MX2017007093A - Metodo y sistema para procesar un sustrato de circuito. - Google Patents
Metodo y sistema para procesar un sustrato de circuito.Info
- Publication number
- MX2017007093A MX2017007093A MX2017007093A MX2017007093A MX2017007093A MX 2017007093 A MX2017007093 A MX 2017007093A MX 2017007093 A MX2017007093 A MX 2017007093A MX 2017007093 A MX2017007093 A MX 2017007093A MX 2017007093 A MX2017007093 A MX 2017007093A
- Authority
- MX
- Mexico
- Prior art keywords
- substrate
- curable material
- mask
- ultraviolet curable
- processing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Una matriz de diodos emisores de luz ultravioleta puede curar material curable por ultravioleta, tal como una máscara o tinta de soldadura, que se haya aplicado a un sustrato en conexión con la fabricación de dispositivos de circuito electrónico. El sustrato se puede colocar en una carcasa asociada con una estación de procesamiento de una operación de fabricación. Una máscara o una plantilla se puede colocar adyacente al sustrato. El material curable por ultravioleta puede aplicarse al sustrato a través de la máscara o plantilla, por ejemplo usando una rasqueta. Los diodos emisores de luz ultravioleta se pueden mover sobre el sustrato para curar el material curable por ultravioleta. El sustrato con el material curado puede retirarse del alojamiento.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/181,832 US20170359903A1 (en) | 2016-06-14 | 2016-06-14 | Method and System for Processing a Circuit Substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2017007093A true MX2017007093A (es) | 2018-08-28 |
Family
ID=60573478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2017007093A MX2017007093A (es) | 2016-06-14 | 2017-06-05 | Metodo y sistema para procesar un sustrato de circuito. |
Country Status (2)
Country | Link |
---|---|
US (1) | US20170359903A1 (es) |
MX (1) | MX2017007093A (es) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6697694B2 (en) * | 1998-08-26 | 2004-02-24 | Electronic Materials, L.L.C. | Apparatus and method for creating flexible circuits |
US20020192569A1 (en) * | 2001-05-15 | 2002-12-19 | The Chromaline Corporation | Devices and methods for exposure of photoreactive compositions with light emitting diodes |
US6561640B1 (en) * | 2001-10-31 | 2003-05-13 | Xerox Corporation | Systems and methods of printing with ultraviolet photosensitive resin-containing materials using light emitting devices |
US9661755B2 (en) * | 2009-07-06 | 2017-05-23 | Camtek Ltd. | System and a method for solder mask inspection |
US20120194622A1 (en) * | 2011-01-31 | 2012-08-02 | Camtek Ltd. | Ultra violet light emitting diode curing of uv reactive ink |
JP5741078B2 (ja) * | 2011-03-09 | 2015-07-01 | セイコーエプソン株式会社 | 印刷装置 |
US8573766B2 (en) * | 2011-09-16 | 2013-11-05 | Lumen Dynamics Group Inc. | Distributed light sources and systems for photo-reactive curing |
JP2014178249A (ja) * | 2013-03-15 | 2014-09-25 | Sumitomo Electric Ind Ltd | フィルム製造方法、フィルム製造プロセスモニタ装置及びフィルム検査方法 |
US20170266948A1 (en) * | 2016-03-16 | 2017-09-21 | Intel Corporation | Modular squeegee head apparatus for printing materials |
-
2016
- 2016-06-14 US US15/181,832 patent/US20170359903A1/en not_active Abandoned
-
2017
- 2017-06-05 MX MX2017007093A patent/MX2017007093A/es unknown
Also Published As
Publication number | Publication date |
---|---|
US20170359903A1 (en) | 2017-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3618107A4 (en) | CERAMIC CIRCUIT BOARD, MANUFACTURING METHOD OF CERAMIC CIRCUIT BOARD, AND MODULE USING CERAMIC CIRCUIT BOARD | |
PH12016501665A1 (en) | Securing element for securing to a printed circuit board, and securing apparatus and method for spaced connection of printed circuit boards using such a securing element | |
HK1256985A1 (zh) | 用於將部件安裝在基板上的設備和方法 | |
EP3468316A4 (en) | CAMERA MODULE MOLDED PRINTED CIRCUIT BOARD, MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD | |
EP3419276A4 (en) | LINE CAMERA MODULE, LIGHT-SENSITIVATED SHAPED COMPONENT AND PCB COUPLERS, MANUFACTURING METHOD AND ELECTRONIC DEVICE | |
SG11201808374TA (en) | Method for manufacturing semiconductor device | |
HK1163349A1 (en) | Semiconductor light emitting device and method for manufacturing same | |
EP3106920A4 (en) | Active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, mask blank provided with active light sensitive or radiation sensitive film, photomask, pattern forming method, method for manufacturing electronic device, and electronic device | |
MX2018015708A (es) | Metodo para la fabricacion de un dispositivo de medicion de tension, un dispositivo de medicion de tension y el uso del dispositivo. | |
EP3521926A4 (en) | ACTIVE LIGHT OR RADIATION SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | |
MY168172A (en) | Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device | |
EP3742870A4 (en) | FLEXIBLE SUBSTRATE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE | |
SG11201606713QA (en) | Curable composition for photoimprint, cured product, and method of producing film having pattern, optical component, circuit board, or electronic component using the composition | |
EP3562136A4 (en) | IMAGE CAPTURE MODULE, PRINTED CIRCUIT BOARD ASSEMBLY, MANUFACTURING PROCESS, AND ELECTRONIC DEVICE INCLUDING AN IMAGE SENSOR MODULE | |
EP3403800A4 (en) | PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR HOUSING, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD | |
TW201612461A (en) | Heat dispersion structure and manufacturing method thereof | |
EP3447090A4 (en) | THERMOCURING RESIN COMPOSITION, HARDENED FILM AND METHOD FOR THEIR PRODUCTION, AND FLEXIBLE CIRCUIT BOARD WITH HARDENED FILM AND METHOD FOR THE PRODUCTION THEREOF | |
MX2018008777A (es) | Metodo para marcacion de componentes electricos. | |
EP3697182A4 (en) | PRINTED CIRCUIT BOARD SET AND METHOD FOR MANUFACTURING THE SAME | |
KR102400442B1 (ko) | 높은 정렬 정밀도로 렌즈를 led 모듈에 부착하는 방법 | |
EP3731279A4 (en) | SUBSTRATE AND ITS MANUFACTURING PROCESS, AND ELECTRONIC APPARATUS | |
PH12018500836A1 (en) | Curable resin film and first protective film forming sheet | |
TW201613011A (en) | Method and apparatus for manufacturing semiconductor devices | |
EP3468315A4 (en) | PRINTED CIRCUIT BOARD MOLDED FROM A CAMERA MODULE, AND EQUIPMENT AND METHOD FOR MANUFACTURING THE SAME | |
EP3430469A4 (en) | FLEXIBLE PCB, ARRAYSUBSTRAT, MANUFACTURING METHOD AND DISPLAY DEVICE |