MX2023003926A - Bloque de tierra ajustable y sistema de prueba con bloque de tierra ajustable. - Google Patents

Bloque de tierra ajustable y sistema de prueba con bloque de tierra ajustable.

Info

Publication number
MX2023003926A
MX2023003926A MX2023003926A MX2023003926A MX2023003926A MX 2023003926 A MX2023003926 A MX 2023003926A MX 2023003926 A MX2023003926 A MX 2023003926A MX 2023003926 A MX2023003926 A MX 2023003926A MX 2023003926 A MX2023003926 A MX 2023003926A
Authority
MX
Mexico
Prior art keywords
blades
ground block
blade
compliant ground
compliant
Prior art date
Application number
MX2023003926A
Other languages
English (en)
Inventor
Valts Treibergs
Pat Joyal
Leslie Fliegelman
Original Assignee
Johnstech Int Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech Int Corporation filed Critical Johnstech Int Corporation
Publication of MX2023003926A publication Critical patent/MX2023003926A/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Se describe un bloque de tierra ajustable para un sistema de prueba para probar dispositivos de circuito integrado. El bloque de conexión a tierra ajustable incluye una pluralidad de hojas eléctricamente conductoras en una relación generalmente paralela lado a lado. Las hojas están configuradas para deslizarse longitudinalmente entre sí. El bloque también incluye un elastómero configurado para retener la pluralidad de hojas. Cada hoja de la pluralidad de hojas incluye un primer extremo y un segundo extremo opuesto al primer extremo en la dirección longitudinal. La pluralidad de hojas está dispuesta de modo que el primer extremo de cada hoja de la pluralidad de hojas esté opuesto al primer extremo de una hoja adyacente en la dirección longitudinal, de modo que el primer extremo de una hoja esté adyacente al segundo extremo de la hoja adyacente. El elastómero es al menos tubular (por ejemplo, cilíndrico sólido o hueco) en parte y no conductor.
MX2023003926A 2020-10-06 2021-10-05 Bloque de tierra ajustable y sistema de prueba con bloque de tierra ajustable. MX2023003926A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063088007P 2020-10-06 2020-10-06
PCT/US2021/053488 WO2022076354A1 (en) 2020-10-06 2021-10-05 Compliant ground block and testing system having compliant ground block

Publications (1)

Publication Number Publication Date
MX2023003926A true MX2023003926A (es) 2023-05-09

Family

ID=80931283

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023003926A MX2023003926A (es) 2020-10-06 2021-10-05 Bloque de tierra ajustable y sistema de prueba con bloque de tierra ajustable.

Country Status (10)

Country Link
US (1) US11821943B2 (es)
EP (1) EP4226166A1 (es)
JP (1) JP2023545037A (es)
KR (1) KR20230082674A (es)
CN (1) CN116547544A (es)
CA (1) CA3194134A1 (es)
IL (1) IL301771A (es)
MX (1) MX2023003926A (es)
TW (1) TW202225712A (es)
WO (1) WO2022076354A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11802909B2 (en) * 2020-10-06 2023-10-31 Johnstech International Corporation Compliant ground block and testing system having compliant ground block
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460010A (en) 1968-05-15 1969-08-05 Ibm Thin film decoupling capacitor incorporated in an integrated circuit chip,and process for making same
US6299459B1 (en) 2001-02-02 2001-10-09 Agilent Technologies, Inc. compressible conductive interface
US6814585B2 (en) 2002-04-19 2004-11-09 Johnstech International Corporation Electrical connector with resilient contact
US6861667B2 (en) 2002-07-15 2005-03-01 Johnstech International Corporation Grounding inserts
US7074049B2 (en) 2004-03-22 2006-07-11 Johnstech International Corporation Kelvin contact module for a microcircuit test system
US7625219B2 (en) 2005-04-21 2009-12-01 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus
KR100963498B1 (ko) * 2005-10-31 2010-06-17 가부시키가이샤 니혼 마이크로닉스 전기적 접속장치
US7737708B2 (en) * 2006-05-11 2010-06-15 Johnstech International Corporation Contact for use in testing integrated circuits
WO2008083404A1 (en) 2007-01-02 2008-07-10 Johnstech International Corporation Microcircuit testing interface having kelvin and signal contacts within a single slot
US20080297142A1 (en) 2007-02-02 2008-12-04 Alladio Patrick J Contact insert for a microcircuit test socket
US7862391B2 (en) 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
US8952714B2 (en) * 2011-05-27 2015-02-10 Jf Microtechnology Sdn. Bhd. Electrical interconnect assembly
MY168237A (en) * 2012-10-12 2018-10-15 Jf Microtechnology Sdn Bhd Ground contact of an integrated circuit testing apparatus
KR102121754B1 (ko) 2018-12-19 2020-06-11 주식회사 오킨스전자 상하 2개의 영역으로 구분되는 단일 코일 스프링을 포함하는 테스트 소켓
TWD205153S (zh) 2019-08-14 2020-06-11 浩暘工業股份有限公司 連接器端子
US11802909B2 (en) * 2020-10-06 2023-10-31 Johnstech International Corporation Compliant ground block and testing system having compliant ground block

Also Published As

Publication number Publication date
IL301771A (en) 2023-05-01
EP4226166A1 (en) 2023-08-16
CA3194134A1 (en) 2022-04-14
CN116547544A (zh) 2023-08-04
US20220107359A1 (en) 2022-04-07
WO2022076354A1 (en) 2022-04-14
TW202225712A (zh) 2022-07-01
US11821943B2 (en) 2023-11-21
JP2023545037A (ja) 2023-10-26
KR20230082674A (ko) 2023-06-08

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