MX2023013304A - Cooling device. - Google Patents

Cooling device.

Info

Publication number
MX2023013304A
MX2023013304A MX2023013304A MX2023013304A MX2023013304A MX 2023013304 A MX2023013304 A MX 2023013304A MX 2023013304 A MX2023013304 A MX 2023013304A MX 2023013304 A MX2023013304 A MX 2023013304A MX 2023013304 A MX2023013304 A MX 2023013304A
Authority
MX
Mexico
Prior art keywords
sheet
upper face
cooling
cooling device
channel
Prior art date
Application number
MX2023013304A
Other languages
Spanish (es)
Inventor
Marco Lorenz
Yannick Fabian Frey
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of MX2023013304A publication Critical patent/MX2023013304A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a cooling device for cooling components, comprising at least one first cooling channel (11). The first cooling channel (11) is filled with a working medium (6) which is simultaneously gaseous and liquid in the first channel (11). According to the invention, the cooling device (1) comprises at least one stack (20) of metal sheets (21, 22, 23), wherein the stack (10) of metal sheets (21, 22, 23) comprises at least one first sheet (21) with a first upper face (25) and a first lower face (26), and a second sheet (22), the first cooling channel (11) is formed as a first depression (27) in the upper face (25) of the first sheet (21), the second sheet (22) is arranged on the upper face (25) of the first sheet (21), the first depression (27) in the first sheet (21) on the upper face (25) of the first sheet (21) is covered by the second sheet (22), and the second sheet (22) closes the first cooling channel (11).
MX2023013304A 2021-05-11 2022-04-25 Cooling device. MX2023013304A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021204769.6A DE102021204769A1 (en) 2021-05-11 2021-05-11 cooler
PCT/EP2022/060818 WO2022238096A1 (en) 2021-05-11 2022-04-25 Cooling device

Publications (1)

Publication Number Publication Date
MX2023013304A true MX2023013304A (en) 2023-12-05

Family

ID=81846430

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023013304A MX2023013304A (en) 2021-05-11 2022-04-25 Cooling device.

Country Status (5)

Country Link
EP (1) EP4338200A1 (en)
CN (1) CN117321758A (en)
DE (1) DE102021204769A1 (en)
MX (1) MX2023013304A (en)
WO (1) WO2022238096A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022209696A1 (en) 2022-09-15 2024-03-21 Robert Bosch Gesellschaft mit beschränkter Haftung Method for producing a pulsating heat pipe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7851080B2 (en) * 2008-04-09 2010-12-14 Gm Global Technology Operations, Inc. Battery cooling plate design with discrete channels
AT511887B1 (en) * 2011-09-12 2016-05-15 Avl List Gmbh RECHARGEABLE BATTERY
US10085362B2 (en) * 2016-09-30 2018-09-25 International Business Machines Corporation Cold plate device for a two-phase cooling system
US20190234691A1 (en) * 2018-01-26 2019-08-01 Taiwan Microloops Corp. Thermal module
FR3091791B1 (en) * 2018-11-16 2022-06-10 Valeo Systemes Thermiques DEVICE FOR HEAT TREATMENT OF AN ELECTRICAL ELEMENT LIKELY TO HEAT AND METHOD FOR IMPLEMENTING THE HEAT TREATMENT DEVICE

Also Published As

Publication number Publication date
EP4338200A1 (en) 2024-03-20
WO2022238096A1 (en) 2022-11-17
CN117321758A (en) 2023-12-29
DE102021204769A1 (en) 2022-11-17

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