatura di particolari metallici.
JP4407180B2 (ja) * 2003-07-23 2010-02-03 セイコーエプソン株式会社 液体噴射ヘッドの製造方法および装置，金型ならびにそれによって得られた液体噴射ヘッド
JP4729840B2 (ja) * 2003-08-12 2011-07-20 セイコーエプソン株式会社 液体噴射ヘッドの製造方法およびそれによって得られた液体噴射ヘッド
DE102004035797B9 (de) * 2004-07-23 2006-07-13 Langenstein & Schemann Gmbh Verfahren und Vorrichtung zum Überführen eines Werkstücks
US7591696B1 (en) * 2008-05-19 2009-09-22 Embarq Holdings Company, Llc Ground bonding strap
US8434340B2 (en) * 2008-12-23 2013-05-07 Barnes Group, Inc. Method for forming a stamped metal part
US8155770B2 (en) * 2009-03-31 2012-04-10 Globalfoundries Inc. Method and apparatus for dispatching workpieces to tools based on processing and performance history
ATE530308T1 (de) * 2009-07-31 2011-11-15 Groz Beckert Kg Stanzwerkzeug mit schwimmend gelagertem stempel
US9056348B2 (en) * 2012-07-24 2015-06-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for manufacturing back frame for flat panel display device
DE102012109434A1 (de) * 2012-10-04 2014-04-24 Groz-Beckert Kg Verfahren und Werkzeugeinheit zur Einstellung eines Stanzspalts
CN105478579B (zh) * 2016-01-20 2017-06-16 江苏常胜电器股份有限公司 热保护器双金属片加工方法及其设备
USD786381S1 (en) 2016-12-03 2017-05-09 Big Dog Floats, L.L.C. Bone-shaped float
FR3077750B1 (fr) * 2018-02-09 2020-01-10 Psa Automobiles Sa Procede de realisation d’une forme femelle de type « os de chien » dans une piece mecanique
CN112845762B (zh) * 2020-12-30 2022-02-18 安徽众成合金科技有限公司 一种用于合金材料电子元件挤压成型装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2646613A (en) * 1946-09-12 1953-07-28 Honeywell Regulator Co Method of making switch contacts
US3391456A (en) * 1965-04-30 1968-07-09 Sylvania Electric Prod Multiple segment array making
US3368383A (en) * 1965-09-27 1968-02-13 Leonard E. Marszal Adjustable stock lifter
US3434327A (en) * 1966-11-01 1969-03-25 Mc Donnell Douglas Corp Stress coining
US4047417A (en) * 1975-10-16 1977-09-13 Johns-Manville Corporation Deeply embossed sheet product and method and apparatus for the production thereof
JPS5351172A (en) * 1976-10-21 1978-05-10 Wako Kk Method of fabricating flanged hollow products
JPS5855132A (ja) * 1981-09-29 1983-04-01 Mazda Motor Corp 板材の紋り加工方法
US4509365A (en) * 1983-09-26 1985-04-09 Fmc Corporation Method and apparatus for weighing a sucker-rod pumped well
US4553418A (en) * 1984-03-15 1985-11-19 Artos Engineering Company Apparatus for producing elongated workpieces of predetermined transverse profile
US4587827A (en) * 1984-08-07 1986-05-13 Wessels Ewald J H Method of sheet metal processing
US4854024A (en) * 1986-12-04 1989-08-08 Siemens-Bendix Automotive Electronics L.P. Method of making multi-stream thin edge orifice disks for valves
US4803880A (en) * 1987-12-21 1989-02-14 United Technologies Corporation Hollow article forging process
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US4928512A (en) * 1988-11-14 1990-05-29 Olin Corporation Die set for the formation of cavities for metal packages to house electronic devices

Also Published As

Publication number Publication date
US5144709A (en) 1992-09-08
WO1992019396A1 (en) 1992-11-12
AU2265292A (en) 1992-12-21

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