MX2022006118A - Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits. - Google Patents

Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits.

Info

Publication number
MX2022006118A
MX2022006118A MX2022006118A MX2022006118A MX2022006118A MX 2022006118 A MX2022006118 A MX 2022006118A MX 2022006118 A MX2022006118 A MX 2022006118A MX 2022006118 A MX2022006118 A MX 2022006118A MX 2022006118 A MX2022006118 A MX 2022006118A
Authority
MX
Mexico
Prior art keywords
ions
mixtures
group
aforementioned
carboxylic acid
Prior art date
Application number
MX2022006118A
Other languages
Spanish (es)
Inventor
Sebastian Lang
Original Assignee
Atotech Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh & Co Kg filed Critical Atotech Deutschland Gmbh & Co Kg
Publication of MX2022006118A publication Critical patent/MX2022006118A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Abstract

The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxo-ions thereof, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state; complexing agents CA1, CA2, CA3, and CA4, wherein CA1, CA2, CA3, and CA4 are all different from each other, wherein each of CA1 and CA2 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned; wherein CA3 is selected from the group consisting of aliphatic compounds having exactly one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned; and wherein CA4 is selected from the group consisting of aromatic compounds having at least one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned.The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxo-ions thereof, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state; complexing agents CA1, CA2, CA3, and CA4, wherein CA1, CA2, CA3, and CA4 are all different from each other, wherein each of CA1 and CA2 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned; wherein CA3 is selected from the group consisting of aliphatic compounds having exactly one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned; and wherein CA4 is selected from the group consisting of aromatic compounds having at least one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned. A method, system and computer program for controlling operation of an automated storage and retrieval system (1) during rebuilding its physical design. The method comprises a planning and designing phase where a new design is established and were storage columns (105) with a rail system (108) that is affected by the rebuilding are excludes from a selection of available routes for container handling vehicles (201) operating on the storage system (1), a relocation phase where storage containers (201) located in excluded storage columns (105) are relocated to other storage columns (105), a rerouting phase were traffic flow of container handling vehicles (201) are rerouted according to available routes and where the master controller (220) is instructed to control the vehicles (201) according to the available routes, a rebuilding phase were the storage system (1) is rebuilt according to the new physical design, and a final routing phase were the routing planner (200) controls traffic flow of the vehicles (201) according to available routes on the rail system (108) of the rebuilt physical design.
MX2022006118A 2019-11-20 2020-11-19 Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits. MX2022006118A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19210301 2019-11-20
PCT/EP2020/082699 WO2021099475A1 (en) 2019-11-20 2020-11-19 Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits

Publications (1)

Publication Number Publication Date
MX2022006118A true MX2022006118A (en) 2022-06-14

Family

ID=68834931

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022006118A MX2022006118A (en) 2019-11-20 2020-11-19 Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits.

Country Status (8)

Country Link
US (1) US20220389588A1 (en)
EP (1) EP4061981A1 (en)
JP (1) JP7244709B2 (en)
KR (1) KR20220103131A (en)
CN (1) CN114729455A (en)
CA (1) CA3158576A1 (en)
MX (1) MX2022006118A (en)
WO (1) WO2021099475A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2847327A (en) 1954-10-25 1958-08-12 Gen Am Transport Processes of chemical nickel plating and baths therefor
JP2848103B2 (en) * 1992-03-19 1999-01-20 上村工業株式会社 Magnetic recording medium
US7410899B2 (en) 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
RU2008111820A (en) * 2007-03-29 2009-10-10 Ибара Корпорейшн (JP) ELECTROLYTE FOR DEPOSITING OF A GALVANIC COATING BY THE CHEMICAL RESTORATION METHOD AND METHOD FOR PRODUCING A HIGH-TEMPERATURE DEVICE ELEMENT USING SUCH ELECTROLYTE
CN103352213B (en) 2013-06-18 2016-08-10 宝鸡多元合金科技有限公司 Environment-friendly type height anti-H 2 S and high abrasion Ni-P-W-Mo quaternary alloy plating solution and compound method thereof
US9783891B2 (en) 2014-04-24 2017-10-10 Atotech Deutschland Gmbh Iron boron alloy coatings and a process for their preparation
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
EP3034650B1 (en) 2014-12-16 2017-06-21 ATOTECH Deutschland GmbH Plating bath compositions for electroless plating of metals and metal alloys
EP3409815B1 (en) 2017-06-02 2020-08-05 ATOTECH Deutschland GmbH Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits
JP6466521B2 (en) * 2017-06-28 2019-02-06 小島化学薬品株式会社 Electroless plating process
JP6474860B2 (en) * 2017-06-28 2019-02-27 小島化学薬品株式会社 Electroless nickel strike plating solution and method for forming nickel plating film
CN109112509A (en) 2018-10-29 2019-01-01 重庆立道新材料科技有限公司 A kind of high corrosion-resistant chemical nickel-plating liquid and preparation method thereof
CN113106431B (en) 2021-04-27 2023-03-28 深圳市优讯佳电子科技有限公司 Storage medium for heat assisted magnetic recording and preparation method thereof

Also Published As

Publication number Publication date
WO2021099475A1 (en) 2021-05-27
US20220389588A1 (en) 2022-12-08
KR20220103131A (en) 2022-07-21
EP4061981A1 (en) 2022-09-28
JP7244709B2 (en) 2023-03-22
JP2022548419A (en) 2022-11-18
CN114729455A (en) 2022-07-08
CA3158576A1 (en) 2021-05-27

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