MX2022014394A - Fuentes de energia electrica autonoma. - Google Patents
Fuentes de energia electrica autonoma.Info
- Publication number
- MX2022014394A MX2022014394A MX2022014394A MX2022014394A MX2022014394A MX 2022014394 A MX2022014394 A MX 2022014394A MX 2022014394 A MX2022014394 A MX 2022014394A MX 2022014394 A MX2022014394 A MX 2022014394A MX 2022014394 A MX2022014394 A MX 2022014394A
- Authority
- MX
- Mexico
- Prior art keywords
- electrical power
- autonomous electrical
- power source
- conductor
- autonomous
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 4
- 230000001143 conditioned effect Effects 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 238000003306 harvesting Methods 0.000 abstract 1
- 239000013589 supplement Substances 0.000 abstract 1
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/378—Electrical supply
- A61N1/3785—Electrical supply generated by biological activity or substance, e.g. body movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J45/00—Discharge tubes functioning as thermionic generators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/001—Energy harvesting or scavenging
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/008—Alleged electric or magnetic perpetua mobilia
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
- G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2310/00—The network for supplying or distributing electric power characterised by its spatial reach or by the load
- H02J2310/10—The network having a local or delimited stationary reach
- H02J2310/20—The network being internal to a load
- H02J2310/23—The load being a medical device, a medical implant, or a life supporting device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Photovoltaic Devices (AREA)
- Heat-Pump Type And Storage Water Heaters (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Control Of Electric Motors In General (AREA)
Abstract
Se proporciona una fuente de energía eléctrica autónoma a escala de micras única y amigable con el ambiente para generar energía renovable o un complemento de energía renovable en sistemas electrónicos, dispositivos electrónicos y componentes de sistemas electrónicos. La fuente de energía eléctrica autónoma incluye un primer conductor con una superficie confrontada acondicionada para tener una baja función de trabajo, un segundo conductor con una superficie confrontada que tiene una función de trabajo comparativamente más alta y una capa dieléctrica de no más de 200 nm de espesor intercalada entre las superficies confrontadas respectivas del primer conductor y el segundo conductor. La fuente de energía eléctrica autónoma se configura para recolectar energía térmica mínima de cualquier fuente en un ambiente por encima del cero absoluto. También se proporciona un componente de fuente de energía eléctrica autónoma que incluye una pluralidad de elementos constituyentes de fuente de energía eléctrica autónoma conectados eléctricamente entre sí para aumentar una salida de energía de la fuente de energía eléctrica autónoma.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/484,054 US9893261B1 (en) | 2017-04-10 | 2017-04-10 | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
US15/484,033 US11605770B2 (en) | 2017-04-10 | 2017-04-10 | Autonomous electrical power sources |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022014394A true MX2022014394A (es) | 2022-12-02 |
Family
ID=61148045
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022014394A MX2022014394A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
MX2022008747A MX2022008747A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022008747A MX2022008747A (es) | 2017-04-10 | 2018-10-08 | Fuentes de energia electrica autonoma. |
Country Status (4)
Country | Link |
---|---|
US (7) | US9893261B1 (es) |
AU (1) | AU2023202987A1 (es) |
MX (2) | MX2022014394A (es) |
WO (1) | WO2018190905A1 (es) |
Families Citing this family (18)
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US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
US9786718B1 (en) | 2016-04-09 | 2017-10-10 | Face International Corporation | Integrated circuit components incorporating energy harvesting components/devices, and methods for fabrication, manufacture and production of integrated circuit components incorporating energy harvesting components/devices |
US11980102B2 (en) | 2016-04-09 | 2024-05-07 | Face International Corporation | Systems and devices powered by autonomous electrical power sources |
US11957922B2 (en) | 2016-04-09 | 2024-04-16 | Face International Corporation | Structurally embedded and inhospitable environment systems having autonomous electrical power sources |
US9793317B1 (en) | 2016-04-09 | 2017-10-17 | Face International Corporation | Devices and systems incorporating energy harvesting components/devices as autonomous energy sources and as energy supplementation, and methods for producing devices and systems incorporating energy harvesting components/devices |
US20220029082A1 (en) * | 2016-04-09 | 2022-01-27 | Face International Corporation | Methods for fabrication, manufacture and production of energy harvesting components and devices |
US9893261B1 (en) | 2017-04-10 | 2018-02-13 | Face International Corporation | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
US10109781B1 (en) | 2017-04-10 | 2018-10-23 | Face International Corporation | Methods for fabrication, manufacture and production of an autonomous electrical power source |
US11101421B2 (en) | 2019-02-25 | 2021-08-24 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
US11244816B2 (en) | 2019-02-25 | 2022-02-08 | Birmingham Technologies, Inc. | Method of manufacturing and operating nano-scale energy conversion device |
US10950706B2 (en) | 2019-02-25 | 2021-03-16 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
US11046578B2 (en) | 2019-05-20 | 2021-06-29 | Birmingham Technologies, Inc. | Single-nozzle apparatus for engineered nano-scale electrospray depositions |
AU2021258210A1 (en) | 2020-04-22 | 2022-11-24 | Board Of Trustees Of The University Of Arkansas | Device for ambient thermal and vibration energy harvesting |
US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
CN114152981B (zh) * | 2021-12-03 | 2023-08-08 | 成都信息工程大学 | 一种势能波函数域地震资料品质因子估计方法 |
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KR101670131B1 (ko) * | 2014-09-23 | 2016-10-28 | 한국과학기술원 | 코팅 대전층을 포함하는 접촉 대전 발전기 및 그 생성 방법 |
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US9893261B1 (en) * | 2017-04-10 | 2018-02-13 | Face International Corporation | Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources |
-
2017
- 2017-04-10 US US15/484,054 patent/US9893261B1/en active Active
- 2017-10-09 WO PCT/US2017/055808 patent/WO2018190905A1/en active Application Filing
-
2018
- 2018-02-12 US US15/894,902 patent/US10014461B1/en active Active
- 2018-07-01 US US16/024,905 patent/US10249810B2/en active Active
- 2018-10-08 MX MX2022014394A patent/MX2022014394A/es unknown
- 2018-10-08 MX MX2022008747A patent/MX2022008747A/es unknown
-
2019
- 2019-04-01 US US16/372,388 patent/US10600950B2/en active Active
-
2020
- 2020-03-23 US US16/827,658 patent/US10756249B2/en active Active
- 2020-08-24 US US17/001,558 patent/US11571583B2/en active Active
-
2023
- 2023-03-13 US US18/120,977 patent/US12048850B2/en active Active
- 2023-05-12 AU AU2023202987A patent/AU2023202987A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
MX2022008747A (es) | 2022-07-27 |
US11571583B2 (en) | 2023-02-07 |
US10249810B2 (en) | 2019-04-02 |
US10600950B2 (en) | 2020-03-24 |
US20180323363A1 (en) | 2018-11-08 |
US20200388744A1 (en) | 2020-12-10 |
AU2023202987A1 (en) | 2023-06-01 |
US10014461B1 (en) | 2018-07-03 |
US20200227615A1 (en) | 2020-07-16 |
WO2018190905A1 (en) | 2018-10-18 |
US20230215713A1 (en) | 2023-07-06 |
US9893261B1 (en) | 2018-02-13 |
US20190229253A1 (en) | 2019-07-25 |
US12048850B2 (en) | 2024-07-30 |
US10756249B2 (en) | 2020-08-25 |
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