MX2016001997A - Medium voltage hybrid air/liquid cooled adjustable frequency drive. - Google Patents

Medium voltage hybrid air/liquid cooled adjustable frequency drive.

Info

Publication number
MX2016001997A
MX2016001997A MX2016001997A MX2016001997A MX2016001997A MX 2016001997 A MX2016001997 A MX 2016001997A MX 2016001997 A MX2016001997 A MX 2016001997A MX 2016001997 A MX2016001997 A MX 2016001997A MX 2016001997 A MX2016001997 A MX 2016001997A
Authority
MX
Mexico
Prior art keywords
heat management
frequency drive
adjustable frequency
medium voltage
assembly
Prior art date
Application number
MX2016001997A
Other languages
Spanish (es)
Other versions
MX355685B (en
Inventor
Broussard Harry
Arthur Farr Thomas
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of MX2016001997A publication Critical patent/MX2016001997A/en
Publication of MX355685B publication Critical patent/MX355685B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)

Abstract

An adjustable frequency drive (10) including a number of power modules (14) and a heat management system (16) is provided. Each of the number of power modules (14) includes a number of inverters (30). Each inverter (30) includes a number of power poles (32). The heat management system (16) includes a housing assembly (120, a first heat management assembly (42), and a second heat management assembly (44). The housing assembly (12) defines a power module enclosure (26A) and a liquid cooling assembly enclosure (26B). The first heat management assembly (42) is substantially disposed in the power module enclosure (26A). The second heat management assembly (44) is not substantially disposed in the power module enclosure (26A).
MX2016001997A 2013-08-15 2014-08-05 Medium voltage hybrid air/liquid cooled adjustable frequency drive. MX355685B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/967,382 US9485889B2 (en) 2013-08-15 2013-08-15 Medium voltage hybrid air/liquid cooled adjustable frequency drive
PCT/US2014/049656 WO2015023467A2 (en) 2013-08-15 2014-08-05 Medium voltage hybrid air/liquid cooled adjustable frequency drive

Publications (2)

Publication Number Publication Date
MX2016001997A true MX2016001997A (en) 2016-12-14
MX355685B MX355685B (en) 2018-04-26

Family

ID=51392391

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016001997A MX355685B (en) 2013-08-15 2014-08-05 Medium voltage hybrid air/liquid cooled adjustable frequency drive.

Country Status (5)

Country Link
US (1) US9485889B2 (en)
EP (1) EP3033932B1 (en)
CA (1) CA2916753C (en)
MX (1) MX355685B (en)
WO (1) WO2015023467A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10143116B2 (en) * 2016-05-13 2018-11-27 Toshiba International Corporation Outdoor UPS unit system and method
DE112019003690T5 (en) * 2018-08-21 2021-04-08 Eaton Intelligent Power Limited INTEGRATED DIRECTLY MOUNTED BRANCH PROTECTION FOR DRIVES WITH VARIABLE FREQUENCY
BR112021018207A2 (en) * 2019-03-18 2021-11-23 Dcbel Inc Cooling system for use in power converters
US11503746B2 (en) * 2019-06-14 2022-11-15 Dmytro KHACHATUROV Variable frequency drive and method of its air cooling

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3327317B2 (en) 1995-10-09 2002-09-24 株式会社荏原製作所 Inverter water cooling
JPH11346480A (en) 1998-06-02 1999-12-14 Hitachi Ltd Inverter device
US6038156A (en) 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
JP2005274120A (en) * 2004-02-24 2005-10-06 Showa Denko Kk Liquid cooled type cooling plate
EP1610452B1 (en) 2004-06-24 2011-12-28 SMA Solar Technology AG Inverter witn a casing with electric and/or electronic components having cooling bodies
US7210304B2 (en) * 2005-02-09 2007-05-01 General Motors Corporation Cooling arrangements for integrated electric motor-inverters
EP1853098A3 (en) * 2006-05-03 2013-07-10 Parker-Hannifin Corporation Modular high-power drive stack system and method
US8149579B2 (en) * 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
US8014110B2 (en) * 2007-01-22 2011-09-06 Johnson Controls Technology Company Variable speed drive with integral bypass contactor
JP4697475B2 (en) * 2007-05-21 2011-06-08 トヨタ自動車株式会社 Power module cooler and power module
JP4819071B2 (en) * 2008-02-06 2011-11-16 本田技研工業株式会社 Electric vehicle and cooling method for DC / DC converter for vehicle
JP5457435B2 (en) * 2008-05-16 2014-04-02 パーカー−ハニフイン・コーポレーシヨン Modular high power drive stack cooled by vaporizable dielectric fluid
EP2325992B1 (en) 2008-09-11 2019-04-24 Kabushiki Kaisha Yaskawa Denki Inverter device, inverter control system, motor control system and inverter device control method
TWI394524B (en) * 2010-02-10 2013-04-21 Delta Electronics Inc Modularized heat dissipating apparatus
US8335081B2 (en) 2010-07-16 2012-12-18 Rockwell Automation Technologies, Inc. Heat sink cooling arrangement for multiple power electronic circuits
US8325478B2 (en) 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Cooling duct attachment and sealing for a motor drive
DE102011100543A1 (en) 2011-05-05 2012-11-08 Semikron Elektronik Gmbh & Co. Kg Power electronic device used as power converter unit for wind power plant, has semiconductor module whose module-side cooling fluid inlet and coolant outlet are connected with coolant outlet and cooling liquid inlet of cooling module
EP2709431A1 (en) 2011-05-12 2014-03-19 Toyota Jidosha Kabushiki Kaisha Cooler and manufacturing method for cooler
WO2013033601A2 (en) 2011-09-02 2013-03-07 Wolverine Tube, Inc. Enhanced clad metal base plate

Also Published As

Publication number Publication date
WO2015023467A2 (en) 2015-02-19
CA2916753A1 (en) 2015-02-19
US20150049437A1 (en) 2015-02-19
EP3033932A2 (en) 2016-06-22
US9485889B2 (en) 2016-11-01
CA2916753C (en) 2021-04-27
WO2015023467A3 (en) 2015-08-13
EP3033932B1 (en) 2021-09-29
MX355685B (en) 2018-04-26

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